QuInAs-ULTRARAM™ Memory ~ Future Compute/AI

🏆【NSTC Announces the Winners of IC Taiwan Grand Challenge, 6 Startups are Expected to Drive the Development of Industrial Innovation】 The first batch of winners from the IC Taiwan Grand Challenge, hosted by the National Science and Technology Council (NSTC), has been revealed. The selected startups include Quinas Technology (UK) with III-V compound semiconductor technology. Newsight Imaging (Israel) with cutting-edge image sensor chips, GalaVerse (USA) with high-efficiency remote processing sensing chips, Ranictek (Taiwan) with advanced high-performance transmission chips, Polaris Electro-Optics (USA) with groundbreaking silicon photonics solutions, and Voltraware Semiconductor (Taiwan) with mid-range wireless charging technology. These innovations, showcased at the Taiwan Innotech Expo (TIE), are geared to accelerate breakthroughs in communication, autonomous driving, industrial automation, and robotics across Taiwan's industrial landscape.   📢Second Batch of IC Taiwan Grand Challenge Now Open The second batch of the IC Taiwan Grand Challenge kicked off on September 4 and is open for submissions until January 31, 2025. Startups, both domestic and international, are encouraged to apply. Winning teams will not only receive a landing grant of USD 30,000 from the NSTC but will also have opportunities to collaborate with Taiwanese manufacturers and businesses to explore new markets. In addition, they will gain access to mentoring from senior semiconductor industry experts, professional venture capital guidance, and potential equity-based funding. The NSTC remains committed to leveraging Taiwan's semiconductor industry ecosystem, using this competition to foster the global development of innovative IC applications, driving industrial transformation, and promoting integration into international markets. Full press release 👉 https://gov.tw/Ums

Showing our support for Taiwan To celebrate National Day earlier this month, we're highlighting the achievements and collaboration within the Taiwan-UK Partnership. We invite you to explore different areas of the Taiwan-UK relationship, including culture, education, technology, and economic cooperation.! QuInAs-ULTRARAM™ Memory ~ Future Compute/AI is excited to be a part of this exciting Taiwan-UK journey together with key stakeholders to further develop and commercialise #ultraram https://lnkd.in/erS3s6sT UK in Taiwan 英國在台辦事處 Innovate UK

“Experience the Future of Memory with UltraRAM: Breakthrough Speed, Power Efficiency, and Storage in One Revolutionary Chip!” Come and learn more and meet QuInAs-ULTRARAM™ Memory ~ Future Compute/AI today and tomorrow at SEDEX in Seoul ROK: The Semiconductor Exhibition will be held at COEX from October 23 to 25, 2024. It is among one of the most outstanding exhibitions that covers the full spectrum of the semiconductor industry supply chain. No other event in the world showcases a full range of semiconductor products including SoC, IP, Memory, sensor, equipment/components and materials, and semiconductor technologies for Digital TV, mobile and IoT. Find us at the British Embassy pavilion and collect a free gift from the U.K.! https://lnkd.in/gc_vaTYV Tony Clemson Peter Hodgson Xiuxin Xia Serdar B. Tekin Vesper MK Kim Narai Kim Hyun Jin Park Mikyung(Mikie) Park #ultraram #sedex2024

I had the amazing opportunity to attend and present my research at NVMTS 2024 in Busan, South Korea, from October 21-23! I presented my poster titled “Impact of Memory Parameters on Sensitivity Margin of Analog-to-Digital Converter Limiting Neural Network Density.” The research explores how memory parameters like device count, conductance ratio, and variability impact ADC sensitivity margins, and ultimately, neural network density. The insights gained from PCMO RRAM and strategies to improve sense margin were exciting, with potential applications in neuromorphic and in-memory computing. This work would not have been possible without my co-authors Jayatika Sakhuja , Harshvardhan Singh , and the invaluable guidance from Prof. Udayan Ganguly and my supervisor Prof. Sandip Lashkare . Their continuous input, encouragement, and mentorship were key to the successful completion of this project. I had the privilege of engaging in insightful discussions about my work with James Ashforth-Pook (CEO of Qinas Technology), Ilya Karpov (Intel, USA), Scott Sills(micron, USA), Su-Jin Sung (KAIST, Korea), Willy ( Samsung , korea) Susanne Hoffmann-Eifert (Forschungszentrum Jülich, Germany) Their feedback and perspectives were incredibly valuable, and I’m grateful for the chance to learn from such experienced professionals in the field ,I m excited for future collaborations with them.. Additionally, I made some wonderful new friends, including Kyong Jae Kim (Sejong University, Republic of Korea), Mohammad Tauquir Alam Shamim Shaikh (Sejong University, Republic of Korea), and Faisal Munir (Forschungszentrum Jülich, Germany), with whom I had enriching conversations during the event and had a fantastic time exploring the beautiful city of Busan, which made the experience all the more memorable. Looking forward to continued innovation in this exciting field. #NVMTS2024 #NonVolatileMemory #NeuromorphicComputing #RRAM #MRAM #PCM #TechInnovation #InMemoryComputing #Busan #Networking #TechCommunity #Collaboration

