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As its third generation of Fan-Out Panel Level Packaging (FOPLP) emerges, OIP Technology Pte. Ltd. is leading the way in creating advanced optical products for AI, automotive, and consumer electronics. This innovative process helps save energy and boost data transfer speeds.   Our in-house OIP Technology expert will be giving a presentation as part of our Semicon Meets Sustainability virtual conference, showcasing why these new optical products have a leg up over traditional semiconductor packages.   Find out more and join our virtual conference! 👉 November 5, 2024 👉 8:00 a.m. – 10:15 a.m. (CET) or 5:00 p.m. – 6:40 p.m. (CET) 👉 Presentations by Fraunhofer IZM, EV Group, IDTechEx, OIP Technology and #DELO 👉 Register now for free: https://lnkd.in/dE9wa8_i   #DELO #adhesives #FOPLP #OIP #innovation #semiconductor

Another win in the books! 🚀💪🙏   We are very honored to receive the 2024 Global Technology Award for Semiconductor Packaging Adhesives for DELO DUALBOND EG4797. The product is the result of our collaboration with @NSW Automation with the goal of pushing the boundaries of what is currently possible in miniaturization using ultra-fine structures known as Micro Dams. DUALBOND EG4797 is used as a flow stop, be it for underfills to protect surrounding components or to reduce the footprint of encapsulants such as glob tops.   Key facts about this award-winning adhesive: 👉 Halogen, PFAS- and solvent-free, meeting the latest requirements 👉 High thixotropic index, allowing tall, thin structures 👉 Energy-efficient, with final curing taking place in 10 seconds or less via UV light Special thanks to @Global SMT & Packaging for their recognition of our innovative solutions. Here’s to more achievements to come!   #DELO #adhesives #awardwinning #semiconductor #microdam

📢 New approach for fan-out wafer-level packaging (FOWLP) Our feasibility study shows: With the use of UV-curable molding materials instead of heat curing ones, warpage and die shift can be reduced significantly. Both warpage and die shift are typical side effects of fan-out wafer-level packaging, a cost-efficient method in the semiconductor industry where numerous dies are encapsulated together on a carrier. Even though fan-out techniques on wafer- and panel-level constantly get refined, these issues associated with the involved compression molding remain. 🧐Interested to find out more about the study? Check out the article below or visit our semicon experts at the SEMICON Europa in Munich (November 12-15). 👉 FOWLP study: https://lnkd.in/e5Pq34B2   👉 Meeting DELO at SEMI Europe: Hall C2 / booth C2740 – Get your free ticket now: https://lnkd.in/dYjsEtmh #DELO #semiconductor #fowlp #warpage #dieshift

As we strive for a greener future, we highly value the significant effect advanced semiconductor packaging technologies for HPC and photonics integration has on promoting sustainability and energy efficiency.   Part of DELO’s upcoming Semicon Meets Sustainability virtual conference, @Dr. Shababa Selim of think tank IDTechX will be giving a presentation on these technologies, their trends as well as industry challenges.     Find out more and join our virtual conference! 👉 November 5, 2024 👉 8:00 a.m. – 10:15 a.m. (CET) or 5:00 p.m. – 6:40 p.m. (CET) 👉 Presentations by Karl Becker from Fraunhofer IZM, Thomas Uhrmann from EV Group, Shababa S. from IDTechEx, OIP Technology Pte. Ltd. and #DELO 👉 Register now for free: https://lnkd.in/dE9wa8_i   #DELO #adhesives #innovation #HPC #PhotonicsIntegration

Want to see #innovative, #reliable, and #efficient manufacturing solutions firsthand?   Catch DELO at the Assembly Show until Thursday in Rosemont, IL!   There you will find our latest adhesive solutions for mechanical applications such as electric motors as well as our high-intensity flood lamps, spot-light sources, and dispensing equipment.   Stop by our booth and talk to our experts! 😊 #DELO #adhesive #dispensing #curing #systemprovider

Photonic Integrated Circuits (PIC) are slowly shaping up to be the future of optical communication technology. Their assembly includes multiple processes, such as optical and edge coupling, as well as v-groove bonding, in which reliable adhesives serve as the ideal fixing mechanism.   DELO’s optoelectronics experts will give a presentation as part of the Semicon Meets Sustainability virtual conference, going over the optical and mechanical properties of the newest materials developed for PIC applications, as well as several experiments conducted by DELO in partnership with third-party companies testing the efficiency of such optical bonds.   Find out more and join our virtual conference! 👉 November 5, 2024 👉 8:00 a.m. – 10:15 a.m. (CET) or 5:00 p.m. – 6:40 p.m. (CET) 👉 Presentations by Fraunhofer IZM, EV Group, OIP Technology Pte. Ltd., IDTechEx and DELO 👉 Register now for free: https://lnkd.in/dE9wa8_i #DELO #adhesives #innovation #webinar #PIC

Photonic Integrated Circuits (PIC) are slowly shaping up to be the future of optical communication technology. Their assembly includes multiple processes, such as optical and edge coupling, as well as v-groove bonding, in which reliable adhesives serve as the ideal fixing mechanism.   DELO’s optoelectronics experts will give a presentation as part of the Semicon Meets Sustainability virtual conference, going over the optical and mechanical properties of the newest materials developed for PIC applications, as well as several experiments conducted by DELO in partnership with third-party companies testing the efficiency of such optical bonds.   Find out more and join our virtual conference! 👉 November 5, 2024 👉 8:00 a.m. – 10:15 a.m. (CET) or 5:00 p.m. – 6:40 p.m. (CET) 👉 Presentations by Fraunhofer IZM, EV Group, OIP Technology Pte. Ltd., IDTechEx and DELO 👉 Register now for free: https://lnkd.in/dE9wa8_i #DELO #adhesives #innovation #webinar #PIC

As #emotor production expands further and further, we at #DELO have been seeking ways to streamline adhesive bonding processes in this sector. That is why we teamed up with our partner ViscoTec, who specializes in advanced #automated #dispensing technologies, to develop a specialized IPM process for automated magnet bonding in e-motors.   In this process, DELO dual-curing #adhesives are used while being dispensed by ViscoTec’s high-tech dispensing equipment applied the adhesives into e-motor rotor wall slots.   Look below to see this process in action! 👉 https://lnkd.in/dU7peesU

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Integrating chiplets into advanced packaging is a big challenge, especially since carrier technologies and lithographic patterning are crucial. This is even more difficult for large chips, where mismatches in the fabrication process can interfere with electrical properties. Creating a seamless pattern for larger chips is thus vital for advanced tech like graphics processing, AI, and high-performance computing.   In a webinar part of DELO’s Semicon Meets Sustainability virtual conference, Thomas Uhrmann of EV Group will be presenting various maskless patterning solutions, which both streamline chiplet integration processes and promote sustainable practices.   Find out more and join our virtual conference! 👉 November 5, 2024 👉 8:00 a.m. – 10:15 a.m. (CET) or 5:00 p.m. – 6:40 p.m. (CET) 👉 Further presentations by Karl Becker of Fraunhofer IZM, OIP Technology Pte. Ltd., Shababa S. of IDTechEx and DELO experts 👉 Register now for free: https://lnkd.in/dE9wa8_i #DELO #adhesives #sustainability #innovation #chiplets