Teramount changes the world of optical connectivity by offering a novel solution for connecting optics to silicon. Silicon-photonics, which realizes speed of light data transfer at low power consumption, is the most promising technology enabler for the next generation of high-speed data transfer in data centers, cloud computing, HPC and other datacom applications. One of the main challenges of next-generation data center co-packaged switches is scalability of fiber-to-chip connectivity - the ability to reliably connect hundreds of fibers to a single switch chip at high yield and low cost. Teramount Photonic-plug’s technology demonstrated 100X improved tolerance in assembling fiber to silicon chip compared to existing technologies, enabling successful integration of optics with silicon and scalable deployment of silicon photonics. With this, Teramount is solving a major obstacle of next-generation data center co-packaged switches thus, enabling a reliable and dense-fiber connectivity at high yield and low cost.
קישור חיצוני עבור Teramount
High-Tech Village,
Edmond Safra Campus,
Jerusalem, IL
Happy to be part of this awesome team!
The past year has been an exciting one for world of silicon photonics and we, at Teramount, achieved important milestones. We look forward to accelerating execution and product processes in the coming year. Wishing all who celebrate good health, happiness and success for the coming Jewish new year.
We are pleased to announce that Teramount made the shortlist to receive the 2024 ECOC exhibition Industry Awards for best fiber component product category. https://lnkd.in/dVxhzqx6 Looking forward to seeing you next week at #ECOC2024 booth C50.
We are delighted to announce our shortlist for the #IndustryAwards2024🏆 𝗜𝗻 𝘁𝗵𝗲 𝗕𝗲𝘀𝘁 𝗙𝗶𝗯𝗿𝗲 / 𝗙𝗶𝗯𝗿𝗲 𝗖𝗼𝗺𝗽𝗼𝗻𝗲𝗻𝘁 𝗣𝗿𝗼𝗱𝘂𝗰𝘁 𝗰𝗮𝘁𝗲𝗴𝗼𝗿𝘆… Sumitomo Electric Europe Ltd. Teramount Formerica OptoElectronics Inc. Congratulations to the shortlisted companies, and good luck to all!👏🍀 Winners will be announced live at #ECOC2024, during the Product Focus sessions from 11:45 on Tuesday 24th September, so be sure to grab your visitor badge today and not miss the ceremony! Register here: https://lnkd.in/dyV2Vfi ✅Stay tuned for more updates on the shortlist!
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Thank you #internationalbussinestimes ! We are thrilled to see the optical connectivity ecosystem thriving and moving towards volume manufacturing. It's exciting to witness the maturity in enabling new AI, advanced computing and data center applications with high-speed optical connectivity. https://lnkd.in/dQxGGBK8
Ready to dive into the world of optical connectivity innovations? 🌟 Swing by Teramount's booth and meet our awesome team who are eager to tell you all about our latest innovations. Only two days left for #OFC2024 - See you at Booth 4111! Hesham Taha Abraham Israel Raanan Gewirtzman Elad Schleifer Amit Miron Peter Gordon #siliconphotonics #optics #fiberoptics #datacenter #cpos #optica
Today we announce a collaboration with GlobalFoundries (GF), a leading silicon-photonics foundry, to address the challenge of connecting fibers to Silicon Photonics (SiPh) chips, to meet the ever-growing bandwidth demands and power challenges in datacom and telecom applications. As part of this collaboration, we are integrating our Universal Photonic Coupler solution with GF’s 45CLO silicon photonics platform, GF FotonixTM, to provide a scalable fiber packaging solution to customers who want to utilize high-speed optical connectivity for applications like AI/ML and datacenter. This collaboration is a significant milestone as it will enable deeper integration of optics into semiconductors through a variety of innovative packaging technologies which provide scalability of bandwidth, power and latency performance to next generations of advanced computing applications. Read more here: https://lnkd.in/dcfmDjwC #siliconphotonics #optics #fiberoptics #datacenter #cpo #OFC2024
We are excited to introduce TeraVERSE-XD. TeraVERSE-XD is the next step in the effort to minimize beachfront real estate in PICs, with a Double-Decker configuration that supports an unparalleled fiber pitch of 64µm,doubling your PIC capacity! This design is future-proof, to allow subsequent generations to add even more fiber layers and increase PIC capacity even further, while maintaining the same form factor. With TeraVERSE-XD, your PIC bandwidth density can soar to new heights, enabling mind-boggling speeds at the smallest possible PIC shoreline. Come visit us at #OFC2024 booth #4111) to learn more about TeraVERSE-XD and other exciting CPO innovations. click here for more information: https://lnkd.in/d9vu949n