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ORCIDNgoc Le Ba
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2020 – today
- 2020
[j5]Van Loi Le, Taegeun Yoo
, Ju Eon Kim, Ngoc Le Ba, Kwang-Hyun Baek, Tony Tae-Hyoung Kim:
A 137-μW 1.78-mm2 30-Frames/s Real-Time Gesture Recognition SoC for Smart Devices. IEEE Trans. Very Large Scale Integr. Syst. 28(8): 1909-1919 (2020)
2010 – 2019
- 2019
- [j4]Ngoc Le Ba, Sechang Oh, Dennis Sylvester, Tony Tae-Hyoung Kim:
A 256 pixel, 21.6 μW infrared gesture recognition processor for smart devices. Microelectron. J. 86: 49-56 (2019) - 2018
- [j3]Ngoc Le Ba, Tony Tae-Hyoung Kim:
An Area Efficient 1024-Point Low Power Radix-22 FFT Processor With Feed-Forward Multiple Delay Commutators. IEEE Trans. Circuits Syst. I Regul. Pap. 65-I(10): 3291-3299 (2018) - [c2]Taegeun Yoo, Van Loi Le, Ju Eon Kim, Ngoc Le Ba, Kwang-Hyun Baek, Tony T. Kim:
A 137-μW Area-Efficient Real-Time Gesture Recognition System for Smart Wearable Devices. A-SSCC 2018: 277-280 - 2017
- [j2]Ngoc Le Ba, Tony Tae-Hyoung Kim:
Design of Temperature-Aware Low-Voltage 8T SRAM in SOI Technology for High-Temperature Operation (25 %C-300 %C). IEEE Trans. Very Large Scale Integr. Syst. 25(8): 2383-2387 (2017) - 2016
- [c1]Sechang Oh, Ngoc Le Ba, Suyoung Bang, Junwon Jeong, David T. Blaauw, Tony T. Kim, Dennis Sylvester:
A 260µW infrared gesture recognition system-on-chip for smart devices. VLSI Circuits 2016: 1-2 - 2014
- [j1]Tony Tae-Hyoung Kim, Ngoc Le Ba:
Design of a Temperature-Aware Low-Voltage SRAM With Self-Adjustable Sensing Margin Enhancement for High-Temperature Applications up to 300 °C. IEEE J. Solid State Circuits 49(11): 2534-2546 (2014)
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