3D InCites

Did you miss the deadline for submitting your 2025 3D InCites Awards Application? Never Fear! We've extended it by ONE WEEK to October 26. Don't miss your chance for your company to be recognized for: 🏆 Technology Enablement 🏆 Engineer of the Year 🏆 Best Place to Work Submit Your Application Here: https://lnkd.in/gjgxMvE

🎤 NEW PODCAST - Live, from Boston MA at the International Microelectronics Assembly and Packaging Society (IMAPS) Annyak Symposium🎤 This episode spotlights 10 of our members who sat down with Françoise von Trapp to talk about what they presented, and showcased, and what they came to learn about. But first - two corrections - In her intro, Françoise says there are 7 members. That's how many were scheduled, but we picked up 3 more during the week. 🤷♀️ Also, she mistakenly called Brendan Wells "Brandon" and for that she is very sorry. Listen in to hear: 👉Brendan Wells, Amkor Technology, Inc. Technologies, Inc., explain the difference between laminate and strip-based substrates for advanced packaging and when to use each. He also discusses how chiplet integration is impacting the assembly processes. 👉 Evan Griffith and Sze Pei Lim Pe Lim, Indium Corporation, talk about how changing advanced packaging requirements for #AI chip sets are changing the game for materials development. 👉 John Lannon, general manager of Micross Components update us on the progress with the company’s 300mm capacity expansion and what it means to win the William T. Ashman and John A. Wagnon Technical Achievement Award. 👉 LPKF Laser & Electronics SE’s Richard Noack talk about the difference between glass interposers and glass core technology, and what’s driving development of these materials. 👉 Sally Ann Henry, ACM RESEARCH, INC. Research, talk about the company’s decision to invest in equipment platforms to support panel level packaging. 👉Casey Krawiec, StratEdge Corporation, talk about what it means to receive the IMAPS Society Award for Corporate Sponsorship. You'll also learn why business is up for packaging GaAn devices. 👉Habib Hichri, Ajinomoto Co., Inc. Fine Techno, talk about IMAPS Academy, and Ajinomoto’s new developments beyond ABF dielectric film into magnetic materials. 👉Adeia's Guilian Gao talk about what #OSATS need to do to support die to wafer #hybridbonding processes. Scott Sikorski, IBM, explain how the Northeast Corridor from New York up into Canada is becoming one of the U.S.’s hot spots in advanced packaging. Peter Cronin, MRSI SYSTEMS Micronic, introduce the company’s latest die bonder system, and a new application center in Livermore, CA. Members, if you missed out, you'll have another opportunity to participate - we'll be recording live from SEMICON Europa! Contact Françoise von Trapp if you want to be included. Listen here: https://lnkd.in/gAanV5Cq

John Lannon, General Manager of Micross AIT dvision of Micross Components, knows a lot 2.5D and 3D heterogeneous integration. Tap into his wealth of knowledge - Watch his recent presentation on how 2.5D and 3D can be used to optimize high reliabilty electronics design. It's this week's featured video! https://lnkd.in/gU3x5Qbs

Introducing the member of the week: Koh Young Europe GmbH! They have a busy month coming up. Koh Young Technology will showcase its advanced inspection solutions at Messe Muenchen's Electronica 2024 (Booth A3.358), and SEMI Europe's SEMICON Europa 2024 in Munich from November 12-15, 2024 (Booth C2.549). At Electronica They will demonstrate solutions for PCB assembly professionals, featuring the Zenith Alpha, KY8030-2, and Neptune C+ systems. Meanwhile, at SEMICON Europa, Koh Young will highlight semiconductor inspection systems, including the Meister S, Meister D, and Meister D+ for wafer-level packaging and advanced applications. 

Today's the day, folks! Get'em in by midnight PDT! Thanks to our platinum sponsors, KLA and EV Group Apply here: https://lnkd.in/gjgxMvE CONTENDERS: MARK THESE IMPORTANT DATES ON YOUR CALENDAR! 👉 Finalists will be notified in mid-November and required to complete an additional questionnaire by January 6. 2025. 👉All finalists will be acknowledged in the 2025 3D InCites Yearbook. 👉Winners will be notified on Tuesday, February 3, 2025. 👉All finalists will be acknowledged in the 2025 3D InCites Yearbook.Awards will be presented in a ceremony on March 4, 2025, during the opening of the IMAPS Device Packaging Conference.

Today's the day, folks! Get'em in by midnight PDT! Thanks to our platinum sponsors, KLA and EV Group Apply here: https://lnkd.in/gjgxMvE CONTENDERS: MARK THESE IMPORTANT DATES ON YOUR CALENDAR! 👉 Finalists will be notified in mid-November and required to complete an additional questionnaire by January 6. 2025. 👉All finalists will be acknowledged in the 2025 3D InCites Yearbook. 👉Winners will be notified on Tuesday, February 3, 2025. 👉All finalists will be acknowledged in the 2025 3D InCites Yearbook.Awards will be presented in a ceremony on March 4, 2025, during the opening of the IMAPS Device Packaging Conference.

You've probably already seen Amkor Technology, Inc.'s news about the MOU with TSMC. But have you read Philip Garrou's thoughts on it? His latest IFTLE blog post features that, as well as key takeaways from the Onshoring sessions and Dev Palmer's Keynote at the recent International Microelectronics Assembly and Packaging Society (IMAPS) International Symposium. you can read it here: https://lnkd.in/gCmH3CKd

You've probably already seen Amkor Technology, Inc.'s news about the MOU with TSMC. But have you read Philip Garrou's thoughts on it? His latest IFTLE blog post features that, as well as key takeaways from the Onshoring sessions and Dev Palmer's Keynote at the recent International Microelectronics Assembly and Packaging Society (IMAPS) International Symposium. you can read it here: https://lnkd.in/gCmH3CKd

Remember when we were all focused on reducing #GHG by replacing coal with clean renewable energy? Remember when nuclear power was a promising renewable option, but then all the plants started closing due to either economics or public concerns over safety and nuclear waste? Well, now that we need #AI - seemingly more than we need to reach our GHG goals - that's all changing. In his recent blog post, "My How the Pendulum Swings", Dean Freeman looks at what's driving companies like Google, Meta, Amazon Web Services (AWS) and Microsoft are looking for other ways to meet their GHG goals - PPAs to offset coal energy, re-firing up old nuclear plants, and investing in small moduloar reactors. Read about it here: https://lnkd.in/g2T2n4NV

Semiconductors are the micro-sized "brains" that power modern electronics. Did you know only the latest advancements in semiconductor packaging materials can transform key industries like #5G, #AI and #Automotive electronics by making them smarter, better, and more reliable? Discover how unseen yet powerful material innovations like thermal die attach solutions are solving critical challenges like heat dissipation and reliability, enabling next-gen devices to achieve superior performance and durability. Explore the eBook from Henkel Adhesive Technologies now to learn more. https://lnkd.in/gThgqSVU