🙌 한국 반도체 기업의 기술 혁신을 지원하기 위해 인트라링크 코리아 (Intralink Korea)는 주한영국대사관과 함께 SEDEX 2024 영국 국가관에 참가합니다! 이번 영국 국가관에는 Edwards Vacuum, Oxford Instruments plc, QuInAs-ULTRARAM™ Memory ~ Future Compute/AI, Paragraf® 등 유망한 영국 반도체 관련 제조사 및 연구기관 4곳이 참여하며, 해외 사업 개발 컨설팅 업체로는 인트라링크 코리아가 함께합니다. 인트라링크 코리아 (Intralink Korea)의 해외 시장 진출 및 기업 성장 지원 서비스에 관심 있는 한국 기업은 10월 23일부터 25일까지 코엑스에서 열리는 반도체 대전 SEDEX 2024의 C514 부스를 방문해 주세요!🙋

https://lnkd.in/etiSWnMh #ultraram

QuInAs Wins Prestigious IC Taiwan Grand Challenge for Smart Data & AI Innovation. QuInAs has been recognized as a winner in the Smart Data & AI category for its pioneering ULTRARAM memory technology, which promises to reshape the future of semiconductor innovation. The IC Taiwan Grand Challenge (ICTGC), organized by the National Science and Technology Council (NSTC), aims to enhance Taiwan’s position as a global semiconductor leader. The competition spotlights teams developing innovative IC designs and advanced technologies, with a focus on fields such as Smart Data & AI, Smart Mobility, Smart Manufacturing, Smart MedTech, and Sustainability. A key component supporting this effort is the Taiwan Chip-based Industrial Innovation Program (Taiwan CbI), a government-backed initiative that leverages Taiwan’s semiconductor expertise. By merging chip technology with emerging innovations like generative AI, the program aims to attract global startups, investors, and talent. It also supports industry-wide innovation and promotes heterogeneous integration for sustainable growth. To foster innovation, Taiwan CbI provides local incentives, such as chip tape-out, masks, and IP services, and collaborates with leading semiconductor companies for investment opportunities. Public-private venture capital funds are also established to draw international talent and investment, positioning Taiwan as a hub for cutting-edge chip technology. Through the IC Taiwan Grand Challenge, top global startups and academic groups are invited to establish operations in Taiwan, gaining access to funding and the nation’s comprehensive semiconductor ecosystem. The government aims to integrate IC design, manufacturing, packaging, and testing, while attracting global talent to drive business growth and industry development. https://lnkd.in/esJh72mW #ultraram

🎉 The #2024 Future Tech Pavilion Officially wrapped up with an exciting finale!🎉 On the last day, the winners of the 1st batch of the #ICTaiwanGrandChallenge were honored by Wu Cheng-wen, Minister without Portfolio and Minister of Science and Technology. Huge congratulations to the following innovators: 🌟 QuInAs-ULTRARAM™ Memory ~ Future Compute/AI 🌟 Newsight Imaging 🌟 #GalaVerseUSA 🌟 #Ranictek 🌟 Polaris Electro-Optics, Inc. 🌟 Voltraware Semiconductor Co. Ltd. This year's FUTEX (Future Tech) Pavilion brought together groundbreaking innovations across six fields: AIoT smart applications, electronics & optoelectronics, advanced materials & chemicals, biotech & medical devices, net-zero technologies, and humanistic technologies. 🌟 The International Trends Forum highlighted #QuantumTechnology and #SportsTechnology, fueling global discussions on the future of tech. 🌟 Technical presentations on #SemiconductorICDesign, #AIEmpowerment, #SustainableNetZero, #BiotechNewDrugs, and #GENAI fostered invaluable industry-academia collaborations. The IC Taiwan Grand Challenge featured top-notch innovations from international startups, including silicon photonics, low-power chips, wireless charging, AI-powered sensing chips, and more—driving the next wave of heterogeneous integration. See you next year at the Future Tech Pavilion! 🚀✨

