Resonac

Hidenori Abe, Executive Director of the Electronics Business Headquarters at Resonac, delivered a presentation at the "Advanced Semiconductor Packaging & Chiplet Show" held in South Korea from August 28 to 30. This B2B event showcases cutting-edge semiconductor packaging technology to leaders in the electronics, semiconductor, and automotive electronics industries.   He took the stage over the course of two days, covering the topics "Semiconductor Materials Innovation through Packaging Co-Creation Activities" and "Promoting Consortium (JOINT2) Activities for Advanced Packaging Technology." Abe introduced the consortium JOINT2, which he is spearheading, and emphasized the importance of co-creation with other companies. He also explained that Resonac focuses on 2.xD/3D packaging and chiplet technologies and continues to develop new materials for improving the performance of semiconductor through co-creation activities.   This event was a fantastic opportunity to showcase Resonac's initiatives and innovations in the semiconductor field.   He is also leading the establishment of the next-generation semiconductor packaging consortium "US-JOINT," involving ten companies from Japan and the United States in Silicon Valley. For more details, click here. https://lnkd.in/gi6m5TjS #semiconductor #event #resonac

On July 25th, 池内 孝敏(Takatoshi Ikeuchi), General Manager, Electronics R&D Center, Electronics Business Headquarters, delivered a presentation at IPC IEMI 2024 held in Malaysia. The presentation theme was "Advanced Packaging/Substrate Materials and Open Innovation Platform." It was a very good opportunity to present and share our insights at this prestigious event.   He introduced our projects in the United States, such as "US-JOINT" and TIE, and emphasized that Resonac is promoting co-creation overseas as a leading company in semiconductor packaging materials, aiming to expedite the research and development of next-generation semiconductors. For more details about "US-JOINT," please check here! https://lnkd.in/gi6m5TjS

Resonac has released the video of our July 8th press conference with English subtitles. 🎥✨ Hidenori Abe, Executive Director of the Electronics Business Headquarters, took the stage to explain the vision and goals of US-JOINT. In Japan, the event was widely covered by various media outlets, including TV, newspapers, and web media. Don't miss out—watch the video now to get all the insights!          #USJOINT #Semiconductors https://lnkd.in/giH5vdfV

On July 17th, Koichi Wakata , a former astronaut with JAXA, visited our research hub "Stage for Co-Creation" in Yokohama City. 🚀 Many employees, including our CTO Fukushima, participated in the discussion. He visited Resonac following the selection of our research proposal on a heat storage and utilization system for the lunar surface by JAXA. This proposal was born out of the activities of our "REBLUC" community, a group of members who have come together to put Resonac’s purpose, "Change society through the power of chemistry," into practice. https://lnkd.in/gEpDcf5w #JAXA #Resonac #Innovation

7/17（水）～7/19（金）にて開催中の #人とくるまのテクノロジー展NAGOYA に出展しています。ブースでは #カーボンニュートラル へ貢献する製品技術を中心に展示しております。ぜひこの機会にお立ち寄りください。 会場：Aichi Sky Expo ホールF-3 小間番号153

真岡 朋光, our CSO/CRO of Resonac, delivered a lecture on "Introduction to Semiconductor Strategy" at the University of Tokyo, his alma mater, on July 16th.🎓   This lecture was part of the Semiconductor Education Program for Interdisciplinary Research and Innovation (SPIRIT) at the University of Tokyo. The program included lectures from leading executives in the semiconductor industry, focusing on strategies and industry insights. He had the privilege of speaking on the program's final day.   During the lecture, he discussed Resonac's initiatives in the semiconductor materials business and the innovative product development enabled by computational information science. Several universities, including the University of Tokyo, have begun efforts to cultivate highly skilled talents in the semiconductor field. We hope that this lecture will contribute to expanding knowledge in the semiconductor industry and spark further interest. If you are passionate about innovation and making a difference, we invite you to explore the exciting opportunities at Resonac. Let's build a brighter future together! 🚀 #TheUniversityofTokyo #University #Semiconductor #education

#Resonac is thrilled to announce that we have received the 🥈 Silver Ring Award at the "Psychological Safety AWARD 2024" (organized by ZENTech, Inc., a psychological safety professional headquartered in Tokyo), which recognized our commitment to fostering psychological safety within teams and organizations!   Through our "Co-creative Collaboration Enhancement Training," we have made a significant impact on creation of workplace environment that prioritizes psychological safety. This training program focuses on co-creation, inclusivity, and development of essential five skills for constructive discussions, namely psychological safety, elimination of unconscious bias, active listening, effective communication, and facilitation skills. Over 90% of our managers, about 1,300 individuals, have successfully completed the training. To assess the program's effectiveness and assess whether those managers enable their teams to exert the five essential skills mentioned above, we conducted 360-degree assessment before and after the workshop. About 70% of participants demonstrated behavioral changes and notable improvements in their teams' ability to apply these skills. 🌟   We are immensely proud of this achievement and will continue fostering psychological safety within our organization and beyond. Thank you to everyone who has supported us on this incredible journey! 🚀   #PsychologicalSafety #award #WorkplaceCulture #TeamSuccess

At the ongoing SEMICON WEST event in San Francisco, Hidenori Abe(Hidenori Abe),Executive Director, was interviewed by US media about the recently announced launch of "US-JOINT." 🚀✨ Several companies participating in US-JOINT are also exhibiting at SEMICON WEST! For more details about "US-JOINT," click here! https://lnkd.in/gXMKUUcy #SEMICONWEST #USJOINT #Electronics #TechNews #SanFrancisco #Semiconductors

Yesterday, we held a press conference to announce the establishment of "US-JOINT," a next-generation semiconductor packaging R&D consortium consisting of 10 American and Japanese companies. From our company, Hidenori Abe (Hidenori Abe), Executive Director of the Electronics Business Headquarters, took the stage and passionately explained the vision and goals of the consortium. At the press conference, we had many attendees and successfully attracted their significant attention. 📸✨ Please look forward to this new challenge towards next-generation technological innovation! 🚀 For more details, please see here. #USJOINT #Semiconductors #TechInnovation #NextGenTech #CoCreation

Resonac has established the next-generation semiconductor packaging R&D consortium "US-JOINT" in Silicon Valley, USA, consisting of 10 Japanese and American companies. In next-generation semiconductors for generative AI and autonomous driving, packaging technology is crucial. US-JOINT will closely collaborate with major IT companies and semiconductor manufacturers concentrated in Silicon Valley to verify the latest concepts and accelerate technology development in response to market needs. For more details about the consortium and participating companies, please click here! https://lnkd.in/gZbHyy-b #Semiconductors #NextGenTechnology #SiliconValley #USJOINT #CoCreation