ARIAT TECHNOLOGY LIMITED

Rumors Suggest Apple’s iPhone 18 Series A20 Chip Will Switch to TSMC 2nm and Use WMCM Packaging According to reports, the iPhone 17 series will continue to use TSMC’s 3nm node, though it’s expected Apple will adopt the new “N3P” variant. This means the A19 and A19 Pro chips won’t transition to 2nm technology next year. However, by 2026, when Apple announces the iPhone 18 series, the new chips—likely named A20 and A20 Pro—are expected to feature new lithography technology and switch from InFO (Integrated Fan-Out) packaging to WMCM (Wafer-Level Multi-Chip Module) packaging. This transition will allow for more complex components to be developed as part of a single chip. One reason the iPhone 17 series is not opting for 2nm technology is the high cost of wafers, so the 2nm process may be reserved for certain iPhone 18 models. According to the leaker the A20 and A20 Pro chips set to release in two years are expected to use TSMC’s 2nm technology and come with WMCM packaging, as well as an upgrade to 12GB of memory. The current generation A18 and A18 Pro chips use TSMC’s InFO technology, which allows components to be integrated within the packaging. The focus is on single-chip packaging, where DRAM is typically attached to the main SoC, positioned on top of or near the CPU and GPU. This approach enhances performance while optimizing size. Reports suggest that WMCM can integrate multiple chips within the same package, allowing the development of more complex chips that incorporate the CPU, GPU, DRAM, Neural Engine, and other components in one package. Apple may choose this packaging because it allows for more flexible chip arrangement. For example, with WMCM, Apple could vertically stack chips or place them side by side. This packaging also enables scalability of chip performance based on the category of device the chip is targeting. Apple is expected to use the 2nm process to develop its M6 chip, while leveraging WMCM packaging to create more powerful versions, such as the M6 Ultra. 📖▶️: https://lnkd.in/g7RkzTED

iPhone 16 Faces Ban in Indonesia Due to Pending TKDN Certification Despite being released nearly a month ago, Apple’s iPhone 16 series has yet to enter the Indonesian market. Indonesian Minister of Industry Agus Gumiwang explained that the primary reason is the iPhone 16’s failure to obtain the required TKDN (Tingkat Komponen Dalam Negeri) certification. Although Apple previously secured the necessary certification, it has since expired, and the company has not fulfilled its investment commitments. The Indonesian government is demanding that Apple update the certification requirements and increase its investment in the country, or the iPhone 16 will remain unavailable for local sale. The TKDN certification mandates the use of locally produced components in goods and services, with a minimum "local content" of 40%. Agus Gumiwang noted that the extension of Apple’s certification is pending further investment. “Apple has not fulfilled its promised investment amount,” he stated. “The actual investment stands at 1.48 trillion IDR, short of the pledged 1.71 trillion IDR.” According to Regulation No. 29/2017 issued by the Minister of Industry, TKDN certification can be achieved through three pathways: manufacturing domestically, developing applications locally, or creating innovative products within the country. Apple is pursuing the innovation route, focusing on establishing Apple Academies in the region as part of its innovation development strategy. In April of this year, Apple CEO Tim Cook announced plans to open a fourth Apple Academy in Bali. The future of the iPhone 16 in the Indonesian market remains uncertain. If Apple fails to renew its TKDN certification, Indonesian consumers may face significant challenges acquiring the device. They would need to purchase it from neighboring countries like Malaysia or Singapore, which would increase the cost. For example, bringing a 1,299 SGD iPhone 16 from Singapore to Indonesia could incur an estimated 155 USD in import duties. 📖▶️: https://lnkd.in/gJbNt9vb

