MacDermid Alpha Electronics Solutions

Introducing a better way to stay connected with our new Life Pages! Our solutions can be found at every level of electronics manufacturing, from wafer fabrication to final device assembly and complemented by smart surface films and in-mold electronics solutions. That’s why we've created a seamless experience to showcase our latest technology advancements and industry trends. Stay up-to-date on news and connect with our experts in your preferred segment of electronics manufacturing: Circuitry Solutions: https://lnkd.in/eC6-gYwa Semiconductor Assembly: https://lnkd.in/e6VwA2Na Wafer Level Packaging: https://lnkd.in/e-FbbcWP Circuit Board Assembly: https://lnkd.in/eskBryX7 Film & Smart Surfaces: https://lnkd.in/eB5tk-qS Explore our Life Pages and discover how our comprehensive solutions are revolutionizing the #electronics manufacturing industry! #PCB #Circuitry #PCBassembly #WaferLevelPackaging #Semiconductor #Assembly #CircuitBoardAssembly #SmartSurfaces #InMoldElectronics #ElectronicsManufacturing

Continuing our discussion on hybrid bonding, developing grain engineering techniques mitigates quality and reliability issues in hybrid bonding by tuning the size, orientation, and texture of copper grains used within the bond. Engineering grain boundaries enhance material properties such as: mechanical strength, thermal conductivity, and electrical conductivity. These improvements directly contribute to the reliability and performance of a microelectronic device, ensuring their long-term functionality under challenging operating conditions. We are already pioneering research in this area; developing technologies that support grain engineering, ensuring grain size is maintained throughout processing. This will ensure that grain growth is controlled during annealing, producing ultra-pure copper films. To learn more about our research into this crucial area of semiconductor manufacturing, connect with our experts here: https://lnkd.in/e3XeeGcn #hybridbonding #semiconductorpackaging #waferlevelpackaging #semiconductor

As microelectronic devices advance, it’s essential for semiconductor packages to deliver optimal performance, reliability, and functionality. To support this progress, contact interconnects are shrinking, pushing traditional bonding methods like flip chip C4 and C2 to their limits. New bonding methods for advanced semiconductor packaging are needed. Hybrid bonding offers a solution by creating a direct connection between chip to chip, chip to wafer or wafer to wafer. The process involves bonding between copper-to-copper interconnects and to the dielectric-to-dielectric interface. Hybrid bonding allows for extremely fine-pitch interconnections (sub-10µm), enabling a dramatic increase in chip integration density. This higher density means better performance and enhanced efficiency, ideal for demanding applications like artificial intelligence, high-performance computing, and advanced memory solutions. However, the quality and reliability of the hybrid bond depends on the quality of the copper pad grain structure. In our next post we’ll address how we are already developing technologies that support re-engineering copper pad grain structure to meet the quality and reliability needs of hybrid bonding. Stay tuned! #hybridbonding #semiconductorpackaging #waferlevelpackaging #semiconductor

We are excited to share that our technical paper ‘Metastable Fine Grain Cu for Hybrid Bonding Applications’ has won the Best in Session Award for the 2024 IMAPS 57th International Symposium on Microelectronics! Senior R&D Scientist, Pingping Ye, showcased our research into the intricate dynamics of copper microstructure evolution, paving the way for enhanced performance and reliability in hybrid bonding applications. Producing metastable copper fine grains tailored for hybrid bonding is crucial for interconnection applications with stringent thermal constraints. Thank you to #IMAPS for this recognition. We are proud of our technical experts, their contributions to this achievement, and their ongoing commitment to future-focused innovation. Stay tuned for next week’s post, as we discuss the importance of developing technologies to enhance the performance and reliability of hybrid bonding to meet the needs of today’s advanced semiconductor packages. For more information on our hybrid bonding technologies please visit: https://lnkd.in/eYRGimzE #hybridbonding #semiconductorpackaging #waferlevelpackaging #semiconductor

Join us at Automotive Interiors Expo in Stuttgart, Germany, November 12-14 and discover the latest technologies to enhance the quality, color, texture, touch, feel and function of automotive smart surfaces and controls. At booth 1706, we will be showcasing our unique portfolio of XtraForm™ materials and XMAPP™ Technology expertise for seamless 3D smart surfaces. Featured Innovation: XtraForm™ 3D Matt Experience the future of #automotive interiors with our latest innovation, XtraForm™ 3D Matt. This deep formable hardcoated film provides a premium vehicle interior look and feel with a softer touch and visually stunning matte appearance. XtraForm™ Matt's antiglare surface blends with other soft materials in a vehicle interior and reduces distractions. The surface is smooth to touch and does not show finger marks, ensuring a pristine interior even after repeated use. Don’t Miss Our Presentation Peter Alan Warwick, Director of Innovation, will present “The End of 'Piano Black'? Matt Finish Smart Surfaces” at the Technology Presentation Stage on Wednesday, November 13, during the morning session. Peter will share insights on the latest trends in smart surfaces, focusing on innovative matt hardcoated films that are glare-free, anti-fingerprint, and softer to touch, as well as support for film insert molding (FIM) processes. Connect with our experts at Automotive Interiors Expo in Stuttgart to discuss your design and functional needs. We look forward to engaging with you, sharing insights and experiences, and exploring collaborative opportunities. For a complementary visitor pass, visit: https://lnkd.in/eHg49QXx #XtraForm #HardcoatedFilms #FlexibleInks #MacDermidAlpha #MacDermidAlphaElectronicsSolutions #IME #InMoldElectronics #PowerYourDesign #AutomotiveDisplays #AutomotiveInteriors

