UTAC

A heartfelt thank you to onsemi for honoring UTAC with the 2024 Excellent Partnership Award (Subcontractor)! We are truly grateful for this recognition and proud of our strong, collaborative partnership. 🤝 Your trust and continuous support have been instrumental in driving our shared success, from achieving benchmark yields to pioneering new manufacturing initiatives. Together, we look forward to pushing the boundaries of innovation and excellence in the semiconductor industry. 🌟 Thank you, onsemi, for this incredible partnership, and here's to many more years of success ahead! 🚀 #Gratitude #Partnership #Excellence #Semiconductors #Innovation #Success

🚀 Powering the Future with Advanced Packaging Solutions at UTAC Group! 🚀 At UTAC, we are shaping the future of technology with our cutting-edge laminates and advanced Ball Grid Array (BGA) packaging solutions, including FCCSP and flip-chip BGA (FCBGA), that support the next generation of multi-function, high-density chips. 🌟 Our versatile portfolio covers Stacked Die, Multi Die Side by Side, or Package Stacking options—enhanced by Thermal Enhancement, Shielded BGAs, and Land Grid Arrays (LGA). 💡 Explore how UTAC is driving innovation and delivering reliability in advanced packaging: https://lnkd.in/ePXZ9t6h #AdvancedPackaging #Semiconductors #BGA #FCBGA #Laminates #LGA #UTACGroup #Electronics #ChipPackaging #SemiconductorSolutions #AdvancedManufacturing #IntegratedCircuits #TechManufacturing #ReliabilityTesting #ElectronicComponents #ICPackaging

During this year's 40th International Electronics Manufacturing Technology (IEMT) Conference in Penang, Malaysia, our team showcased UTAC’s cutting-edge semiconductor packaging and testing services from our different facilities, and the samples on display were a huge hit. 🎯 A special shoutout to Alastair Attard 👏, who delivered an insightful presentation on the challenges and innovations in laminate-based iBGA packages for high-performance solutions. UTAC is proud to be at the forefront of automotive electronics. THANK YOU🙌 to everyone who stopped by to learn more about our cutting-edge offerings in MEMS & Sensors, Wafer Level Packages, and Power Products. As a long-established OSAT, we are energized by the industry’s commitment to innovation and we can’t wait to see what’s next. 🚀 #IEMT2024 #ElectronicsManufacturing #IEMTConference #MEMS #WaferLevelPackaging #OSAT #SemiconductorPackaging #iBGAPackages #TestingServices #AutomotiveElectronics #Innovation #TechnologyShowcase #TechInnovation #SemiconductorIndustry #SemiconductorSolutions IEEE

 🔧 UTAC's End-to-End Turnkey Solutions: The Power Behind Semiconductor Innovation 🔧 In today’s rapidly evolving semiconductor industry, agility, precision, and comprehensive solutions are key. UTAC offers Full Turnkey Services, covering the entire semiconductor supply chain—from design to drop shipping—with seamless packaging and testing solutions. Partner with us for world-class OSAT services that optimize speed, quality, and efficiency, empowering OEMs and semiconductor companies to stay ahead. From concept to completion, UTAC ensures excellence at every stage. #Semiconductor #OSAT #TurnkeySolutions #OEMSolutions #SemiconductorIndustry #UTACGroup #Innovation #TechnologyLeadership #SemiconductorPackaging #TestServices #AdvancedTechnology

🎉 A heartfelt congratulations to Dr. W. John Nelson, President & CEO / COO of UTAC Group, for winning an auction bid during SSIA's flagship event of the year! John placed a personal bid for a beautiful painting titled “Let Our Light Shine!”🎨🌟 The painting, with its vibrant Van Gogh-inspired style, swirling clouds, and sunny countryside, holds special meaning for John, reminding him of the bright, serene landscapes of Ireland where he grew up." As a veteran in the semiconductor industry, I believe we should all give back when the opportunity arises. The painting’s emotional value stood out to me, not only because of its vibrant colors and textures but also because it was created by an artist with sight limitations. It was a privilege to participate in such a meaningful cause,” shared John. A wonderful testament to how art and community can come together for a good cause. 🌍💫 #AuctionWinner #UTACGroup #SemiconductorDinner2024 #VanGoghStyle #ArtForACause #GivingBack #CommunityEngagement #EmotionalValue #ArtisticExpression #IrishHeritage #SSIAStrengthInUnity #SSIA Singapore Semiconductor Industry Association (SSIA)

We’re thrilled to be at IEMT! If you missed us on Day 1, don’t worry — there’s still time to visit us today at Booth 5. Discover our specialized products and service solutions designed just for you. Our team is eager to share insights, answer your questions, and give out some exclusive goodies. And be sure to catch Alastair Attard’s talk on 'Driving the Future: Innovations in Automotive Image Sensor Packaging and Testing'! #IEMT2024 #ElectronicsManufacturing #UTACGroup #AutomotiveSensors #SemiconductorIndustry #SemiconductorSolutions #AdvancedManufacturing #IEMTConference #Technology #Networking #MeetTheTeam #ExclusiveGiveaways #StayConnected

UTAC Group takes home the Workforce Transformation Award at the SSIA Summit & Dinner. Under the leadership of W. John Nelson, Ph.D, President & CEO / COO of UTAC Group, transformation starts from the top. UTAC’s core values of Unity, Trust, Accountability and Communication are integral to everything we do. By leveraging data analytics to refine internal culture initiatives, we ensure continuous improvement towards fostering an engaging, innovative and inclusive workplace. Our unwavering commitment to a dynamic and harmonious workforce is evident in the strides we’ve made to empower team members, unlocking their full potential to drive organizational success and societal progress. #UTACGroup #WorkforceTransformation #Leadership #CoreValues #InnovativeWorkplace #SSIASummit2024 #TeamEmpowerment

IT'S ALMOST HERE! We're counting down the days to the 40th International Electronics Manufacturing Technology (IEMT) Conference 2024! You won't want to miss this lively session on "Driving the Future: Innovations in Automotive Image Sensor Packaging and Testing" by Alastair Attard, UTAC's Director of Sensing Applications. See you at Booth #5 soon! #IEMT2024 #ElectronicsManufacturing #AutomotiveInnovation #UTACGroup #ImageSensorPackaging #TestingInnovation IEEE 

Achieve superior die edge quality and exceptional yields (>99.9% AOI) without the risk of mechanical damage using UTAC Group's advanced plasma dicing solutions. Our cutting-edge semiconductor manufacturing processes are designed to maximize die strength and increase yields for both bumped (solder or Cu pillar) and non-bumped wafers. With multi-project wafer (MPW) capabilities, our facilities enable full wafer utilization, accommodating diverse die sizes in a single run. Connect with us today to discover world-class semiconductor assembly, bumping, probing, and testing services. #SemiconductorInnovation #PlasmaDicing #MPWProcessing #UTACGroup #ChipProduction #AdvancedManufacturing

It's a hive of activity at the SSIA Summit 2024 today where Jonathan Abela, Senior Vice President of Sales & Marketing has spent the day meeting global industry leaders. This year's theme is "Synergizing Silicon: Pioneering the Future with AI and Quantum Technologies," and UTAC Group is a proud sponsor of this prestigious gathering at the nexus of the semiconductor manufacturing and microelectronics devices sector. See you at tonight's Semiconductor Dinner, wrapping up the summit on a high note. Singapore Semiconductor Industry Association (SSIA) #SSIAStrengthInUnity #UTACGroup #SSIA #AI #QuantumTechnologies #IndustryEvents #AI #SemiconductorManufacturing #FutureOfTech