Rumored NVIDIA Next-Gen RTX 5080 to Feature 32Gbps GDDR7 Memory Reports suggest that NVIDIA’s next-generation graphics cards, including the GeForce RTX 5080 and RTX 5090, are expected to launch with cutting-edge GDDR7 memory. The RTX 5080 is rumored to feature the fastest memory seen on any graphics card to date, with GDDR7 running at 32Gbps (in comparison to the RTX 4080, which utilizes 23Gbps GDDR6X memory), thanks to the GB203 GPU core and 16GB of GDDR7 memory. The card will utilize a 256-bit memory bus, which means the memory bandwidth alone will reach an impressive 1TB/s. This is a significant leap from the RTX 4080 series, which achieved a peak bandwidth of 736GB/s using its 23Gbps GDDR6X solution. The higher speeds offered by GDDR7 will provide the new generation of GPUs with greater bandwidth, especially those with narrower memory buses. While the full specifications for the 50-series cards have yet to be confirmed, rumors suggest that the RTX 5090 will feature 32GB of GDDR7 memory (an increase from the 24GB GDDR6X memory in the RTX 4090). However, this upgrade comes at a cost, as power consumption is expected to rise from 450W to 600W. Below is a rumored comparison of the complete specifications for the NVIDIA GeForce RTX 5090 and RTX 5080 GPUs alongside their predecessors. 📖▶️: https://lnkd.in/gjv46bJu

8-bit microcontroller with 14KB of FLASH memory in a 14-SOIC package. PIC16F1825-I/SL Brand and Manufacturer Manufactured by Microchip Technology (formerly Micrel). PIC16F1825-I/SL Features 32 MHz operating speed. 14KB FLASH program memory (8K x 14). 1K x 8 RAM size. 256 x 8 EEPROM memory. Internal oscillator. 11 I/O pins. Peripherals include brown-out detect/reset, POR, PWM, and WDT. Connectivity options: I²C, LIN, SPI, UART/USART. PIC16F1825-I/SL Working Principle Functions as a programmable microcontroller, allowing users to implement specific tasks through software while interfacing with various peripherals. PIC16F1825-I/SL Size, Shape and Packaging 14-SOIC package with a width of 0.154 inches (3.90 mm). PIC16F1825-I/SL Core Technical Parameters Supply voltage range: 1.8 V to 5.5 V. Operating temperature range: -40°C to 85°C. Core size: 8-bit. Data converters: 8-channel, 10-bit A/D. PIC16F1825-I/SL Reliability and Longevity Designed for industrial applications with a wide operating temperature range, ensuring robust performance over time. PIC16F1825-I/SL Precautions for Use Ensure supply voltage is within specified range. Follow recommended operating temperature limits. PIC16F1825-I/SL Practical Application Areas Commonly used in embedded systems, consumer electronics, automotive applications, and industrial control. PIC16F1825-I/SL Substitutes and Equivalent Products Compatible with other microcontrollers in the PIC® family and similar 8-bit MCUs from various manufacturers. MORE--> 📖▶️: https://lnkd.in/gQ3NVNnT

Apple’s Next-Generation TWS Earbuds Will Feature Heart Rate Monitoring Sensors On September 28, reports surfaced that Apple is preparing to equip its next-generation TWS earbuds with health sensors capable of measuring heart rate. It’s expected that these sensors will be included in the AirPods Pro 3, which Apple plans to release next year, and the next-generation Powerbeats Pro is also likely to receive the same upgrade. Based on Apple’s product update cycle, nearly three years passed between the first two generations of AirPods Pro, so the AirPods Pro 3 will likely be unveiled in the fall of next year. AirPods are Apple’s wireless earbuds, first introduced during the company’s fall event on September 8, 2016, alongside the iPhone 7. The earbuds feature built-in infrared sensors that automatically detect when they’re in your ears for automatic playback, and users can control Siri with a double tap. Nowadays, more and more wearable devices are incorporating health sensors, such as those for heart rate monitoring. 📖▶️: https://lnkd.in/gmss6Zrf

