MacDermid Alpha Electronics Solutions

Introducing a better way to stay connected with our new Life Pages! Our solutions can be found at every level of electronics manufacturing, from wafer fabrication to final device assembly and complemented by smart surface films and in-mold electronics solutions. That’s why we've created a seamless experience to showcase our latest technology advancements and industry trends. Stay up-to-date on news and connect with our experts in your preferred segment of electronics manufacturing: Circuitry Solutions: https://lnkd.in/eC6-gYwa Semiconductor Assembly: https://lnkd.in/e6VwA2Na Wafer Level Packaging: https://lnkd.in/e-FbbcWP Circuit Board Assembly: https://lnkd.in/eskBryX7 Film & Smart Surfaces: https://lnkd.in/eB5tk-qS Explore our Life Pages and discover how our comprehensive solutions are revolutionizing the #electronics manufacturing industry! #PCB #Circuitry #PCBassembly #WaferLevelPackaging #Semiconductor #Assembly #CircuitBoardAssembly #SmartSurfaces #InMoldElectronics #ElectronicsManufacturing

We are very excited to announce that our experts are presenting 3 technical papers on the latest innovations for Printed Circuit Board (PCB) and IC substrate production at the IMPACT Conference, October 22-25, co-located with the TPCA Show in Taipei, Taiwan.   Gain valuable insights into the latest solutions for enhancing the performance of high-density circuit board designs, ensuring the highest levels of PCB fabrication quality, and improving advanced IC Substrate efficiency.   Carmichael Gugliotti, Product Manager for Primary Metallization, will present ‘Advanced Viafill Reliability Using Direct Metallization Technology’ on October 23, at 17:30.   Frank Xu, Ph.D. Xu, Global Product Manager – Final Finishes, will discuss ‘The Impact of Recent Revisions of ENEPIG Specification - IPC 4556A’ on October 24 at 16:45.   Saminda Dharmarathna, R&D Line of Business Partner – IC Substrates, will present the ‘Advanced Electroplating Processes for IC Substrates – Redistribution Layer and Embedded Trenches’ on October 25 at 11:30.   Connect with our technical experts to learn how our range of high reliability, and high-performance solutions combined with our deep expertise throughout the electronics supply chain make us the solutions supplier of choice for PCB and IC Substrate manufacturers.   For more information and to register for the event please visit: https://lnkd.in/ejSktbRg   #tpca #impact2024 #printedcircuitboard #icsubstrates #directmetallization #finalfinishes

It’s not too late to connect with us at booth 1422 at the #EVTech and #BatteryShow in Detroit Michigan! Learn about how we’re shaping the future of power #electronics with our Pressure-Sintered Argomax® and TrueHeight™ technologies. Innovations that enhance production processes are at the core of our commitment.     See you at the show!

It’s day one of The Battery Show & EV Tech Expo and our experts are ready to connect at booth 1422! Talk to us about our engineered Preforms & Alloys portfolio which is designed to meet the toughest challenges in #powerelectronics: 🔹 TrueHeight™: Achieve industry-leading bondline control for superior consistency and reliability. 🔹 PowerBond™: Leverage patented SnSb high-temperature alloys for extreme durability in demanding applications. 🔹 AccuFlux™: Our proprietary high-activity flux technology ensures optimal wetting and void control for preforms. Whether you're advancing in #automotive, or energy storage, our solutions deliver unmatched performance. Visit us to learn how we can help power your innovation. For more details about the show & how to register as an attendee, visit here: https://lnkd.in/e5ihjyxg

As the demand for electric vehicles grows, so does the challenge of managing heat in critical components like inverters, converters, and on-board chargers. Our Electrolube® Thermal Interface Materials (TIMs) provide an effective solution for heat removal for all of those key components. They optimize heat transfer; respectively maintaining switching efficiency, expanding component lifespan, and supporting charging reliability. The Electrolube® TIMs portfolio includes thermally conductive gap filling pads, one-part thermal gels, and thin dielectric sheets; which cover all those heat transfer requirements. Coupled with our integrated solutions for connecting and protecting, they deliver optimal performance and reliability to address the needs of modern #automotive #powertrain #electronics. Ready to take the next step for thermal management of your #EV powertrain components? Connect with our experts at The Battery Show in Detroit, Michigan from October 7-10 in booth 1422 to discover how our products can help you maximize heat dissipation in your automotive electronics. For more information, about our Electrolube® Thermal Interface Materials, visit here: https://lnkd.in/ecjJde22

