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Hermetic Packaging Via Seam Sealing Hermetic sealing is crucial in semiconductor manufacturing to protect sensitive components from environmental factors such as moisture, dust, and gases. One effective method for achieving hermetic sealing is seam sealing using Kovar packages and lids. Read more at link below. https://lnkd.in/gcfSR2HT

Introduction to Ball Bonding in Semiconductor Packaging Ball bonding is a widely used technique in semiconductor manufacturing for creating electrical connections between a silicon die and a lead frame or substrate. This process involves using a fine wire, typically made of gold or copper, to form a small ball at the end of the wire. The ball is then bonded to a bond pad on the chip or package substrate using a combination of heat, pressure, and ultrasonic energy. Read more at link below. https://lnkd.in/g7XtrzcF

Introduction to Wedge Bonding in Semiconductor Packaging Wedge bonding is a wire bonding technique widely used in semiconductor manufacturing to create electrical connections between a silicon die and a lead frame or substrate. This method employs a wedge-shaped tool to form bonds at both ends of the wire, typically made of aluminum or gold. Read more at link below. https://lnkd.in/gUehfdjX

Introduction to Wedge Bonding in Semiconductor Packaging Wedge bonding is a wire bonding technique widely used in semiconductor manufacturing to create electrical connections between a silicon die and a lead frame or substrate. This method employs a wedge-shaped tool to form bonds at both ends of the wire, typically made of aluminum or gold1. Read more at link below. https://lnkd.in/gUehfdjX

UV curable, heat-resistant dicing tape is a specialized adhesive tape used in semiconductor manufacturing to secure wafers during the dicing process. This type of tape is designed to withstand high temperatures, typically up to 150°C, without losing its adhesive properties or leaving significant residue after UV irradiation. Read more at link below. https://lnkd.in/gqpseBD5

Blue Tape used for Wafer Dicing Blue tape is a commonly used adhesive tape in semiconductor manufacturing, specifically for wafer dicing. This tape is typically made from a flexible PVC base layer coated with an acrylic adhesive. It is known for its moderate adhesion properties, which are strong enough to hold the wafer securely during the dicing process but still allow for easy removal of the diced die. Read more at link below. https://lnkd.in/gbVqsZWv

Quick Guide to BGA Substrate Design Ball Grid Array (BGA) substrate design is a critical aspect of semiconductor packaging, influencing the performance, reliability, and manufacturability of electronic devices. The substrate in a BGA package serves as a small printed circuit board (PCB) that connects the silicon die to the package balls, facilitating electrical connections and mechanical support. Read more at link below: https://lnkd.in/gN7NHVBY

Balling Process for BGA Substrates The balling process for Ball Grid Array (BGA) substrates is a critical step in semiconductor packaging, ensuring reliable electrical connections between the integrated circuit (IC) and the printed circuit board (PCB). This process involves attaching tiny solder balls to the underside of the BGA package, which will later be used to form connections during the reflow soldering process. Read more at link below. https://lnkd.in/gbQE6vPA

Solder Re-Flow for SMD Mounting The solder reflow process is a critical technique in electronics manufacturing, primarily used to attach surface-mount components to printed circuit boards (PCBs). This process begins with the application of solder paste, a mixture of powdered solder and flux, to the PCB using a stencil. Components are then placed onto the solder paste, which holds them in position temporarily. Read more at link below: https://lnkd.in/gwYnCUa5

What Is Continuity Testing? Continuity testing is a fundamental procedure in semiconductor manufacturing, ensuring the integrity of electrical connections within integrated circuits (ICs) and between ICs and other components on a printed circuit board (PCB). This test verifies that there are no open circuits or unintended short circuits, which could compromise the functionality of the semiconductor device. Read more at link below https://lnkd.in/g7K8vGDR