MacDermid Alpha Electronics Solutions

Introducing a better way to stay connected with our new Life Pages! Our solutions can be found at every level of electronics manufacturing, from wafer fabrication to final device assembly and complemented by smart surface films and in-mold electronics solutions. That’s why we've created a seamless experience to showcase our latest technology advancements and industry trends. Stay up-to-date on news and connect with our experts in your preferred segment of electronics manufacturing: Circuitry Solutions: https://lnkd.in/eC6-gYwa Semiconductor Assembly: https://lnkd.in/e6VwA2Na Wafer Level Packaging: https://lnkd.in/e-FbbcWP Circuit Board Assembly: https://lnkd.in/eskBryX7 Film & Smart Surfaces: https://lnkd.in/eB5tk-qS Explore our Life Pages and discover how our comprehensive solutions are revolutionizing the #electronics manufacturing industry! #PCB #Circuitry #PCBassembly #WaferLevelPackaging #Semiconductor #Assembly #CircuitBoardAssembly #SmartSurfaces #InMoldElectronics #ElectronicsManufacturing

Our very own Regional Product Manager, Ebad Rehman, was featured on the 'Reliability Matters' podcast, hosted by Mike Konrad As the demand for durable and reliable electronics continues to grow, the selection of soldering materials—especially solder paste—plays a crucial role in ensuring the performance and longevity of electronic devices. In this episode, Ebad shares valuable insights on the latest advancements and best practices in soldering material technology. Whether you're a seasoned engineer or just starting in the electronic assembly industry, this conversation is packed with knowledge that can help you make informed decisions to enhance the reliability of your electronic assemblies. Don’t miss out on this opportunity to dive into the critical intersection of materials science and electronics reliability. Watch it here: https://lnkd.in/e8dBg26n #Podcast #Electronics #Soldering #MacDermidAlpha #MaterialsScience #Reliability #Innovation #Engineering

The rapid development of advanced technologies including artificial intelligence (#AI) is driving the need for increased performance, reliability, and functionality in electronic devices. This is leading to increasing miniaturization and circuit density in Printed Circuit Boards (PCBs) and IC Substrates. #PCB and IC Substrate manufacturers are looking for solutions that enhance reliability and performance for these complex, high-density applications.     Connect with our experts at the TPCA Show to discover how our advanced specialty chemistries and materials meet the challenges of today’s complex PCB and IC Substrate designs, enabling next generation technologies.     Visit us at booth #K615, Pavilion 1F from October 23-25 in Taipei, Taiwan. Discuss with our experts how our innovative chemistries including metallization solutions for advanced redistribution line (RDL) via fill and fine line plating, direct metallization and our conformal copper plating technologies are empowering AI and future technologies.    For more information on the event please visit: https://lnkd.in/ec8ww6AB   #tpca #impact2024 #printedcircuitboard #icsubstrates #artificialintelligence #electronicsmanufacturing

One major goal for EV powertrain engineers is to achieve peak performance of their automotive electronics, even under extreme conditions. That’s where our advanced solder alloy comes in! In harsh automotive environments, where electronic components are subject to high vibration and cyclical temperatures, Innolot® MXE is the choice #solderalloy for improving thermomechanical reliability. This next-generation alloy provides superior thermal cycling performance from temperatures of -40⁰C to 150⁰C, making it ideal for applications with continuous operating temperatures above 125⁰C. Innolot MXE significantly increases the characteristic life of solder joints in harsher test conditions and outperforms conventional high reliability alloys in industry standard testing. Are you looking to enhance the performance of your critical EV electronics? Visit us at the Battery Show in Detroit, Michigan from October 7-10 at booth 1422 to discover how Innolot MXE can be the ideal candidate for your next high reliability application!