Join us at SMTA International on Thursday, October 24, for two insightful presentations that explore high-reliability #electronics and automated soldering processes. Our Director of R&D Applications, Anna Lifton, will address the rising demand for high-temperature reliability and extended fatigue life in electronic applications, showcasing a novel solder alloy ideal for automotive use. Presentation Title: "Exploring the Next-generation High-Reliability Lead-free Solder Alloy" Time: 9:00 am – 9:30 am Right after that, join Westin Bent, our Application Lab Manager, as he discusses how selecting the appropriate cored wire can significantly enhance the efficiency and quality of automated soldering processes, addressing challenges faced in modern electronics assembly. Presentation Title: "How Choosing the Right Cored Wire Can Optimize Automated Soldering Performance" Time: 9:30 am – 10:00 am Don’t miss these opportunities to learn and discuss strategies for improving reliability and performance in electronics #assembly. We invite you to visit us at Booth #2712 to connect with our experts. For information about our showcased solutions at the event, visit here: https://lnkd.in/gapyhw58 #solder #solderalloy

We are thrilled to announce that we will be leading an insightful discussion on optimizing material choices for electronics applications in our upcoming webinar series! Join Padmanabha Shakthivelu, Senior Business Development Manager, as he presents: “Material Selection for High-Reliability Electronics Applications: Session 1 - Conformal Coatings.” This first session of the webinar series will cover key applications, reliability challenges, and technology trends in high-reliability electronics, followed by an interactive Q&A session. Date: November 1, 2024 Time: 2:00 PM – 3:00 PM (GMT+8) Location: Online Webinar Don't miss this opportunity to learn from one of our experts and explore the latest insights on conformal coatings, resins, and thermal interface materials (TIMs) for enhancing electronic application reliability. To register for the webinar, visit: https://lnkd.in/g3hcFSE5 We look forward to seeing you online! #thermalinterfacematerials #conformalcoating #electronics #pottingresin

A little over a month ago, we hosted our first Film & Smart Surface Tech Day in Bangkok, Thailand. Thank you to all who joined us on September 12th - 13th and to the support from our business partners: KOSTAL Group, Marabu Inks and Vlink. Our film & smart surface integrated solutions enable highly functional, decorative, and robust control and display surfaces at automotive, commercial, industrial, & medical human-machine interface. This event presented FIM technology, In-Mold Electronics including the latest innovation of automotive formable films (XtraForm 3D) and electronics ink, and automotive recognized XMAPP quality system. If you missed the opportunity to discuss our cutting-edge technologies, you can connect with our experts here: https://lnkd.in/escgu3sd #Automotiveinterior #Automotive #XtraForm #XMAPP #IME

Join us at SMTA International in Rosemont, IL, Booth Number 2712, from October 22–24. As #semiconductor packages become increasingly complex, ensuring board-level reliability (BLR) presents unique challenges. This complexity highlights the critical need for advanced reinforcement materials that enhance BLR and ensure thermomechanical reliability throughout the #assembly. On Tuesday, October 22nd, from 9:30–10:00 AM, our Director of R&D Applications, Anna Lifton, will present: “Electrochemical Reliability Considerations of Board-Level Solder Joints with Polymer Reinforcement Materials in Advanced Semiconductor Packaging.” Learn how high-performance #underfills and #edgebond materials significantly improve #solder joint reliability, tested under rigorous real-world conditions. For information about our showcased solutions at the event, visit here: https://lnkd.in/g8ACSrvB

We are very excited to announce that our experts are presenting 3 technical papers on the latest innovations for Printed Circuit Board (PCB) and IC substrate production at the IMPACT Conference, October 22-25, co-located with the TPCA Show in Taipei, Taiwan.   Gain valuable insights into the latest solutions for enhancing the performance of high-density circuit board designs, ensuring the highest levels of PCB fabrication quality, and improving advanced IC Substrate efficiency.   Carmichael Gugliotti, Product Manager for Primary Metallization, will present ‘Advanced Viafill Reliability Using Direct Metallization Technology’ on October 23, at 17:30.   Frank Xu, Ph.D. Xu, Global Product Manager – Final Finishes, will discuss ‘The Impact of Recent Revisions of ENEPIG Specification - IPC 4556A’ on October 24 at 16:45.   Saminda Dharmarathna, R&D Line of Business Partner – IC Substrates, will present the ‘Advanced Electroplating Processes for IC Substrates – Redistribution Layer and Embedded Trenches’ on October 25 at 11:30.   Connect with our technical experts to learn how our range of high reliability, and high-performance solutions combined with our deep expertise throughout the electronics supply chain make us the solutions supplier of choice for PCB and IC Substrate manufacturers.   For more information and to register for the event please visit: https://lnkd.in/ejSktbRg   #tpca #impact2024 #printedcircuitboard #icsubstrates #directmetallization #finalfinishes