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2020 – today
- 2024
[j10]Hamza Errahmouni Barkam
, Sanggeon Yun, Paul R. Genssler, Che-Kai Liu, Zhuowen Zou, Hussam Amrouch, Mohsen Imani:
In-Memory Acceleration of Hyperdimensional Genome Matching on Unreliable Emerging Technologies. IEEE Trans. Circuits Syst. I Regul. Pap. 71(4): 1794-1807 (2024)- [j9]Karthik Pandaram, Paul R. Genssler, Hussam Amrouch:
WaSSaBi: Wafer Selection With Self-Supervised Representations and Brain-Inspired Active Learning. IEEE Trans. Circuits Syst. I Regul. Pap. 71(4): 1808-1818 (2024) - [c22]Paul R. Genssler, Lilas Alrahis, Ozgur Sinanoglu, Hussam Amrouch:
HDCircuit: Brain-Inspired HyperDimensional Computing for Circuit Recognition. DATE 2024: 1-2 - [c21]Paul R. Genssler, Mahta Mayahinia, Simon Thomann, Mehdi B. Tahoori, Hussam Amrouch:
DropHD: Technology/Algorithm Co-Design for Reliable Energy-Efficient NVM-Based Hyper-Dimensional Computing Under Voltage Scaling. DATE 2024: 1-6 - [c20]Paul R. Genssler, Sandy A. Wasif, Miran Wael, Rodion Novkin, Hussam Amrouch:
Frontiers in Edge AI with RISC-V: Hyperdimensional Computing vs. Quantized Neural Networks. DATE 2024: 1-6 - [c19]Mahta Mayahinia, Simon Thomann, Paul R. Genssler, Christopher Münch, Hussam Amrouch, Mehdi B. Tahoori:
Algorithm to Technology Co-Optimization for CiM-Based Hyperdimensional Computing. DATE 2024: 1-6 - 2023
- [j8]Paul R. Genssler, Austin Vas, Hussam Amrouch:
Brain-Inspired Hyperdimensional Computing: How Thermal-Friendly for Edge Computing? IEEE Embed. Syst. Lett. 15(1): 29-32 (2023) - [j7]Simon Thomann, Paul R. Genssler, Hussam Amrouch:
HW/SW Co-Design for Reliable TCAM- Based In-Memory Brain-Inspired Hyperdimensional Computing. IEEE Trans. Computers 72(8): 2404-2417 (2023) - [j6]Albi Mema, Simon Thomann, Paul R. Genssler, Hussam Amrouch:
FDSOI-Based Analog Computing for Ultra-Efficient Hamming Distance Similarity Calculation. IEEE Trans. Circuits Syst. I Regul. Pap. 70(7): 2679-2688 (2023) - [j5]Paul R. Genssler, Hamza Errahmouni Barkam, Karthik Pandaram, Mohsen Imani, Hussam Amrouch:
Modeling and Predicting Transistor Aging Under Workload Dependency Using Machine Learning. IEEE Trans. Circuits Syst. I Regul. Pap. 70(9): 3699-3711 (2023) - [c18]Paul R. Genssler, Hussam Amrouch:
Technology/Algorithm Co-Design for Robust Brain-Inspired Hyperdimensional In-memory Computing. ACSSC 2023: 280 - [c17]Sanggeon Yun, Hamza Errahmouni Barkam, Paul R. Genssler, Hugo Latapie, Hussam Amrouch, Mohsen Imani:
Hyperdimensional Computing for Robust and Efficient Unsupervised Learning. ACSSC 2023: 281-288 - [c16]Hussam Amrouch, Paul R. Genssler, Mohsen Imani, Mariam Issa, Xun Jiao, Wegdan Mohammad, Gloria Sepanta, Ruixuan Wang:
Beyond von Neumann Era: Brain-Inspired Hyperdimensional Computing to the Rescue. ASP-DAC 2023: 553-560 - [c15]Paul R. Genssler, Simon Thomann, Hussam Amrouch:
Tutorial: The Synergy of Hyperdimensional and In-Memory Computing. CODES+ISSS 2023: 5-6 - [c14]Hamza Errahmouni Barkam, Sanggeon Yun, Paul R. Genssler, Zhuowen Zou, Che-Kai Liu, Hussam Amrouch, Mohsen Imani:
HDGIM: Hyperdimensional Genome Sequence Matching on Unreliable highly scaled FeFET. DATE 2023: 1-6 - [c13]Behnaz Ranjbar, Florian Klemme, Paul R. Genssler, Hussam Amrouch, Jinhyo Jung, Shail Dave, Hwisoo So, Kyongwoo Lee, Aviral Shrivastava, Ji-Yung Lin, Pieter Weckx, Subrat Mishra, Francky Catthoor, Dwaipayan Biswas, Akash Kumar:
Learning-Oriented Reliability Improvement of Computing Systems From Transistor to Application Level. DATE 2023: 1-10 - [c12]Victor M. van Santen, Florian Klemme, Paul R. Genssler, Hussam Amrouch:
Challenges in Machine Learning Techniques to Estimate Reliability from Transistors to Circuits. DFT 2023: 1-6 - [c11]Jonas Krautter, Paul R. Genssler, Gloria Sepanta, Hussam Amrouch, Mehdi B. Tahoori:
Stress-Resiliency of AI Implementations on FPGAs. FPL 2023: 333-338 - [c10]Shubham Kumar, Paul R. Genssler, Somaya Mansour, Yogesh Singh Chauhan, Hussam Amrouch:
Frontiers in AI Acceleration: From Approximate Computing to FeFET Monolithic 3D Integration. VLSI-SoC 2023: 1-6 - 2022