Is it the end of "piano black" for automotive interiors? Highly durable gloss black surfaces have been the mainstay of vehicle dashboards and controls for decades, but today's interiors are getting smarter, with growing levels of interactivity in terms of touch control and illumination. As the smart surfaces in a vehicle expand in area and location as well as interactivity there is a desire for a gentler, more sophisticated, driver and passenger experience; one with a smooth touch and a premium matt appearance. Introducing XtraForm 3D Matt, our low-gloss, formable, hardcoated polycarbonate film based on the proven XtraForm film range and suitable for smart surface manufacturing with existing film insert molding processes. XtraForm 3D Matt is now available for integration into a wide range of automotive interior functional and trim components, including dashboards, door panels, steering wheels, and center consoles. For more information, please visit: https://lnkd.in/etzCFU6r   #XtraForm #HardcoatedFilms #FlexibleInks #MacDermidAlpha #MacDermidAlphaElectronicsSolutions #IME #InMoldElectronics #PowerYourDesign #AutomotiveDisplays #AutomotiveInteriors 

Discover our cutting-edge technologies designed to enhance the reliability and performance of today’s advanced semiconductor applications at the @International Microelectronics Assembly and Packaging Society (IMAPS) International Symposium on Microelectronics.     We’re excited to announce our experts will present three papers on the latest innovations in semiconductor packaging at the symposium:    Pingping Ye, Senior R&D Scientist, will explore the intricate evolution of copper (Cu) microstructure, focusing on grain growth in the paper ‘Metastable Fine Grain Cu for Hybrid Bonding Applications’ on October 1 during the Interconnection Materials/Wirebonds and other Interconnect Materials session.    Don’t miss Stephen Lombardo, R&D Chemist – Wafer Level Packaging, discuss two of the latest barrier technologies for semiconductor packages in his paper, ‘Boric acid-free Nickel Barrier and NiFe Alternative Barrier’ during the Innovative Materials for Integration Assembly Session on October 3.    Harshul Khanna, Ph.D., R&D Scientist, will discuss the importance of precisely controlling copper grain size and orientation within vias for ensuring integrated circuit reliability in semiconductor manufacturing in the paper ‘Exploring the Engineering of Copper Grains to Electroplate Bamboo-Like Structures and Foster Cu (111) Oriented Films in Pursuit of Enhanced Device Reliability’. The presentation will take place on October 3 during the Substrate Integration and Reliability session.    For more information on the IMAPS Symposium on Microelectronics and to register please visit: https://lnkd.in/eaKxbQuu   #IMAPS2024 #IMAPSBoston #semiconductorpackaging #semiconductormanufacturing

We are pleased to announce that Canyon Graphics Corporation are now certified XMAPP Applicators! Canyon Graphics successfully passed all audits and have fulfilled the requirements to become XMAPP approved. Market Expansion through XMAPP Partner Collaboration: Canyon Graphics have proven themselves to be a strong XMAPP Certified Partner for automotive interior parts using XtraForm products and XMAPP Technology. Our collaborative efforts have proven that together we can enhance the design, engineering, and sourcing of interior smart surfaces in automotive supply chains. Our combined success is evidence that we can fulfil the desires of design and styling and satisfy the rigorous engineering requirements, while delivering the highest levels of quality and performance. What is XMAPP? XMAPP is our quality system and technology program for automotive applicators using the XtraForm® range of products and processes. XMAPP helps tackle the challenges in developing and manufacturing high-performance parts by collaborating with all suppliers in one successful supply chain. This proactive approach to assessing risk and identifying any issues within supply chains gives automotive OEMs the confidence that the same product quality and consistent processes are available worldwide. About Canyon Graphics: Canyon Graphics, Inc. are a fully integrated FIM supplier, printing, forming, trimming, and injection molding all under one roof in San Diego, California. These services are provided to leading customers all over the world. Canyon Graphic’s mission is to lead the custom manufacturing industry in exceeding our customer’s expectations for quality, service and delivery by providing innovative engineering solutions for product identification, fabrication of components and related products. www.canyongraphics.com #HardcoatedFilms #FlexibleInks #MacDermidAlpha #MacDermidAlphaElectronicsSolutions #IME #InMoldElectronics #PowerYourDesign #AutomotiveDisplays #AutomotiveInteriors *Personnel shown in image from left to right: Nathan Breneman - Managing Director - Canyon Graphics Rob Gilman - Engineering Manager - Canyon Graphics Neil Bolding - Technical Manager - MacDermid Alpha

