Meet our Brand Ambassador Huub Claassen at the Power Electronics World Magazine & PE International Conference in Brussels, April 16 & 17
Speaker Spotlight 🌟 Huub Claassen - Boschman Advanced Packaging Technology Theme: Technology Developments in WBG: SiC, GaN and Beyond 🎤 Novel interconnect and packaging technologies for power module manufacturing For high-power applications, the industry is moving to next generation semiconductor materials, so called Wide-bandgap materials (WBG) to replace Silicon (Si) such as Silicon Carbide (SiC) and Gallium Nitride (GaN). While these materials offer breakthrough properties, they are not a drop-in replacement and essentially require all new designs, materials, and processes to deal with higher temperatures and offer better thermal resistance, performance and reliability. Specifically, for back-end semiconductor packaging: 1. Silver Sintering (to replace and overcome thermal limitations of tin solders) 2. Epoxy Molding (to replace and overcome thermal limitations of silicone gel) 3. Trimming and Forming of Power leads and signal pins Boschman has pioneered these processes with early adopters in the industry and has positioned itself as the market leader for both Pressure Sintering and Advanced Transfer Molding. 🎉 Get Ready to Be Inspired! 🌟 As we draw closer to the grand event of 2024, Are you ready to embark on this thrilling journey with us? Register to secure your place at PE International to hear Taha's presentation! https://lnkd.in/eDwCF36P Stay connected with us as we bring you more stories and insights from inspiring individuals attending PE International. 60% of exhibition and speaking slots have already been filled. Get in touch with us today if you want to find out how to get involved and penetrate the power electronics industry! To find out more please contact James Cheriton: 📧 info@pe-international.net 📞 024 7671 8970 🌐 www.peinternational.net #PEInternational #PEWmagazine #PowerElectronics #EmpoweringVoices #Boschman