Research Firm: Global Robot Shipments to Reach 47 Million Units in 2024, with 5-Year CAGR Above 20% According to a forecast from market research firm Sigmaintell Consulting, global robot shipments are expected to reach approximately 47 million units in 2024, with a compound annual growth rate (CAGR) exceeding 20% over the next five years. By 2029, global robot revenues are projected to approach $128 billion. Sigmaintell Consulting notes that the global robot market is segmented by application into industrial robots, consumer robots, and specialized robots. Due to the trends of an aging population and advancements in artificial intelligence (AI), overall demand for robots continues to grow. In 2023, consumer robots accounted for about 81% of global robot shipments, maintaining their dominant position in the market. Industrial robots comprised around 17% of total shipments. Among application markets, cleaning service robots stood out, making up nearly 70% of the consumer robot market shipments in 2023. In the consumer robotics space, iRobot, ECOVACS, and Roborock are the top three players in the industry. iRobot relies on a pure visual solution, which makes it more sensitive to lighting and environmental conditions, but the company faces intense competition within the industry. ECOVACS holds strong brand recognition in the Chinese market and has accumulated extensive technical expertise in areas like robot navigation, AI, and visual recognition, giving it a competitive edge. Roborock, on the other hand, has developed a strong capability in software algorithms, designing its own high-efficiency software communication framework. Its Laser Slam technology architecture has matured ahead of competitors, with products primarily targeting the mid-range market and gradually expanding into the high-end segment. 📖▶️: https://lnkd.in/gnXjSSwV

Former Apple Design Chief Teams Up with OpenAI to Develop New AI Device On September 22, it was reported by foreign media that former Apple design chief Jony Ive has officially confirmed his collaboration with OpenAI’s CEO Sam Altman to develop a new AI hardware device aimed at personal users. This project began earlier this year, when rumors surfaced that Ive and Altman were working together to design an AI hardware product for individual users, while seeking external investment. The collaboration combines OpenAI's technological prowess with the expertise of one of Apple's original pioneers, bolstering the potential and strength of the project. Reportedly, the initial team working on the device is relatively small, consisting of only 10 employees. However, it includes two key figures who worked alongside Ive on the iPhone's development—Tang Tan and Evans Hankey. As for the device's specific design and functionality, there have been market rumors that it draws inspiration from touchscreen technology and the original iPhone, though these claims have not been officially confirmed. During his time at Apple, Ive was instrumental in the design of groundbreaking products like the iPhone and iPad, which transformed the global tech landscape. Earlier this month, he also designed a modular jacket for the Italian luxury brand Moncler, featuring a highly innovative magnetic fastening system. Additionally, reports suggest that Ive will be leading the design of Ferrari’s first electric vehicle. 📖▶️: https://lnkd.in/gg22B-jE

Switzerland Launches "Alps" Supercomputer to Meet Extreme Data Processing and AI Demands Recently, Switzerland has launched the new "Alps" supercomputer to address extreme data processing and AI needs. Swiss experts have stated that it would take a commercial laptop 40,000 years to complete what "Alps" can accomplish in a single day. The Swiss Federal Institute of Technology Zurich (ETH Zurich) announced that the launch of "Alps" is a key part of Switzerland's plan to position itself as a world leader in developing and implementing transparent and trustworthy AI solutions. Andreas Krause, head of the institute’s AI Center, explained that "Alps" enables the training of complex AI models, which can be applied to important fields such as medicine and climate research. The Swiss Federal Office of Meteorology and Climatology has already begun using "Alps" to create higher-resolution weather models, better reflecting Switzerland's complex mountain and valley terrain. According to CSCS Deputy Director Michele De Lorenzi, a commercial laptop would need 40,000 years to perform the same operations that "Alps" can complete in a single day. 📖▶️: https://lnkd.in/gfZERVhC