Today is the last day for our showcase at SMTA Guadalajara! Visit us at booth #733 and see how our innovative technologies redefine performance and reliability.       What Sets Us Apart?    Our next-gen high-reliability, ALPHA® CVP-390V Innolot® MXE Solder Paste enhances thermal cycling, vibration and drop shock performance, while delivering superior electrochemical reliability, extending system life in the most extreme conditions.    Our Electrolube® 2K301P Conformal Coating provides resin-like durability with increased thickness, better edge coverage, and flexibility, ensuring advanced protection in harsh environments.    Our extensive portfolio of Thermal Interface Materials meets a wide range of thermal management needs. From managing power density and bridging air gaps to offering flexible application options, we've got you covered!    Connect with our experts at the event to learn more about our innovative solutions. For more information about our featured solutions, visit here: https://lnkd.in/etQ55qQS

Exciting times ahead at Productronica India 2024! We are thrilled to announce that our experts will be featured at two key discussions during Productronica India: Join Ravi Bhatkal, Ph.D., Managing Director for India, as he participates in a pivotal panel discussion titled “The Great Leap Forward on Component Manufacturing: Accessing Global Markets Through Scale and Deep Manufacturing” at the ELCINA CEO Forum. This session will delve into strategies for scaling and localizing component production as India’s electronics manufacturing ecosystem advances. Date: September 12, 2024 Time: 12:45 PM – 1:45 PM Location: Hall No. 2, India Expo Mart (IEML), Greater Noida Don’t miss Richard Puthota, Senior Director of Business Development, at the round table discussion on “Way Forward for PCB Manufacturing – Short Term vs Long Term Strategy” at the India PCB Tech Conference. This talk will address strategies for growth in India's burgeoning PCB sector amid rising demand and technological advancements. Date: September 12, 2024 Time: 3:30 PM – 4:15 PM Location: Hall No. 2, India Expo Mart (IEML), Greater Noida These sessions are excellent opportunities to gain insights and engage with thought leaders on the future of electronics manufacturing and PCB production. For more details about the event, visit: https://lnkd.in/ePyMxRzi We look forward to seeing you there! #ProductronicaIndia2024 #ElectronicsManufacturing #PCBManufacturing #MacDermidAlpha

Connect with us at SEMICON 2024 and explore high performing materials for Sintering and Die Attach, Surface Mount, and Wave Soldering applications. Our breadth of products includes Silver Sinter Technologies, Solder Paste, Solder Preforms, Underfills and Edgebond, Soldering Alloys, Liquid Soldering Flux, Cored Wire, Surface Mount Adhesives, Electronic Cleaners, and Stencils. Our Electrolube® brand products provide top-tier chemical #solutions for #electronics, #automotive, industrial, and LED sectors. Those products include: Argomax®: Sinter Silver Sintering Paste for Die Attachment ATROX®: conductive die attach pastes designed to provide you with superior performance for today's stringent reliability requirements. 𝗣𝗿𝗲-𝗿𝗲𝗴𝗶𝘀𝘁𝗲𝗿 𝗻𝗼𝘄 𝗮𝗻𝗱 𝗴𝗲𝘁 𝘆𝗼𝘂𝗿 𝗲-𝗯𝗮𝗱𝗴𝗲: https://lnkd.in/g3JsT7f2 📍 SEMICON 𝗜𝗻𝗱𝗶𝗮, 𝗦𝗲𝗽𝘁𝗲𝗺𝗯𝗲𝗿 𝟭𝟭-𝟭𝟮-𝟭𝟯, 𝟮𝟬𝟮𝟰, 𝗮𝘁 𝗜𝗻𝗱𝗶𝗮 𝗘𝘅𝗽𝗼 𝗠𝗮𝗿𝘁 (𝗜𝗘𝗠𝗟), 𝗚𝗿𝗲𝗮𝘁𝗲𝗿 𝗡𝗼𝗶𝗱𝗮. Ravi Bhatkal | Richard Puthota | Emmanuel David | Parduman Salaria | Rajeshwar A. | Shriniwas Verma | SHARAN Aiyappa | Electronic Industries Association of India-ELCINA | IPCA Indian Printed Circuit Association | Indian Institute of Semiconductor & Electronics Education | India Cellular & Electronics Association (ICEA)