Accelsius

The past few weeks have been nothing short of amazing for the Accelsius team! We've been busy showcasing our innovative NeuCool™ 2-phase direct-to-chip solutions and engaging with the data center community across several key industry events. AFCOM DFW Chapter Meeting We kicked things off at the AFCOM DFW Chapter Meeting at CentersquareDC, coordinated by Al Nichols from Silverback Data Center Solutions. Special thanks to Robin Strack for helping make this event such a success. It was a fantastic panel and a great opportunity to connect with industry peers and share valuable ideas. Yotta 2024 Conference in Las Vegas Next up was the inaugural Yotta 2024 conference in Las Vegas. It was incredible to gather with colleagues, partners, and the global ecosystem to discuss solutions to the challenges facing our industry. The Accelsius team had productive discussions about how to de-risk and future-proof client infrastructures and discussed ways to help our clients deliver and HPC compute at the required scale. The collaboration, exchange of ideas, and scale of the upcoming projects were truly inspiring. Open Compute Project Foundation Global Summit in San Jose We wrapped up our busy schedule at the OCP Global Summit in San Jose, where we showcased our technology alongside Intel Corporation. It was a tremendous opportunity for the Accelsius technology to be included with an industry giant, and we were proud to demonstrate the benefits of our NeuCool™ 2-Phase technology alongside the results of our joint studies on a universal cold plate for both single and 2-phase cooling. A huge thank you to Dr. Devdatta Kulkarni and his team for their support. The response to our demo and the discussions around the possibilities of our NeuCool™ technology and products were fantastic! A huge thank you to everyone who attended our presentations, visited our booth, and interacted with our demos at these events. Your engagement and interest drive us to continue innovating! I also want to give a heartfelt shoutout to the entire Accelsius team —whether you were at the events or back in Austin providing support. None of this would have been possible without your dedication and hard work. Teamwork makes the dream work! Next up is SC24 in Atlanta! Let's connect and discuss how our solutions can enhance your data center. Reach out to me or the Accelsius team to set up a meeting! #Innovation #OCP #OCP24 #Yotta24 #LiquidCooling #NeuCool #2Phase #AI #HPC #datacentercooling

Accelsius is headed to SC24! And we'd like to celebrate another exciting conference by inviting our data center colleagues to join us for an informal happy hour! WHEN: Wednesday, November 20th from 5-7 PM WHERE: The Skylounge at the Glenn Hotel LINK TO REGISTER: https://lnkd.in/ejDH2Q4N We're looking forward to the chance to meet and mingle in Atlanta with our fellow industry members! However, registration is required for the event, and spaces are limited, so be sure to register yourself (and invite a colleague) ASAP! Special thanks to AFCOM and our co-sponsor Silverback Data Center Solutions for helping us organize this event!

NEW RESEARCH AVAILABLE: Yesterday, at the OCP Global Summit 2024, our CTO Dr. Richard Bonner presented research on the feasibility of a universal cold plate that Accelsius has conducted alongside scientists at Intel. READ WHITE PAPER HERE: https://lnkd.in/e6Xg5pQx In this recently published white paper, co-authors Richard Bonner, Qingyang Wang, Devdatta Kulkarni, and John C. Gulick developed and tested the performance of a universal cold plate that could accommodate both single-phase and two-phase liquids. Not only did the authors of this paper conclude that "the possibility of having a universal cold plate appears feasible," which would then ease the transition of single-phase to two-phase cooling for end users, but also showed that, even with a cold plate optimized for single-phase, two-phase exhibited stronger cooling performance. Be sure to download and read the full white paper for a thorough explanation of the experiment and its results!

We appreciated the invitation for Liz Cruz to chat about Accelsius and our journey with Rob Coyle on the OCP Podcast! The episode will be released in a few weeks.

