Mosaic Microsystems

Dr. Shelby F. Nelson is leading the charge in microelectronics innovation! Shelby has just been honored as the 2024 Entrepreneur of the Year by the Rochester Section of the American Chemical Society. This prestigious award celebrates her trailblazing work in co-founding Mosaic Microsystems and advancing glass packaging technologies essential for #microelectronics and #photonic chip integration. Mosaic’s proprietary glass handling technology allows temporary bonding of thin, flexible glass to a rigid handle wafer, to enable high-yield manufacturing of electrical and optical traces and circuits, leveraging industry standard processes normally used for silicon. This technology works with glass even below 100 microns thick. Mosaic wants engineers who are involved in RF, computing, integrated photonics, and biomedical devices to know the benefits of glass for advanced semiconductor packaging. Glass can be thought of as a very high-performance printed circuit board (PCB) -- enabling cutting-edge applications to meet their challenging targets. Mosaic’s early understanding of the value of glass has been underscored by recent announcements by companies like Intel and Samsung of a drive to incorporate glass in their advanced packaging. Mosaic’s special expertise is in the production of thin glass packaging solutions, with successful (high yield) handling of the floppy and transparent material through the many steps required to produce finished packages.                                Mosaic is prototyping thin glass with multi-layer interconnects, along with copper-filled through-glass vias connecting front to back of the glass, and is rapidly moving these to production for both defense and commercial industries.

Shelby F. Nelson is #hiring. Know anyone who might be interested?

We're #hiring a new Senior R&D Project Manager in Rochester, New York Metropolitan Area. Apply today or share this post with your network.

Read why industry-leading researchers at Yole Group conclude: "Glass core substrates represent a promising frontier for advanced IC substrates and advanced packaging in general." Mosaic Microsystems is one of the leaders paving the way for the adoption of Glass Core Substrate for HPC with our proprietary glass handling process. https://lnkd.in/g5SyQ7R6

Advanced packaging for microelectronics in glass is now available -substrates & interposers with TGV and RDL. Let's talk at IMS June 18-20 about how your packaging design can be realized. 

Mosaic Microsystems announces strategic hire: Andrew Garland joins as Sr. Process Engineer to drive Next-Gen Glass Interposer Packaging Solutions. Mosaic Microsystems, a leader in the field of microelectronic glass packaging solutions using glass substrate, announced today the addition of Andrew Garland to its engineering team as a process engineer. With a rich background in image sensor package design and assembly engineering, Andrew brings a wealth of experience and a proven track record of driving technological advancements, process improvement, and leadership to Mosaic Microsystems. Mr. Garland’s most recent efforts have been in the field of wafer-level chip-scale package (WLCSP) design, carrying designs from concept to qualification. This includes work that has resulted in two pending patents for novel WLCSP design. Andrew also brings along prior production experience, where he managed engineering activities for package assembly. “Andrew is a great addition to the production team,” said Brian Harding, Senior Production Manager at Mosaic. “His process engineering experience in the area of backend assembly will be vital as we scale and expand our current product offerings.” About Mosaic Microsystems: Mosaic Microsystems is a leading provider in microelectronics and photonics packaging solutions, specializing in the advancement of glass interposers. With a dedicated focus on maintaining their industry lead, Mosaic Microsystems pioneers' technologies that are driving forward ultra-high I/O pitch density applications. These applications include but are not limited to AI high-performance computing, high bandwidth memory (HBM), opto-electronics based computing, and mm-wave radio frequency (RF) devices. Beyond high-end applications, Mosaic Microsystems' expertise extends to facilitating low-cost packaging solutions for a diverse array of industries, including micro-electromechanical systems (MEMS), sensors, power, and analog devices, among others. For more information, please visit www.mosaicmicro.com.

Glass has excellent electrical and mechanical properties for advanced electronic packaging, and even photonics applications.     Glass wafers, with a large bulk resistance, low moisture sensitivity, and dimensional stability, have properties that allow them to be inserted in many of the processes typically used for silicon, and also allow advantaged performance in some applications, especially those involving high frequency. Thin glass is required to keep latency low, and form-factor contained. In this presentation, we will describe the capability to produce void-free, hermetic, copper-filled vias, ranging in aspect ratio from 2:1 to 8:1. Shelby F. Nelson will also describe progress in multilayer metallization of thin glass interposers. 

Medical electronics benefits with Glass for advanced electronic packaging.   Many of the properties that make glass ideal for electronics applications lead to bio-compatibility: environmental resistance, inertness in aqueous environments, and chemical stability.  Through glass vias (TGV) allow complex and densely patterned electrical connections through a glass substrate. TGV hermeticity have demonstrated hermeticity in 100 mm thick glass containing over 10,000 vias, after annealing as high as 450 °C.  Mosaic’s proprietary bonding technology which allows processing of thin (<200um) glass substrates. Glass lends itself to micromachining, to create fluidic structures along with electrical circuitry. Joshua Roys, PhD will show examples of mixed fluidic and electronic structures, illustrating the use of Mosaic's temporary bonding approach, combined with permanent bonding technologies, to produce complex internal cavity glass structures. 

Designing Considerations for Thin Glass high performance interposers.     Thin glass with low loss-tangent, low surface roughness enabling fine line lithography, and dielectric properties that do not change with humidity are required to keep signal lines short, and form-factor contained. Building on existing competence in precision, custom through-glass vias, and in-house metallization for via-fill, Brittany Hedrick will explore five layers of redistribution layer (3 on one side, and 2 on the other) are explored in order to fabricate thin glass interposers that can accommodate a relatively high density of interconnects. 

Learn about the 5-part recruiting strategy Mosaic Microsystems uses to overcome talent shortages in this guest post for 3D Incites, written by Mosaic Co-Founder and President, Paul Ballentine. https://bit.ly/3OU9Kes