4D Technology Corporation

4D Technology Corporation

Appliances, Electrical, and Electronics Manufacturing

Tucson, AZ 1,297 followers

A subsidiary of Onto Innovation

About us

4D Technology designs and manufactures laser interferometers, surface roughness profilers and interferometry accessories, for accurate measurement of optics, optical systems and precision machined surfaces. Our innovative products utilize state-of-the-art technology that can be deployed in production environments, even in the presence of severe vibration and turbulence. 4D interferometers and optical profilometers are used daily in critical applications in astronomy, aerospace, optical testing and many other industries. 4D's history of innovation has changed how and where interferometric measurement can be used, from unique space-based projects to high throughput production of precision components. 4D Technology is a wholly owned subsidiary of Onto Innovation.

Industry
Appliances, Electrical, and Electronics Manufacturing
Company size
11-50 employees
Headquarters
Tucson, AZ
Type
Public Company
Founded
2002
Specialties
Vibration-Insensitive Dynamic Laser Interferometers, Vibration-Insensitive Dynamic Optical Profilers, Surface metrology, Surface measurement, 3D measurement, Optics, and Interferometers

Locations

Employees at 4D Technology Corporation

Updates

  • Join 4D Technology Corporation's free webinar Defense and Space Optics: At-wavelength IR metrology for Testing & Alignment on Wednesday, September 4, 2024, from 12 p.m. to 1 p.m. EDT. Infrared optics play a pivotal role in the space and defense industries due to their unique capabilities in detecting and analyzing thermal radiation. In space exploration, infrared optics facilitate the observation of celestial objects obscured by cosmic dust or faint in visible light, offering insights into the formation and behavior of stars, planets and galaxies. They also enable Earth observation satellites to monitor climate change, natural disasters and environmental conditions by capturing thermal signatures and variations. In defense, infrared optics are crucial for surveillance, reconnaissance and targeting, allowing for the detection of heat emissions from vehicles, aircraft and personnel in diverse conditions, including low-light and obscured environments. Infrared laser communication systems offer secure and reliable data transmission over long distances, enhancing operational coordination and mission effectiveness. As such, it is essential to test optical components and systems at the operating wavelength to understand the final optical performance whether it be fiber coupling efficiency, system level wavefront error or other performance metrics. Individual component metrology can be used to correct as-built optical designs for optimum system level performance. This webinar will discuss how such optics are aligned and tested using various at-wavelength interferometers of different aperture sizes and configurations to maintain the integrity of the transmitted signals to tight tolerances, resulting in better coupling, less losses and higher efficiencies. We will cover wavelengths including: NIR: 1053nm & 1064nm SWIR: Discrete c-band testing from 1530nm-1565nm MWIR: 3.39µm, 3.8µm – 4.1µm LWIR: 10.6µm It will include key performance metrics for such systems and critical considerations for selection of the appropriate system for a given application. Topics will include: • Measuring despite vibration: how dynamic interferometry can enable vibration-immune testing of IR optical components and systems • Measuring at discrete frequencies: when to use a Fizeau interferometer versus a Twyman-green • Real-time alignment, collimation and fiber coupling of optical systems at wavelength • Measuring surface roughness in dynamic environments Who should attend this webinar? If you’re in these fields: • Satellite communications • IR optical design • Space imaging • IR components manufacturing • IR optical systems alignment To register, please visit: https://lnkd.in/e33wvF2k.

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    The rise of multi-node chips, a.k.a. chiplets, brings with it the need for new metrology, inspection and lithography solutions for the advanced packaging sector. Onto Innovation’s Cheolkyu Kim and Keith Best will dive into some of these solutions at the 2024 Korea Electronics Packaging and Circuits Association (KPCA) show, September 4-6, in Incheon, Korea. On September 4, Cheolkyu will present Metrology and Inspection Solutions to Extend IC Substrates and Panel Packaging to 2µm L/S and Beyond, while on September 5, Keith will discuss Panel Lithography Solutions – Supporting an Evolving Ecosystem. In addition to these two presentations, the Onto Innovation team will be on hand. Stop by Booth L401 to learn about the many unique and powerful process control technologies Onto offers the semiconductor market.

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    The demand for AI technologies cuts across multiple segments of the semiconductor industry, from advanced node, next generation CPU/GPUs supporting high bandwidth memory to chiplet technologies drawn from a variety of mature and specialty node device technologies, as well as advanced packaging at both the wafer and panel levels. With these factors at play, manufacturers face many challenges in supporting waves of end market growth enabled by advanced technologies like AI or specialty technologies, such as power devices for the automotive and green energy industries. Onto Innovation’s Al Gamble will discuss these issues and more during his presentation “Addressing Key Challenges in Enabling AI and Specialty Applications Through Unique Metrology, Inspection and Lithography Technologies” September 6 at SEMICON Taiwan. In his presentation, Al also will highlight the many unique and powerful process control technologies Onto is bringing to the semiconductor market. In addition, Onto Innovation invites attendees to Booth #N0270 to learn about the Company’s portfolio of integrated process and process control solutions being used to support its customers’ ramp of AI products. For more information about Onto, please visit: www.ontoinnovation.com or reach out to the sales team.