A proven solution for improving the reliability & power of an EV motor is to remove excess heat by filling the air gap with a potting resin. The benefits? Potentially increasing the motor life & improved power density. Studies show that for every 10 degrees Celsius reduction in stator temperature, the motor lifespan doubles. They also show that filling the stator housing improves output by up to 30%, from the same sized motor. Our Electrolube® Potting Compounds are well suited in this application. Our materials have longer cure times, with thermally conductive particles which flow easily between the windings, optimizing component filling. These advantages can help designers achieve their reliability & power improvement goals. Ready to take the next step in improving EV motor thermal management? Connect with us at The Battery Show in Detroit Michigan from October 7-10 in booth 1422 to discover how our Electrolube® Potting Compounds can be the ideal candidate for your high reliability EV motor application! For more info about the show visit here: https://lnkd.in/erFckbWt

How do you protect PCBs in harsh environments?    In high-reliability automotive electronics, failure is simply not an option.     In the #electronics industry, electrochemical migration is a growing challenge, particularly as the space between components shrink and operational environments become more demanding. With the increasing need for long-term reliability, there is a greater focus on ensuring the comprehensive coating coverage of components, especially on sharp edges and component leads.    That’s why we developed Electrolube® 2K301P, a #conformalcoating designed to provide enhanced protection, even in harsh operating conditions. The soft, flexible hydrophobic coating provides excellent resistance to humidity and condensation. Also, with weight reduction being a key design consideration, 2K301P offers a lighter alternative compared to traditional resins.    Ready to take your electronics protection to the next level? Visit us at The Battery Show in Detroit, Michigan from October 7-10 at booth 1422 to discover how Electrolube 2K301P can be the ideal candidate for your high-reliability applications.    For more information on this innovative solution, click here: https://lnkd.in/gRmXmzgG

Our very own Regional Product Manager, Ebad Rehman, was featured on the 'Reliability Matters' podcast, hosted by Mike Konrad As the demand for durable and reliable electronics continues to grow, the selection of soldering materials—especially solder paste—plays a crucial role in ensuring the performance and longevity of electronic devices. In this episode, Ebad shares valuable insights on the latest advancements and best practices in soldering material technology. Whether you're a seasoned engineer or just starting in the electronic assembly industry, this conversation is packed with knowledge that can help you make informed decisions to enhance the reliability of your electronic assemblies. Don’t miss out on this opportunity to dive into the critical intersection of materials science and electronics reliability. Watch it here: https://lnkd.in/e8dBg26n #Podcast #Electronics #Soldering #MacDermidAlpha #MaterialsScience #Reliability #Innovation #Engineering

The rapid development of advanced technologies including artificial intelligence (#AI) is driving the need for increased performance, reliability, and functionality in electronic devices. This is leading to increasing miniaturization and circuit density in Printed Circuit Boards (PCBs) and IC Substrates. #PCB and IC Substrate manufacturers are looking for solutions that enhance reliability and performance for these complex, high-density applications.     Connect with our experts at the TPCA Show to discover how our advanced specialty chemistries and materials meet the challenges of today’s complex PCB and IC Substrate designs, enabling next generation technologies.     Visit us at booth #K615, Pavilion 1F from October 23-25 in Taipei, Taiwan. Discuss with our experts how our innovative chemistries including metallization solutions for advanced redistribution line (RDL) via fill and fine line plating, direct metallization and our conformal copper plating technologies are empowering AI and future technologies.    For more information on the event please visit: https://lnkd.in/ec8ww6AB   #tpca #impact2024 #printedcircuitboard #icsubstrates #artificialintelligence #electronicsmanufacturing

One major goal for EV powertrain engineers is to achieve peak performance of their automotive electronics, even under extreme conditions. That’s where our advanced solder alloy comes in! In harsh automotive environments, where electronic components are subject to high vibration and cyclical temperatures, Innolot® MXE is the choice #solderalloy for improving thermomechanical reliability. This next-generation alloy provides superior thermal cycling performance from temperatures of -40⁰C to 150⁰C, making it ideal for applications with continuous operating temperatures above 125⁰C. Innolot MXE significantly increases the characteristic life of solder joints in harsher test conditions and outperforms conventional high reliability alloys in industry standard testing. Are you looking to enhance the performance of your critical EV electronics? Visit us at the Battery Show in Detroit, Michigan from October 7-10 at booth 1422 to discover how Innolot MXE can be the ideal candidate for your next high reliability application!