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MediaTek has just announced two new premium 5G chipsets known as the Dimensity 8000 and Dimensity 8100. The chipmaker claims the duo will bring “flagship level technology” to premium 5G phones. While both chipsets offer identical hardware, the Dimensity 8100 will offer a slightly higher CPU clock speed.
The Dimensity 8000 combines four Arm Cortex-A78 cores running at 2.75GHz, whereas the Dimensity 8100 can run at 2.85GHz. Both SoCs additionally offer four Arm Cortex-A55 cores running at 2.0GHz. These octa-core chipsets leverage TSMC’s 5nm manufacturing process.
“You could say the MediaTek Dimensity 8000 series is the little brother to our flagship Dimensity 9000 chip. Meaning it brings flagship grade features and next level energy efficiency to the premium smartphone market,” Deputy General Manager of MediaTek’s Wireless Communications Business Unit, CH Chen, said in a press release.
The Dimensity 8100 and 8000 run on the Arm Mali-G610 MC6 GPU coupled with the company’s HyperEngine 5.0 gaming tech. MediaTek claims this can enable superior frame rates of up to 170fps with the Dimensity 8100 and 140fps with the Dimensity 8000. Meanwhile, both chips support quad-channel LPDDR5 memory and UFS 3.1 storage.
The two new chipsets support cameras of up to 200-megapixel
MediaTek further said that the duo of Dimensity 8000 chipsets feature the company’s Open Resource Architecture, allowing phone makers to customize 5G experiences for their customers. Speaking of 5G, the company is also touting 5G UltraSave 2.0, a “power-saving enhancement suite” to improve battery performance.
Excitingly, the new chipsets support camera sensors of up to 200-megapixel, plus 4K recording at 60fps and HDR10+ video. The Dimensity 8000 series will also offer simultaneous dual-camera HDR video recording. Theoretically, this could enable the use of the front and back cameras, or the rear wide-angle and telephoto cameras, simultaneously.
Latest connectivity standards such as Wi-Fi 6E and Bluetooth 5.3 are also supported. This should ensure the chip stays in sync with the industry for at least a couple of years. Lastly, MediaTek also took the wraps off the budget-ranged Dimensity 1300 (6nm) chipset. This new SoC also brings HyperEngine 5.0 and is compatible with 200-megapixel camera sensors.
The Dimensity 8100 and 8000 will be available during “the first quarter of 2022,” although no companies were mentioned in the press release. But a subsequent XDA report claims that manufacturers like Xiaomi (Redmi) and Realme will launch phones with the Dimensity 8100 chip. So we probably won’t have to wait too long to check out the new SoCs in action.