ASML

Where will we see technology go next?💡 Celebrating four decades of ASML, we witness the shift from the social-sharing 2000s to the 2010s, an era where every aspect of life has been augmented by digital innovation. Breakthroughs in AI, 5G and IoT, driven by the semiconductor industry, are transforming the way we live and work – empowering smarter cities, improving healthcare systems and creating more sustainable mobility solutions. These advancements are making a tangible, positive difference for both people and our planet.

How do you capture 40 years of innovation in a podcast? 🎙️ This International Day of Podcasting, immerse yourself in 'Four Decades of ASML' and relive the defining moments that have shaped our journey. Watch all four episodes on our playlist 👇 http://ms.spr.ly/6041mYtjz

In the 2000s, the chip industry’s ability to print ever-finer circuitry on silicon wafers almost got stopped short at the 65 nm threshold. The solution? A thin layer of water. 💡💧

It takes extreme engineering to generate extreme ultraviolet light.💥 In our High NA EUV lithography machines, molten tin gets forced through a thin nozzle to create droplets just 1/3 the width of a human hair. Then each of those droplets gets hit by two laser beam pulses – one to flatten it like a pancake, and a second to vaporize it into a plasma that’s nearly 40 times hotter than the surface of the sun. And all that happens 50,000 times per second. Why? So we can print the tiniest chip patterns at the speed of high-volume manufacturing to keep powering technology forward with you.

How often does luck tip the scales in innovation? 💡 At ASML, the journey to mastering EUV lithography wasn't just about cutting-edge research and relentless effort. Sometimes, even the smallest, most unexpected discoveries can change everything... Here's how a touch of good fortune met brilliant minds to make the seemingly impossible, possible. 🚀

【High-NA 引領未來！來自 ASML 總部的技術分享，揭示半導體製程新篇章🎊】 SEMICON 在 9/6 圓滿落幕，ASML 今年也很榮幸參與由 @SEMI Taiwan 舉辦的半導體先進製程科技論壇，特別邀請從荷蘭總部來到台灣的 High-NA EUV 產品管理負責人 Greets Storms，分享 ASML High-NA 的核心技術，一窺它如何引領半導體微影技術的創造下一波浪潮！🕶️ Greets 深入分享 High-NA 如何透過更高的解析度、更精細的製程，推動未來半導體製程的發展。不過，沒有參與到這場演講的朋友也不用擔心，小編為大家整理了精彩講座的三大重點，快速掌握領先技術👇🏻 🔍更強大的晶片密度與成像對比度：High-NA EUV 可列印出比現有 EUV 微縮 1.7 倍的尺寸， 讓我們能夠因此提升 2.9 倍的晶片密度，這大幅改善了關鍵尺寸均勻度（CDU），為類似的晶片尺寸提供更高的成像對比度、減少每次曝光所需的進光量，並縮短每層列印時間。 🎯更準確的鏡片反射：與早期系統不同，High-NA EUV 採用了變形鏡片，也就是 X 軸和 Y 軸縮小倍率不同的一種鏡頭，讓我們可以將入射角從 18 度降到 9 度，在光罩上達到幾乎最佳的反射效果。 ⚡更精簡的能源消耗與複雜程度：ASML 不僅專注於提升解析度，也致力於降低整體耗能。而 High-NA EUV 則能幫助 ASML 達成這個目標，也就是說，在花費跟過去相同能源的情況下，High-NA 可以創造更高的生產率！ ASML 首批 High-NA EUV 將在今年為客戶研發的階段帶來幫助，並預計 2025 年進入量產階段時，由 EXE:5000、EXE:5200 幫助提升生產力，帶來更大的價值🌟 聽完是否覺得 High-NA EUV 正在改寫半導體製造的規則，未來已來，你準備好了嗎？🌟

Every new ASML lithography system released in the past 20 years has borne the TWINSCAN moniker. But it's more than just a name – it's our revolutionary approach to delivering the productivity that chipmakers need to push Moore's Law forward. Learn more about how a seemingly simple solution to the problem of productivity has shaped decades of innovation. 🏭👇

Did you know our YieldStar optical metrology systems are critical for ensuring the precise alignment of chip layers? 🤯 Invented in the early 2000s, they use advanced optics and sensor technology to help chipmakers optimize production in real time.

This machine is larger than a double-decker bus, but it can print the tiniest chip patterns. 🤏 Meet our High NA EUV lithography system, weighing in at about 150,000 kg. And that’s just the system itself – making it work requires more than 50 auxiliary cabinets that are coupled to the system by about 140 mechanical connections and 1000 electrical connections. Talk about big tech!

Think you know ASML's technology inside and out? Let's find out! 🤓