It's a wrap for the Taiwan Innotech expo. On the last day, the winners of the 1st batch of the #ICTaiwanGrandChallenge received honors from Minister Cheng-Wen Wu of Taiwan's National Science and Technology Council. The winners are QuInAs-ULTRARAM™ Memory ~ Future Compute/AI, Newsight Imaging, #GalaVerseUSA, #Ranictek, Polaris Electro-Optics, Inc., and Voltraware Semiconductor Co. Ltd. Delighted to see many friends at the expo as well.

🎉恭喜來自英國的新創團隊 QuInAs 在台灣贏得大獎！ 來自英國的 QuInAs-ULTRARAM™ Memory ~ Future Compute/AI 以「ULTRARAM – 用於未來運算和新型人工智慧的革命性量子驅動通用記憶體」在 IC Taiwan Grand Challenge 的 #量子計算 Smart Data & AI 類別勝出。 國家科學及技術委員會 今年首度舉辦 IC Taiwan Grand Challenge 挖掘 #IC設計創新 與 #晶片創新應用 潛力新星，吸引了全球 72 組新創角逐。起源自英國蘭卡斯特大學（ Lancaster University），英國新創 QuInAs 開發出專利記憶體技術，積極拓展國際合作，且已經多次來台灣交流，恭喜他們獲獎和開啟更多台英合作機會！ QuInAs 和 #智慧移動、#智慧製造、#節能創新 等領域的獲獎團隊將在本週六一起舉行發表會，分享新創科技的實際運用與最新趨勢，現在就報名搶位，感受令人驚豔的最新科技！ 📆時間：10 月 19 日（六）13:00-14:30 📍地點：世貿一館 📝報名：https://bit.ly/3TNfIjI 🔍認識 QuInAs：https://quinas.tech/ Quinas Technology公司的ULTRARAM™，是由英國蘭卡斯特大學（Lancaster University）開發的先進記憶體技術，旨在成為通用型記憶體（universal memory）解決方案。該技術利用共振穿隧效應（resonant tunnelling，一種量子力學過程），透過快速且節能的寫入和抹除運作，實現非揮發性，因此具備高耐用性。    記憶體市場規模每年高達約1,650億美元，目前由動態隨機存取記憶體（DRAM）和NAND快閃記憶體（NAND flash）占主導地位，但兩者均有其限制。NAND flash是非揮發性記憶體，斷電時仍能保留資料，但速度較慢，且耐用性有限。反觀DRAM速度快且耐用性佳，但資料容易消失，必須不斷重新整理（refresh），才能維持資料。ULTRARAM™結合前述兩者的優點，速度像DRAM一樣快，但和快閃記憶體同樣具備非揮發性、高耐用性和超低功耗的特性。    ULTRARAM™使用三五族化合物半導體（III-V compound semiconductors），能充分利用記憶體的獨特電氣特性，同時還可利用既有半導體製程進行大量生產。具體來說，它採用以砷化銦（InAs）／銻化鋁（AlSb）化合物半導體製成的獨特三重勢壘共振穿隧(TBRT)結構，以原子級薄層取代快閃記憶體的傳統電阻氧化物勢壘（resistive oxide barrier），可在斷電時的高阻狀態和施加小電壓時的高導通狀態之間切換，進而實現高效的程式設計／抹除運作。此創新讓ULTRARAM™擁有高性能、非揮發性和耐用性的獨一無二特性組合。    ULTRARAM™正尋求在充滿挑戰的環境、加密貨幣、物聯網（IoT）、記憶體運算等關鍵領域，發揮其技術優勢。  James Ashforth-Pook, Innovate UK, Andie Wang, Jessica Reilly, Piers Gopsill, Judy Lin 林昭儀