- [j4]Paul R. Genssler, Victor M. van Santen, Jörg Henkel, Hussam Amrouch:
On the Reliability of FeFET On-Chip Memory. IEEE Trans. Computers 71(4): 947-958 (2022) - [j3]Paul R. Genssler, Hussam Amrouch:
Brain-Inspired Computing for Circuit Reliability Characterization. IEEE Trans. Computers 71(12): 3336-3348 (2022) - [j2]Christian Hakert, Kuan-Hsun Chen, Horst Schirmeier, Lars Bauer, Paul R. Genssler, Georg von der Brüggen, Hussam Amrouch, Jörg Henkel, Jian-Jia Chen:
Software-Managed Read and Write Wear-Leveling for Non-Volatile Main Memory. ACM Trans. Embed. Comput. Syst. 21(1): 5:1-5:24 (2022) - [c9]Hussam Amrouch, Florian Klemme, Paul R. Genssler:
Design Close to the Edge for Advanced Technology using Machine Learning and Brain-Inspired Algorithms. ASP-DAC 2022: 493-499 - [c8]Hussam Amrouch, Mohsen Imani, Xun Jiao, Yiannis Aloimonos, Cornelia Fermüller, Dehao Yuan, Dongning Ma, Hamza Errahmouni Barkam, Paul R. Genssler, Peter Sutor Jr.:
Brain-Inspired Hyperdimensional Computing for Ultra-Efficient Edge AI. CODES+ISSS 2022: 25-34 - [c7]Hussam Amrouch, Jens Anders, Steffen Becker, Maik Betka, Gerd Bleher, Peter Domanski, Nourhan Elhamawy, Thomas Ertl, Athanasios Gatzastras, Paul R. Genssler, Sebastian Hasler, Martin Heinrich, André van Hoorn, Hanieh Jafarzadeh, Ingmar Kallfass, Florian Klemme, Steffen Koch, Ralf Küsters, Andrés Lalama, Raphaël Latty, Yiwen Liao, Natalia Lylina, Zahra Paria Najafi-Haghi, Dirk Pflüger, Ilia Polian, Jochen Rivoir, Matthias Sauer, Denis Schwachhofer, Steffen Templin, Christian Volmer, Stefan Wagner, Daniel Weiskopf, Hans-Joachim Wunderlich, Bin Yang, Martin Zimmermann:
Intelligent Methods for Test and Reliability. DATE 2022: 969-974 - [c6]Yiwen Liao, Raphaël Latty, Paul R. Genssler, Hussam Amrouch, Bin Yang:
Wafer Map Defect Classification Based on the Fusion of Pattern and Pixel Information. ITC 2022: 1-9 - [c5]Shubham Kumar, Swetaki Chatterjee, Simon Thomann, Paul R. Genssler, Yogesh Singh Chauhan, Hussam Amrouch:
Cross-layer FeFET Reliability Modeling for Robust Hyperdimensional Computing. VLSI-SoC 2022: 1-6 - [i4]Simon Thomann, Paul R. Genssler, Hussam Amrouch:
HW/SW Co-design for Reliable In-memory Brain-inspired Hyperdimensional Computing. CoRR abs/2202.04789 (2022) - [i3]Paul R. Genssler, Austin Vas, Hussam Amrouch:
Brain-Inspired Hyperdimensional Computing: How Thermal-Friendly for Edge Computing? CoRR abs/2204.03739 (2022) - [i2]Paul R. Genssler, Hamza Errahmouni Barkam, Karthik Pandaram, Mohsen Imani, Hussam Amrouch:
Modeling and Predicting Transistor Aging under Workload Dependency using Machine Learning. CoRR abs/2207.04134 (2022) - 2021
- [c4]Paul R. Genssler, Hussam Amrouch:
Brain-Inspired Computing for Wafer Map Defect Pattern Classification. ITC 2021: 123-132 - 2020
- [c3]Victor M. van Santen, Paul R. Genssler, Om Prakash, Simon Thomann, Jörg Henkel, Hussam Amrouch:
Impact of Self-Heating on Performance, Power and Reliability in FinFET Technology. ASP-DAC 2020: 68-73 - [c2]Victor M. van Santen, Simon Thomann, Chaitanya Pasupuleti, Paul R. Genssler, Narendra Gangwar, Uma Sharma, Jörg Henkel, Souvik Mahapatra, Hussam Amrouch:
BTI and HCD Degradation in a Complete 32 × 64 bit SRAM Array - including Sense Amplifiers and Write Drivers - under Processor Activity. IRPS 2020: 1-7 - [i1]Christian Hakert, Kuan-Hsun Chen, Paul R. Genssler, Georg von der Brüggen, Lars Bauer, Hussam Amrouch, Jian-Jia Chen, Jörg Henkel:
SoftWear: Software-Only In-Memory Wear-Leveling for Non-Volatile Main Memory. CoRR abs/2004.03244 (2020)
2010 – 2019
- 2017
- [c1]Paul R. Genßler, Oliver Knodel, Rainer G. Spallek:
A New Level of Trusted Cloud Computing - Virtualized Reconfigurable Resources in a Security-First Architecture. GI-Jahrestagung 2017: 531-542 - 2016
- [j1]Oliver Knodel, Paul R. Genssler, Rainer G. Spallek:
Migration of long-running Tasks between Reconfigurable Resources using Virtualization. SIGARCH Comput. Archit. News 44(4): 56-61 (2016)
Coauthor Index
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