Fill Easy attended the Fintech Week Hong Kong 2023 which took place on 2nd and 3rd of November. It was an invaluable experience where we had the privilege of meeting stakeholders across diverse industries and share about how digital identity will be shaping the future of eKYC processes and onboarding journey. We support clients in integrating government digital identities from different regions e.g iAM Smart (HK), Singpass (SG), UAE Pass (UAE) with just two API calls from our solution. We envision Hong Kong to be a super connector, allowing users with different nationalities to easily access services/products via their government digital identities in the future. CEO Matthew Zi Jin Lee also had the chance to present our digital identity integration solution to Professor Sun Dong, JP, Secretary for Innovation, Technology and Industry. Lastly, a special thanks to the HKSTP - Hong Kong Science and Technology Parks Corporation partnership team for their exceptional support in facilitating business matching and connecting us with valuable opportunities. Working closely with HKTSP significantly contributed to the success of our participation, and we look forward to continued partnerships that drive innovation in the Fintech space. #fintechweek2023 #HKSTP #FillEasy #digitalidentity #iAMSmart #Singpass #UAEPass
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