Lam Research

Logic scaling is at the heart of semiconductor evolution, enabling us to pack more transistors into smaller spaces for faster, more powerful chips. From the early days of planar FETs to the breakthrough of gate-all-around and CFET architectures, each advancement reduces current leakage and improves performance. Watch the full video to explore the transistor architectures enabling logic scaling. https://bit.ly/43TdIfA

As logic devices continue to shrink, the required atomic layer deposition and etch process becomes more difficult when building gate-all-around structures. Discover how emerging processes and technologies reduce congestion and complexity while improving performance.

With nearly 150 members, the Women of CSBG Employee Resource Group (ERG) fosters support, growth, and empowerment. Since 2018, the ERG has created a space for women to connect, develop new skills, and share experiences. From leadership panels to mentorship programs, discover how this ERG drives success at Lam and beyond.

Imagine squeezing half a billion people onto the island of Manhattan — that’s the level of density we achieve with Dynamic Random Access Memory (DRAM). Watch the video to see how we enable higher memory density through advanced scaling techniques, from high aspect ratio etching to atomic layer deposition.

As a testament of our commitment to business integrity, we are one of Ethisphere’s World's Most Ethical Companies®. We are so honored to be recognized by Ethisphere for a third year in a row. This recognition reflects our continued dedication to doing business the right way. https://lnkd.in/ghbG8a78

Gate-induced drain leakage (GIDL) is a significant challenge in scaling DRAM, causing energy loss when devices are not in use. Using SEMulator3D®, we modeled Dual Work-Function Metal Gate (DWMG) structures — dividing the gate into sections with different electrical properties. Discover how this controlled the electric field and reduced energy loss. https://bit.ly/4i4Ay8w.

For 20+ years, our Kiyo® family of products has led the conductor etching industry, delivering high-performance capabilities and advanced chip designs with shrinking features. Learn how Akara® builds on our history of etch excellence and scales next-generation device architectures. https://bit.ly/3Xq1Pdb

Our team in Enschede, Netherlands, celebrated the grand opening of our newly remodeled facility, now serving as our European center for PLD technology development. This site, combined with our deep university partnerships, strengthens our leadership in PLD and other specialty technologies. Learn more. https://bit.ly/4kkIGDh

We collaborated with researchers from Princeton Plasma Physics Laboratory (PPPL) and the University of Colorado Boulder to explore how hydrogen fluoride plasma cryo etching can enhance 3D NAND manufacturing by replacing conventional materials. Discover how this process doubled etch rates via the blog. https://bit.ly/4aTfH5m

Built on two decades of leadership in conductor etch, our latest innovation, Akara®, delivers unmatched precision and performance required for 3D chipmaking. Explore more. https://bit.ly/4i5iURo