Fraunhofer IZM

#NewsfromRealIZM Reliable access to electronic components is of strategic importance for Germany’s future as the industrial hub in Europe. However, the relocation of more and more IC production capabilities to other continents harbors greater risks of espionage and hardware being compromised. On the joint project T4T »Tech-for-Trust: Distributed Manufacturing for Novel and Trustworthy Electronics«, Fraunhofer Institutes and their German industry partners are working on an innovative split manufacturing approach. Secure assembly and encryption in Germany are intended to prevent espionage and the theft of intellectual property in semiconductor production. Find out more about the research project and how it contributes to increasing flexibility and security in chip manufacturing. Read the full blog post by Professor Juliana Panchenko, Group Leader »Micro-Nano Interconnect« at Fraunhofer IZM-ASSID in Dresden, here: https://lnkd.in/eama-FyG #Semiconductors #Microelectronics #HardwareSecurity #SplitManufacturing

#Career Reliable electronics is not automatically sustainable electronics - Hans Walter from #FraunhoferIZM makes this clear in the #µknowsbest interview. However, he and his colleagues are bringing these two aspects of electronics together under the keyword “EcoReliability” and in a newly created working group on the topic. To establish the “EcoReliability - Reliable and Sustainable Electronics” working group, they are hosting a kick-off meeting on November 20, 2024. Want to be part of it? All information and registration at: https://lnkd.in/dG4v9ERf #ecoreliability #electronics #ecorel

#Events Meet our experts Konstantina Kolovou-Kouri and Josh Wilson at #compamed2024 in Hall 8a Booth H29-2und get to know more about #neuralimplants and #neuralinterfaces. More information: https://lnkd.in/e6Kt4fvY

#Events We´re looking forward to Semicon Europa as a member at the booth of Silicon Saxony from November 12-15 in Munich. Our experts of our branch of the institute, the Fraunhofer IZM-ASSID (»All Silicon System Integration Dresden – ASSID «) Manuela Junghähnel, PhD, Frank Windrich, Kay Viehweger, Steffen Lapp, Catharina Rudolph, Philipp Scheibe and Andreas Gang will join the conference und you can meet them at our booth together with a lot of other members of Silicon Saxony and also some other members of FMD - Forschungsfabrik Mikroelektronik Deutschland. Use the chance to network with our experts at our booth C1419#34 , where they will present new research and development results in the areas 2.5/3D #heterogenous 300 mm #wafer #level #system #integration. Fraunhofer IPMS, Fraunhofer ENAS

#News Unsere Forschung wurde im aktuellen Newsletter vom Präsidenten der Fraunhofer-Gesellschaft, Holger Hanselka erwähnt. Unter dem Titel "Quantentechnologien – Grundlagenforschung schnell in die Anwendung überführen", erläutert er das Projekt QSolid zu Entwicklungsmöglichkeiten in der #Quantencomputing-Hardware. Unsere Forschenden vom Standort Fraunhofer IZM-ASSID in Dresden-Moritzburg arbeiten hier zusammen mit dem Fraunhofer IPMS und 24 deutschen Forschungseinrichtungen und Unternehmen unter Koordination des Forschungszentrums Jülich an einem deutschen Quantencomputer basierend auf supraleitenden Quantenchips mit verringerten Fehlerraten. Im Projekt QSolid, das durch das BMBF mit einer Gesamtsumme von 76,3 Millionen Euro gefördert wird, konnten wir mit einem Demonstrator bereits konkrete Anwendungen sowie Benchmarks für Industriestandards testen. Weitere Informationen zum Projekt: https://lnkd.in/d95kbU5X Steffen Bickel, Manuela Junghähnel, PhD, Juliana Panchenko, Catharina Rudolph, Andreas Gang, Kay Viehweger, Wofram Steller

#Events The #electronica, the world's leading trade fair and conference for electronics, will take place from November 12-15, 2024 at the Trade Fair Center of Messe München. The trade fair offers a broad spectrum of exhibits from the world of #electronics, ranging from #automotives to #electromechanics, #electronics #design, #printed #circuit #boards, #micro and #nano #systems and #sensor #technology, among others.   Fraunhofer IZM is attending electronica as part of a joint booth of Fraunhofer-Gesellschaft and will be presenting current developments from the areas of #radar sensors, #RF technologies and sensor #packaging, e.g.: 👉IOT kits, radar kits 👉Radar sensor technology/ gesture recognition 👉Energy efficient design 👉RF material characterization, detection of the influence of material aging on RF properties 👉Signal, power integrity 👉antenna design 👉3D packaging More information: https://lnkd.in/evSXF9MS Our experts look forward to seeing you at our booth B4/141: Paul Perlwitz, Lukas Becker, Christian Tschoban, Jan Hefer, Harald Pötter, Timo Pelchen, Julius Gissing, Tekfouy Lim, Andreas Middendorf, Michael Schiffer, Robert Gernhardt, Alexandra Rydz, Georg Weigelt together with: Fraunhofer ILT, Fraunhofer ISIT, Fraunhofer IPMS, Fraunhofer IKTS, Fraunhofer IIS, Institutsteil Entwicklung Adaptiver Systeme EAS, Fraunhofer IPA, Fraunhofer IIS FMD - Forschungsfabrik Mikroelektronik Deutschland

#Events Our expert Juliana Panchenko coordinated this #workshop for all people, who are interested in 2.5 and 3D #System #Integration. ✍ Register now and gain into microelectronic system advancements and miniaturization techniques: https://lnkd.in/ehjPxJNM Together with: Fraunhofer IPMS, Fraunhofer IIS, Institutsteil Entwicklung Adaptiver Systeme EAS and much more #Fraunhofer #experts

#Events Meet our experts at COMPAMED – Düsseldorf / Deutschland from November 11-14! Together with Fraunhofer ITMP and Fraunhofer EMFT we´re presenting the research project "e-Pille". 💊 More information: https://lnkd.in/dr9MqF4 #medical #research #digital #health #compamed2024 Christine Kallmayer, Erik Jung

#Karriere 🎃💀 The spooky season is here! A µ-stical Halloween for everyone! Let's celebrate the spookiest moments and the sweetest treats! What's your Halloween highlight? 👻🍬 If you want to know more about our µknowshow, click though our youtube-channel: https://lnkd.in/ezvGxvNE #µknowsbest #Halloween #SpookySeason

#Events Our group leader Karl Becker will present "A Holistic Approach for Chiplet Packaging" at the DELO virtual conference on Tuesday, November 5th, from 8:30 a.m. – 8:45 a.m. 👉 Register now for free: https://lnkd.in/dE9wa8_i The virtual conference "Semicon Meets Sustainability" is brought to you by DELO Industrie Klebstoffe and will be held on Tuesday, November 5, 2024, from 8:00 a.m.–10:15 a.m. CET and in a condensed format from 5:00 p.m. – 6:40 p.m. CET. If you work in #semiconductor back-end #packaging and are interested in learning more on how to employ #sustainable practices, this virtual #conference is for you. The conference will be held in English language. presented by DELO Industrie Klebstoffe with experts from EV Group, Fraunhofer IZM, IDTechEx, OIP Technology Pte. Ltd.