Learn how microscopy and spectroscopy can reveal the causes and mechanisms of material failures, and explore some of the recent advances in these techniques.

Scanning electron microscopy is a great technique to prove a metallurgist's suspicions about a failure mode. While visual examination can tell a trained metallurgist a lot about a failure, SEM, coupled with EDAX microanalysis can assist in proving definitively what has occurred.

I use ESM in life sciences to examine ectopic minerals depositions in the aortic valve. ESM with EDAX is an excellent tool for that. So I can know the composition of minerals we have in the tissue.

What are the latest developments and trends in microscopy and spectroscopy for failure analysis?

Microscopy and spectroscopy are essential tools for failure analysis, the process of identifying and understanding the causes and mechanisms of material defects and failures. These methods can reveal the microstructure, composition, and properties of materials at different scales and conditions, and help engineers and scientists solve problems and improve performance. In this article, we will explore some of the latest developments and trends in microscopy and spectroscopy for failure analysis, and how they can benefit various industries and applications.

1 Scanning electron microscopy

Scanning electron microscopy (SEM) is a widely used technique that utilizes a beam of electrons to scan the surface of a sample and produce high-resolution images and elemental analysis. It can reveal features such as cracks, fractures, corrosion, wear, and contamination, as well as provide information on the morphology, phase distribution, and chemical composition of materials. Recent advances in SEM for failure analysis include low-voltage SEM which can reduce charging and beam damage effects on non-conductive or sensitive samples and enhance the contrast and resolution of surface details. In situ SEM can perform mechanical, thermal, electrical, or environmental tests on samples while imaging them and capture the dynamic behavior and response of materials under various stresses and stimuli. Correlative SEM also combines SEM with other techniques such as optical microscopy, X-ray microscopy, or atomic force microscopy to correlate data from different modalities to obtain a comprehensive and multiscale characterization of materials.

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Chris Harte

Laboratory Technician
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Scanning electron microscopy is a great technique to prove a metallurgist's suspicions about a failure mode. While visual examination can tell a trained metallurgist a lot about a failure, SEM, coupled with EDAX microanalysis can assist in proving definitively what has occurred.

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Rihab Bouchareb

Assistant professor interested into Cardiovascular disease/Kidney disease/Valvular disease/Metabolism/Lipids/atherosclerosis
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I use ESM in life sciences to examine ectopic minerals depositions in the aortic valve. ESM with EDAX is an excellent tool for that. So I can know the composition of minerals we have in the tissue.

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Muhammad Muteeb Butt

Additive Manufacturing, Root Cause Failure Analysis, Replica Metallography, Damage Mechanism Assessment, Material Testing, Remaining Life Assessment, Product Development
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SEM is a key tool in failure analysis. It enables us to pinpoint crack initiation sites, track crack propagation modes, and understand the final rupture mode. When coupled with EDS, SEM becomes even more indispensable. In a recent case study, EDS facilitated the identification of an inclusion's composition, revealing it to be MnS and serving as a critical indicator of crack initiation. Moreover, SEM allows for the precise determination of composition of small phases, aided by EDS. SEM has various modes, including backscattered and scanning electron modes. Each mode provides unique benefits, from compositional-based contrast to morphological-based contrast, enhancing our ability to uncover the intricate details of failure mechanisms.

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Abhishek Gottipati

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Multibeam SEM (MBSEM) is also available at commercial scale for high throughput defect metrology work. These current generation MBSEMs are primarily from single electron beam source followed by beam splitting.

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Sam Imanieh

Sr. Failure Analysis Engineer
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In my experience, different detectors attached to SEM are very helpful and powerful in failure analysis. Backscattered, Auger, EBSD, and EDS are examples of such attachments that help to solve and find reasoning for the failures of the parts under investigation.

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2 Transmission electron microscopy

Transmission electron microscopy (TEM) is a powerful technique that uses a beam of electrons to pass through a thin sample and produce images and diffraction patterns that reveal the atomic structure and crystallography of materials. TEM can provide information on defects, dislocations, grain boundaries, interfaces, and phases of materials, as well as help understand mechanisms of deformation, fracture, fatigue, creep, and diffusion. Recent advances in TEM for failure analysis include aberration-corrected TEM to correct distortions and aberrations caused by the lenses and magnets in the electron microscope, scanning TEM (STEM) to scan the beam across the sample and collect signals from different detectors, and in situ TEM to apply external forces or fields to the sample and observe changes in structure and properties of materials in real time.

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3 Raman spectroscopy

Raman spectroscopy is a non-destructive technique that uses a laser to excite the molecules in a sample and measure the scattered light that contains information on the vibrational modes and energy levels of the molecules. This type of spectroscopy can provide insight on chemical bonds, functional groups, molecular structure, and phase transitions of materials, as well as help identify the origin, composition, and degradation of materials. In terms of failure analysis, recent trends in Raman spectroscopy include Tip-enhanced Raman spectroscopy (TERS), Surface-enhanced Raman spectroscopy (SERS), and Hyperspectral Raman imaging. TERS uses a metal-coated tip to enhance the electric field and the Raman signal near the tip apex, while SERS uses metal nanoparticles or nanostructures to amplify the Raman signal of molecules adsorbed on the surface. Hyperspectral Raman imaging combines Raman spectroscopy with optical microscopy and acquires spectra at each pixel of an image to generate maps that show the spatial distribution and variation of chemical species, phases, and stresses in materials.

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Sam Imanieh

Sr. Failure Analysis Engineer
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Very recent electron microscopes equipped with Raman spectroscopy detectors. This is the case with environmental SEM machines and Raman chemical images can be superimposed on an electron image. This will expand your sample knowledge and accelerate your root cause analysis.

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What are the latest developments and trends in microscopy and spectroscopy for failure analysis?

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1 Scanning electron microscopy

2 Transmission electron microscopy

3 Raman spectroscopy

Failure Analysis

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