TOMORROW: Celebrate the end of another successful OCP Global Summit by joining us at a happy hour! WHERE: Laughing Monk Brewing (formerly Faultline) in Sunnyvale, CA WHEN: Thursday, October 17th @ 3:30-6:30 PM LINK TO REGISTER: https://lnkd.in/ePYGYwzQ Be sure to join us for a great opportunity to network with peers over appetizers and beverages! We can guarantee there'll be no presentations, no sales pitch, and no agenda. Thanks so much to our fellow event coordinators and sponsors: 🫧 Silverback Data Center Solutions 🫧 AFCOM NorCal - Silicon Valley 🫧 Caliism Data Solutions 🫧 Hula Networks We hope to see y'all soon!

Our tabletop demo is now live at OCP’s Future Technologies Symposium! Feel free to stop by the foyer of LL20BC to chat with our world-class research team and have a hands-on chance to explore our NeuCool™️ two-phase, direct-to-chip liquid cooling technology.

Accelsius has been highlighted in a recent article from CRN entitled "Smart Technology Investments For A New Era." Written by Jennifer Follett, the article discusses the "key technology areas" that will help solution providers differentiate their businesses in 2025. READ HERE: https://lnkd.in/eGqX7JT9 As the creator of a two-phase, direct-to-chip cooling solution, Accelsius was mentioned as a company ready to meet the new demand for liquid cooling as powerful accelerator chips needed to support GenAI continue to be developed. Companies like Accelsius "are eager to team with channel partners to deliver solutions for both the data center and the edge," Follett writes. "With direct-to-chip liquid cooling, the channel has an opportunity to build distinctive solutions that ... help data centers cut down on energy usage versus traditional air-cooling methods. How cool does that sound?" If you're looking to stay ahead of the curve in 2025, be sure to reach out to us to discuss how our NeuCool liquid cooling technology is ready to meet the needs of the next few generations of AI-focused hardware.

We made it to OCP! Check out our research—conducted by Accelsius Senior R&D Thermal Engineer Dr. Qingyang Wang and Accelsius CTO (and occasional research poster model) Dr. Richard Bonner—on the Lower Level of SJCC!

Accelsius is at OCP this week! Check out the following event highlights to get a hands-on chance to try out our revolutionary NeuCool™ technology, featuring superior results from recent experimental testing with leading chip vendors. 🫧 🫧 🫧 First, don't miss the chance to explore our NeuCool technology at two different locations throughout the event. Be sure to test out our tabletop demo at the Accelsius booth in the Future Technologies Symposium on October 16th from 8 AM to 4 PM. We'll also have a demo available at Intel's booth in the Innovation Village (Booth B4) throughout the conference! 🫧 🫧 🫧 Next, be sure to check out Accelsius CTO Dr. Richard Bonner's panel on DC Cooling Technologies, featuring his recent findings on a universal direct-to-chip plates for single- and two-phase cooling! WHEN: Wednesday, October 16th @ 10:40 AM WHERE: SJCC Lower Level - LL20BC 🫧 🫧 🫧 Finally, as the conference winds down, come join us at a happy hour at Laughing Monk Brewing Co.! This is an informal event designed to allow you to network with industry peers over appetizers and beverages. We hope to see you there! WHEN: Thursday, October 17th from 3:30-6:30 PM WHERE: 1235 Oakmead Parkway, Sunnyvale, CA 94085 LINK TO REGISTER: https://lnkd.in/ePYGYwzQ

Last week, our Product Development Thermal Engineer Akshith Narayanan presented at ASME InterPACK 2024! Akshith's topic explored server-level direct-to-chip two-phase cooling for high-powered GPUs, with a particular focus on the cold plate performance for today's GPU power levels up to future power loads of 2.2kW per socket. During his presentation, Akshith also shared the results of the Dell 4-Way H100 server when installed in our NeuCool™ in-rack system. Huge congratulations to Akshith for his presentation at InterPACK! We're thankful that you took the time to travel and share your findings on the performance of two-phase, direct-to-chip liquid cooling.