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ORCIDHector Villacorta
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2020 – today
- 2024
[j9]Víctor H. Champac, Hector Villacorta, Roberto Gómez-Fuentes, Fabian Vargas, Jaume Segura:
Failure Probability due to Radiation-Induced Effects in FinFET SRAM Cells under Process Variations. J. Electron. Test. 40(1): 75-86 (2024)- 2022
- [c8]Víctor H. Champac, Hector Villacorta, Roberto Gómez-Fuentes, Fabian Vargas, Jaume Segura:
Failure Probability due to Radiation-induced Effects in FinFET SRAM Cells under Process Variations. LATS 2022: 1-6 - 2021
- [j8]Víctor H. Champac, Javier Mesalles, Hector Villacorta, Fabian Vargas:
Analysis and Detection of Open-gate Defects in Redundant Structures of a FinFET SRAM Cell. J. Electron. Test. 37(3): 369-382 (2021) - 2020
- [c7]Zahira Perez, Javier Mesalles, Hector Villacorta, Fabian Vargas, Víctor H. Champac:
Analysis and detection of hard-to-detect full open defects in FinFET based SRAM cells. LATS 2020: 1-6
2010 – 2019
- 2019
- [j7]Freddy Forero
, Hector Villacorta, Michel Renovell, Víctor H. Champac:
Modeling and Detectability of Full Open Gate Defects in FinFET Technology. IEEE Trans. Very Large Scale Integr. Syst. 27(9): 2180-2190 (2019) - 2018
- [j6]Alfonso Herrera-Moreno, Jose Luis Garcia-Gervacio, Héctor Villacorta-Minaya, Héctor Vázquez-Leal:
TCAD analysis and modeling for NBTI mechanism in FinFET transistors. IEICE Electron. Express 15(14): 20180502 (2018) - [c6]Zahira Perez, Hector Villacorta, Víctor H. Champac:
An accurate novel gate-sizing metric to optimize circuit performance under local intra-die process variations. VLSI-SoC 2018: 77-82 - 2016
- [j5]Hector Villacorta, Jaume Segura, Víctor H. Champac:
Impact of Fin-Height on SRAM Soft Error Sensitivity and Cell Stability. J. Electron. Test. 32(3): 307-314 (2016) - [c5]Francisco Mesalles, Hector Villacorta, Michel Renovell, Víctor H. Champac:
Behavior and test of open-gate defects in FinFET based cells. ETS 2016: 1-6 - 2015
- [j4]Hector Villacorta, Jose Luis Garcia-Gervacio, Jaume Segura, Víctor H. Champac:
Low VDD and body bias conditions for testing bridge defects in the presence of process variations. Microelectron. J. 46(5): 398-403 (2015) - [c4]Hector Villacorta, Roberto Gómez, Sebastià A. Bota, Jaume Segura, Víctor H. Champac:
Impact of increasing the fin height on soft error rate and static noise margin in a FinFET-based SRAM cell. LATS 2015: 1-6 - 2014
- [j3]Víctor H. Champac, Hector Villacorta, Nestor Hernandez, Joan Figueras:
Skew violation verification in digital interconnect signals based on signal addition. IEICE Electron. Express 11(15): 20140201 (2014) - [c3]Hector Villacorta, Jaume Segura, Sebastià A. Bota, Víctor H. Champac:
Analysis of fin height on FinFET SRAM cell hardening. MWSCAS 2014: 671-674 - 2013
- [j2]Hector Villacorta, Charles F. Hawkins, Víctor H. Champac, Jaume Segura, Roberto Gómez:
Reliability Analysis of Small-Delay Defects Due to Via Narrowing in Signal Paths. IEEE Des. Test 30(6): 70-79 (2013) - [c2]Hector Villacorta, Jose Luis Garcia-Gervacio, Víctor H. Champac, Sebastià A. Bota, Jaime Martínez-Castillo, Jaume Segura:
Bridge defect detection in nanometer CMOS circuits using Low VDD and body bias. LATW 2013: 1-6 - 2012
- [j1]Hector Villacorta, Víctor H. Champac, Sebastià A. Bota, Jaume Segura:
Resistive bridge defect detection enhancement under parameter variations combining Low VDD and body bias in a delay based test. Microelectron. Reliab. 52(11): 2799-2804 (2012) - 2010
- [c1]Hector Villacorta, Víctor H. Champac, Chuck Hawkins, Jaume Segura:
Reliability analysis of small delay defects in vias located in signal paths. LATW 2010: 1-6
Coauthor Index
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