Enhancing AI Performance: Apple's Next-Gen A18 Series Chip Based on Arm's Latest V9 Architecture Apple is set to hold its fall product launch event on September 10, where the highly anticipated iPhone 16 series, touted as the most AI-capable phone yet, will make its debut. Reports suggest that the new iPhones will be powered by the all-new A18 series chips, designed to meet the demands of upcoming AI features like Apple Intelligence. According to foreign media, Apple will unveil the A18 chip at the event, which is based on Arm’s latest V9 architecture. The A18 chip is expected to bring more robust machine learning and image processing capabilities to the iPhone 16 series, enhancing user experience and supporting more advanced AI functionalities. In addition, the A18 chip will utilize TSMC’s latest N3P process, improving both power efficiency and overall performance. Meanwhile, the iPhone 16 Pro and iPhone 16 Pro Max will debut the A18 Pro chip, which features a 6-core design with 2 performance cores and 4 efficiency cores, reaching a CPU clock speed of 4.05GHz, comparable to Qualcomm's Snapdragon 8 Gen 4. The A18 Pro will also include a 6-core GPU, delivering 40% faster graphics processing, making it Apple’s most powerful mobile GPU to date. Built on the more advanced N3P process from TSMC, the A18 Pro boasts a 10% performance boost and 16% power reduction compared to the A18 chip. Last September, Apple signed an agreement with Arm extending their partnership beyond 2040. Additionally, Arm announced in July that chips based on its V9 architecture now account for 50% of the smartphone market. 📖▶️: https://lnkd.in/gtWFYEWx

A high-performance 32-bit microcontroller based on the ARM® Cortex®-M4 core, featuring advanced peripherals and extensive memory for complex embedded applications. STM32F429IIT6 Brand and Manufacturer Manufactured by STMicroelectronics. STM32F429IIT6 Features ARM® Cortex®-M4 core operating at 180MHz. 2MB FLASH program memory. 256KB RAM for efficient data handling. Supports a wide range of peripherals including DMA, I²S, LCD, PWM, WDT, and Brown-out Detect/Reset. Multiple communication interfaces: CANbus, Ethernet, I²C, SPI, UART/USART, USB OTG, IrDA, and LINbus. Internal oscillator for stable timing performance. 24x 12-bit A/D converters and 2x 12-bit D/A converters for high-precision data acquisition. 140 I/O pins for flexible interfacing with external devices. Packaged in a 176-LQFP (24x24mm) for compact designs. STM32F429IIT6 Working Principle Operates as a microcontroller using the ARM® Cortex®-M4 architecture to execute code stored in FLASH memory, control peripherals, and manage data flow via integrated I/O and communication interfaces. STM32F429IIT6 Size, Shape, and Packaging Packaged in a 176-pin LQFP with 24x24mm dimensions. Supplied in trays for easy handling during manufacturing. STM32F429IIT6 Core Technical Parameters Supply voltage: 1.8V ~ 3.6V. Processor speed: 180MHz. Program memory size: 2MB FLASH. RAM size: 256KB. Operating temperature: -40°C ~ 85°C (TA). I/O pins: 140. Data converters: 24x 12-bit A/D, 2x 12-bit D/A. Moisture sensitivity level: 3 (168 hours). Package: 176-LQFP (24x24mm). STM32F429IIT6 Reliability and Longevity Lead-free and RoHS compliant. Designed to operate reliably within industrial temperature ranges, ensuring long-term stability in demanding environments. STM32F429IIT6 Precautions for Use Ensure proper voltage levels between 1.8V and 3.6V. Handle with care to avoid ESD damage during assembly. Follow proper moisture handling protocols due to its MSL 3 rating (168 hours). Use adequate cooling solutions if necessary in high-performance applications. STM32F429IIT6 Practical Application Areas Ideal for applications in industrial control, medical devices, automotive systems, consumer electronics, and high-performance embedded systems requiring extensive memory and peripheral support. STM32F429IIT6 Substitutes and Equivalent Products Possible alternatives include NXP MK64FN1M0VLL12 and Texas Instruments TM4C129XNCZAD for similar ARM® Cortex®-M4 based microcontrollers. MORE--> 📖▶️: https://lnkd.in/gUa6HpAG