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    Exciting times are ahead for India’s rapidly growing semiconductor industry, with headlines announcing new initiatives and investments signaling a watershed moment for the country. This month brings SEMI’s inaugural SEMICON India in New Delhi, and the Onto Innovation team will be there to meet new customers and build new relationships. Onto invites attendees to Booth #H1U11 to discuss their challenges and goals, while learning about the Company’s portfolio of integrated process and process control solutions. For more information about Onto, please visit: www.ontoinnovation.com or reach out to our sales team.

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    Gallium nitride is poised for a bigger role in the semiconductor industry, one driven by the demand for more data servers supporting the AI gold rush and various power devices for the automobile industry as it continues the EV transition. But with the wider adoption of GaN comes the push “to develop best practices for test, inspection, and metrology,” Anne Meixner writes in the Semiconductor Engineering article “Driving Cost Lower and Power Higher With GaN.” In this article, Meixner dives deep into these emerging best practices, turning to a host of industry SMEs including Onto Innovation’s Jiangtao Hu and Mike McIntyre. To learn more, please visit: https://lnkd.in/gTtwgC4s.

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  • The 2024 SPIE Optics and Photonics exhibition is next week, and 4D Technology will be there as an exhibitor at the “leading multidisciplinary optical sciences and technology meeting.” At the exhibition, the 4D team will showcase a number of products, including the new AccuFiz Duo, a short and long coherence Fizeau interferometer. To learn more about the AccuFiz Duo, please visit: https://lnkd.in/eBJY_Gre.

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  • 4D Technology Corporation reposted this

    Exciting Speaker Announcement! We are thrilled to announce that Jiangtao Hu, Sr. Director of Product Marketing at Onto Innovation, will be speaking at I.S.E.S. USA Power 2024! With his extensive experience in product marketing and process control technologies, Jiangtao will provide invaluable insights into the industry's latest advancements and challenges. About Jiangtao Hu: Jiangtao Hu is the Sr. Director of Product Marketing at Onto Innovation, responsible for Metrology. Prior to this, he worked at Lam Research, leading product marketing teams in advanced process and equipment controls. Jiangtao started his career at Nanometrics in 2001, received his Ph.D. in Chemistry from Harvard University in 1999, and his bachelor’s degree in Applied Physics from Tsinghua University in 1995. About Onto Innovation: Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include un-patterned wafer quality, 3D metrology spanning chip features from nanometer-scale transistors to large die interconnects, macro defect inspection of wafers and packages, elemental layer composition, overlay metrology, factory analytics, and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster, and more efficient. Headquartered in Wilmington, Massachusetts, Onto Innovation supports customers with a worldwide sales and service organization. Don't miss this opportunity to hear from industry leaders like Jiangtao! Sign up to join us now at www.ises-power.com/us or contact our team at info@isesglobal.com for more information. #ISESUSAPower2024 

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  • FANUC America Corporation recently stopped by 4D Technology to present the team with the 2024 Innovative System of the Year Award for the 4Di InSpec™ automated metrology system (AMS). Developed in partnership with OptiPro Systems, the 4Di InSpec AMS system enables automated surface defect and feature metrology for aviation, aerospace and other applications in the industrial manufacturing market. The 4Di InSpec AMS system is a vibration-immune technology offering non-contact, three-dimensional optical metrology on the production floor, providing new levels of defect inspection with micrometer-level resolution. For more on the 4Di InSpec AMS, please visit: https://lnkd.in/eKB4Exiv,

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    🔹 Onto Innovation Reports 2024 Second Quarter Results 🔹 Strong demand for AI packaging and orders for emerging gate-all-around nodes drive revenue above high end of guidance Onto Innovation Inc. today announced financial results for the second fiscal quarter of 2024: Second Quarter Financial Highlights • Revenue of $242 million, exceeding the high end of guidance, driven by additional pilot line expansions for high-performance computing using gate-all-around transistor architecture and high bandwidth memory (HBM) supporting AI market growth. • GAAP gross margin and non-GAAP gross margin of 53%. ▪ GAAP operating income of $49 million and GAAP net income of $53 million. • Non-GAAP operating income of $65 million and non-GAAP net income of $65 million. • GAAP diluted earnings per share of $1.07 and non-GAAP diluted earnings per share of $1.32 were both above guidance ranges. • Record cash from operations of $65 million, or 27% of revenue. Second Quarter Business Highlights • Revenue from specialty and advanced packaging customers set another quarterly record of $164 million aided by AI packaging customers. • Closed over $300 million of volume purchase agreements issued by two customers for their AI advanced packaging and gate-all-around investments through 2025. • Revenue from advanced nodes increased at multiple customers led by the Atlas® and Iris™ systems for emerging gate-all-around devices. • Delivered industry-first JetStep® X500 lithography tool specifically designed for next-generation glass substrates for panel level packaging. Michael Plisinski, chief executive officer of Onto Innovation, commented, “The Onto Innovation team is working closely with technology leaders in advanced packaging and advanced nodes to drive yield improvements and enable smoother ramp times. As a result, we are seeing greater adoption of our metrology in packaging and new applications for the Dragonfly® platform leading to stronger sales. As we look forward, we expect continued strength in advanced packaging and the adoption of gate-all-around transistor architecture at several customers to lead our revenue growth in 2025.” For more investor information, please visit: https://lnkd.in/eaaSfkhU.

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Funding

4D Technology Corporation 3 total rounds

Last Round

Grant

US$ 225.0K

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