DSP

ER-DSPC-10
1. Deep submicron physical design;
2. Unified integrated development environment;
3. Fully autonomous C compiler.

ER-DSPC-20A
1. Dual-core architecture, rich interface;
2. Directly connected to AD/DA to form a minimum system;
3. Autonomous embedded operating system.

ER-DSPC-20B
1. Based on the independent architecture EC104E core;
2. SIMD+VLIW architecture;
3. Meet military temperature requirements;

ER-DSPB-3U1
1. Work Temperature: -40°C~70°C;
2. Storage Temperature: -55°C~125°C;
3. Power Consumption: ≤35W.

ER-DSPB-3U2
1. Storage Temperature: -55°C~+125°C;
2. Power Consumption: ≤45W;
3. Heat-dissipating Method: Cooling Conduction.

ER-DSPB-6U1
1. Work Temperature: -40°C~70°C;
2. Storage Temperature: -55°C~125°C;
3. Power Consumption: ≤60w.

ER-DSPB-6U2
1. Work Temperature: -40°C~70°C;
2. Storage Temperature: -55°C~125°C;
3. Power Consumption: ≤60W.