Heraeus Electronics

As the market for automotive and industrial applications evolves, SiC semiconductors are taking center stage, driven by the need for smaller die areas, higher current densities and lower costs. This shift demands new packaging materials and advanced sintering and interconnection technologies. We will dive into the latest material developments for packaging SiC power devices, including metal ceramic substrates, cutting-edge sintering and soldering techniques, and innovative die top interconnection.   We'll explore how these innovations optimize performance, enhance reliability, and address the challenges posed by higher power density, elevated temperatures, and faster switching frequencies. If you're passionate about pioneering breakthroughs in power module technology, this tutorial is your opportunity to gain valuable insights and strategies to drive forward-thinking innovations.   Don't miss this chance to connect with us at the ECCE Conference and Expo. Dr. Habib Mustain is looking forward to meeting you in his tutorial on October 20th. https://lnkd.in/gaTdiYwP   #ECCEConference #PowerModuleInnovations #SiCPowerDevices #SemiconductorPackaging #Engineering #ScientificInnovation #Tutorial

🧑🎓Following several years of local connection, Nanyang Technological University Singapore (NTU) and Heraeus Electronics deepened their cooperation with a high-level management meeting. 👩🎓 Representatives from both organizations discussed facilitating overseas internships for NTU students at Heraeus Electronics. Together with NTU, Heraeus Electronics is set on crafting a future where academic and professional realms merge to create outstanding opportunities for tomorrow’s leaders. Discover how we are setting up talents for success: https://lnkd.in/eSe5_D43 #ElectronicsJobs #EngineeringJobs #Internships #Innovation

🎉 We have recently concluded our tech days in the Americas, and would like to extend a big thank you to all customers who attended the event! Heraeus Electronics believes in establishing strong continued partnerships in the industry to propose the best solutions to our customers. We are pleased to have Ravi Parthasarathy from ZESTRON and Gabriela Pereira from Yole Intelligence join us as guest speakers for these tech days! Tech days are continuously held across the globe for our customers to interact and learn about the newest updates to material technologies for the semiconductor industry. Look out for an upcoming one in your region! 🤗

✨ Workshop Success Story! ✨ We just wrapped up our Fall 2024 Thick Film Workshop, in planning since May 2024, and what an incredible experience it was! 🌍 Customers traveled from around the globe to join us, not just to dive deep into thick film technology but also to build meaningful relationships that will last a lifetime. Directly from one of our workshop students:  “The workshop really provided us knowledge and gave us a picture of the commitment and passion of Heraeus Electronics to educate customers and the willingness to work hand-in-hand for a good business and working relationship.” 💬 Thank you to everyone who attended and contributed to this successful event! 🙌 Did you miss this event? Not to worry! 🎉 Our next workshop is set for Spring 2025! We’re making a few exciting adjustments, with a special focus on Low Temperature #PrintedElectronics and creating long-lasting connections with industry professionals. Stay tuned—it’s going to be an amazing opportunity! 🔥   #HeraeusElectronics #ThickFilmTechnology #Innovation #Networking

Visit our booth with a 50% off exclusive discount code!   📢Exciting news! We are thrilled to announce that we will be exhibiting at “The Future of Electronics RESHAPED” in Berlin on October 23-24, 2024. As a supplier of polymer thick film inks for Printed Electronics, we’re eager to connect with industry experts, innovators, and fellow enthusiasts.   Join us and RESHAPE the Future of Electronics! 👉🏼Register here and use code "Heraeus": https://lnkd.in/ggAxu89D See you there! 👀   #HeraeusElectronics #Innovation #TechBlick #PrintedElectronics #PolymerThickFilmInks #Berlin #WeAtHeraeusElectronics

Heraeus Electronics is proud to announce that our innovative product, magiCu® PE401 Cu Sinter Paste, has received the prestigious 2024 Mexico Technology Award in the ‘Sinter Paste’ category. This award recognizes our commitment to developing advanced materials that meet the evolving needs of the electronics industry. The magiCu® PE401 Cu Sinter Paste is a game-changer in power electronic device manufacturing, offering fast-sintering processes, reduced manufacturing costs, exceptional thermal conductivity, and ease of integration into existing manufacturing lines. 🎉 Find out more: https://lnkd.in/gqnvxpFN #PowerElectronics #Innovation #SinterPaste

We're thrilled to present an exclusive interview with one of our very own from the Heraeus Electronics team! As part of our ongoing commitment to authenticity and real stories, we sat down with Dennis Ang, Business Development APAC, to dive deeper into his journey and experiences as a vital member of the Heraeus Electronics team. In this engaging interview, Dennis Ang shares insights into what drives him personally, the dynamic and fulfilling nature of his role at Heraeus Electronics, and his recent project achievements that have left a lasting impact. He also provides valuable perspectives on team dynamics, leadership styles, and growth within our organization. It's a rare opportunity to connect with a real person who embodies our core values and principles. His story reflects the genuine passion and dedication present at Heraeus Electronics. Stay tuned as we share more interviews, shining a light on the exceptional individuals who make our team truly outstanding and dynamic! 🌏💡  https://lnkd.in/gE8PmHUr #HeraeusElectronics #BehindTheScenes #RealPeople #Interview #EmployeeSpotlight #BecomeElectrified

Join us at the ECPE European Center for Power Electronics hybrid workshop on Materials Innovations for Advanced Power Packaging. Explore the dynamic and multidisciplinary field of power electronics packaging and discover the latest trends in materials for power electronic discretes, modules, and converters, as well as new developments in interconnection technologies, potting, encapsulation, and more.   🔌 ECPE hybrid Workshop on Materials Innovations for Advanced Power Packaging – Substrate, Interconnection and Encapsulation 📅 Date: Oct 09-10, 2024 📍 Location: Hanau, Germany and via Webex 🔗 Details: https://lnkd.in/eqs9mxb9 Don't miss out on insights into material characterization, inspection methods, and EU regulations on materials. Registration is open until October 2nd. See you there!   #PowerElectronics #MaterialsScience #ECPEWorkshop #AdvancedPackaging #ModuleAttach

🏯 Thank you for visiting us at Semicon Taiwan 2024, 4 - 6 Sep! It was a remarkable event for our customers and the Heraeus Electronics team! We look forward to continuing customer conversations and exploring new partnerships in the future, all while championing sustainability in the semiconductor industry! If you haven't visited us this year, we look forward to meet you in 2025! Watch this video for event highlights! #SemiconTaiwan2024 #HeraeusElectronics #Innovation #Sustainability #Thankyou #Advancedpackaging

🎉 Get ready for an exclusive 2-day Thick Film Training event, where existing and new customers will experience an immersive journey through our cutting-edge application and innovations labs. 🌟 Expect a full site tour, engaging lectures, and first-hand training that will unveil the exciting potential of partnering with Heraeus Electronics as a leading thick film supplier. Our dedicated teams are thrilled to showcase our capabilities and create an unforgettable learning experience for you. 🏗️ This event marks a valuable opportunity for us to exchange knowledge and expertise with our valued customers and pave the way for fruitful collaborations in the future. Let's embark on this journey together and unlock new possibilities! 🤝 #ThickFilmTraining #Innovation #Electronics #Partnership #HeraeusElectronics #CustomerExperience 🚀