Thermal & Power
A prominent growth sector, Thermal & Power capitalizes on design advancements now enabling and protecting billions of individual electronic devices as well as entire systems. We are a world leader in high-performance thermal interface materials (TIM) and TIM automated application solutions. Coupled with our design know-how, our thermal products fill in air gaps and microscopic irregularities, resulting in significantly lower thermal resistance and thus better cooling of increasingly hotter 5G and other components. More effective heat transfer helps a new product achieve faster regulatory compliance. Likewise, Laird™ Steward™ product designers also work with global customers, delivering consistently high-performing inductive components that measurably improve power delivery by preserving signal integrity. This area is comprised of wireless charging products, inductors for power and signal lines, and electromagnetic compatibility (EMC) solutions. Thermal & Power is comprised of:
Gap Fillers / Thermal Interface Materials
Laird designs and manufactures a complete line of gap fillers including thermal interface sheets or pads, phase change materials, thermal greases, and thermally conductive insulator materials. Combining thermal conductivity with softness will solve numerous thermal performance issues. Our line includes ultra-thin gap fillers, a high deflection series, and materials that provide electrical isolation. Among the many applications of gap fillers are telecom/datacom, wireless infrastructure, routers, servers, memory modules, gaming systems, tablets, notebooks, smart home devices, LED lighting, automation, test instrumentation, power supplies, controllers, ADAS, infotainment and powertrain. Our capabilities expanded in 2018 to include the automated application of all forms of thermal interface materials, thus lessening tedious manual tasks.
Liquid Gap Fillers
When designers must eliminate mechanical stress on sensitive components or there is a desire to implement bulk automated dispensing, Laird’s liquid gap filler offerings prove ideal. These one- and two-part gap fillers bridge the interface between hot components and a chassis or heat sink assembly while gently protecting device elements. Their super compliant nature - enabling the transfer of little or no pressure between interfaces - makes our liquid gap fillers a preferred choice around the globe to fill large and uneven gaps in assemblies.
Inductive Components
Laird™ Steward™ wireless charging coil assemblies are designed to meet the WP Qi standard, are easy to install and enable fast charging and maximum power transmission. Automotive-grade assemblies are available. Our inductive solutions also include easy to install and cost-saving power inductors. These signal integrity products feature high current/low loss capabilities and utilize a low-profile, small footprint design. Ferrite-based product families preserve signal integrity by removing or filtering noises generated by active components such as microprocessors, microcontrollers and System-on-Chip (SoC), and couplings from DC power lines.