U.S. Tech Global

Seika to Host PCBA Depaneling Webinar: TORRANCE, CA — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, is pleased to announce its upcoming PCBA Depaneling Webinar titled “Complete the SMT Process with the Appropriate Depaneling Method.” The webinar will take place on Wednesday, November 6, 2024 at 10 a.m.PST, and will be presented by Max Bernard and Steven Yukutake, product managers at Seika Machinery. Register now to join this informative session: Webinar Registration. As electronics continue to shrink in size and the global surface-mount technology (SMT) industry evolves, maintaining a clean, high-quality PCBA at the end of the manufacturing process is more critical than ever. The depaneling process—often overlooked—plays a key role in reducing defects such as chip cracks and ensuring the integrity of the final product. This session will provide attendees with valuable insights into common defects, as well as practical methods for improving depaneling processes to minimize production issues. During the webinar, attendees will also learn about Seika Machinery’s Sayaka PCB Routers, which are known for their precision and efficiency in depaneling. These routers are designed to ensure smooth cuts with minimal stress on delicate components, making them an ideal solution for high-reliability applications. Sayaka routers feature advanced cutting technology that reduces vibration, helping to eliminate risks of damage during production while improving product quality and consistency. “Our goal with this webinar is to highlight the importance of selecting the right depaneling method to avoid common production issues and improve product reliability,” said Michelle Ogihara, Executive Vice President at Seika Machinery. “With the right equipment and techniques, manufacturers can ensure a smooth end-to-end SMT process.” Don’t miss this opportunity to learn from industry experts and discover new strategies to optimize your depaneling process. For more information, contact Michelle Ogihara at 310-540-7310; e-mail michelle@seikausa.com; or visit www.seikausa.com. http://dlvr.it/TFZdPh

TA to Present Advanced SMT Squeegees: See Transition Automation at SMTAI, Booth 2458   TYNGSBORO, MA — Transition Automation, Inc. will exhibit a full range of high-performance Permalex Squeegee Blades and Holder Systems at Stand #2458 during SMTA International in Rosemont, IL from October 22-24, 2024. Transition Automation, Inc. is a worldwide leader in the manufacturing and sales of Permalex® Edge Metal Squeegees, holder systems, and advanced SMT printing systems. Founded in 1989, Transition Automation, Inc. is the first company to propose using metal squeegees for SMT when all SMT printers at the time used Polyurethane blades. Transition Automation remains the only company with a singular focus on high-performance metal squeegee blades and holder systems. Permalex brand squeegees incorporate a polymer infusion and are used by many top-tier electronics manufacturers – especially those companies who supply to high-value, mission-critical end markets, such as Space and Satellite, Automotive, Avionics and Industrial Controls. Transition Automation, Inc. is located at 5 Trader Circle, Building D, Tyngsboro, MA 01879 USA; Phone: 978-649-2400; Fax 978649-2402, Web: www.metalsqueegees.com   http://dlvr.it/TFZdPW

AIM to Highlight NC259FPA at SMTA Tampa Bay: CRANSTON, RI — AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Tampa Bay Expo & Tech Forum taking place on November 12 at the Largo Event Center in Largo, Florida. Among other great products, AIM will be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste. NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer. To learn more about NC259FPA and to discover all of AIM’s products and services, visit the company at the SMTA Tampa Bay Expo & Tech Forum on November 12, or visit www.aimsolder.com http://dlvr.it/TFZdPQ

CE3S Exhibits at SMTA Tampa Bay and Space Coast: HARRISBURG, PA ― Cumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is excited to announce its participation in both the SMTA Tampa Bay Expo on November 12, 2024, and the SMTA Space Coast Expo on November 14, 2024. As a leading strategic sourcing and distribution partner, CE3S will showcase its innovative supply chain solutions at both events, highlighting how it can serve as a one-stop shop for manufacturers. * SMTA Tampa Bay Expo Date: Tuesday, November 12, 2024 Time: 8:30 AM – 3:00 PM (US Eastern) Location: Largo Event Center, Largo, FL * SMTA Space Coast Expo Date: Thursday, November 14, 2024 Time: 8:30 AM – 6:00 PM (US Eastern) Location: Melbourne Auditorium, Melbourne, FL Amanda Smeltz, Director of Sales, VMI Solutions and Dave Fields, VMI Account Manager can be found at the CE3S booth for both events to discuss how CE3S can provide customized supply chain solutions and strategic account management. Attendees will have the opportunity to learn more about how CE3S offers the convenience of a one-stop shop combined with the personalized attention of a family-owned business. At the SMTA Space Coast Expo, CE3S is proud to sponsor several key components of the event, including the After-Expo Networking Social, Refreshment Break and a Technical Session. Visitors to the CE3S booth at both expos will learn more about its featured solutions: * Vendor Managed Inventory Solutions: Eliminate the hassle of inventory management with tailored services. * Strategic Account Solutions: Access specialized sourcing and supply chain support to streamline operations. * Value-Added Service Solutions: Discover CE3S's repackaging, custom labeling, cable assemblies, laser cutting, kitting, and 3PL services. * Government Solutions: Meet the purchasing needs of federal, state, and local government agencies with specialized programs. CE3S partners with hundreds of reputable manufacturers to offer a wide range of high-quality products tailored to meet diverse industry needs. Beyond its comprehensive product offerings, the CE3S team brings deep expertise in areas such as special project planning, sourcing, inventory management, workstation design, and ESD strategy. “We look forward to connecting with attendees at both the Tampa Bay and Space Coast Expos," said Amanda Smeltz. “Our goal is to help companies solve supply chain challenges by offering strategic sourcing solutions with exceptional service and value.”  For more information about CE3S’s participation at the SMTA Expos or its solutions, visit www.ce3s.com or contact sales@ce3s.com.  http://dlvr.it/TFZdMK

TANAKA to Showcase "TK-SK" Palladium Alloy: See TANAKA at SWTest Asia, Booth 210   TOKYO, JAPAN — TANAKA Kikinzoku Kogyo K.K. (Head office: Chuo-ku, Tokyo; Representative Director & CEO: Koichiro Tanaka), which develops industrial precious metal products as one of the core companies of TANAKA Precious Metals, has announced the development of TK-SK, a palladium alloy designed for probe pins used in the final testing stage (post-processing) of semiconductor packages. This new product will be showcased via a panel display at SWTest Asia 2024, an exhibition scheduled for October 24–25, 2024, in Fukuoka Prefecture, Japan, with samples available for shipping before the end of the year. Key Features of “TK-SK”: 640HV Hardness: This palladium alloy offers maximum hardness of 640HV, making it ideal for use in test socket applications, particularly in the final continuity testing stage (back-end process). TANAKA Kikinzoku Kogyo has manufactured and supplied a range of precious metals for probe pins used in testing equipment in the front-end and back-end processes of semiconductor manufacturing. As a palladium alloy for probe pins, TK-SK exhibits maximum hardness of 640HV that makes it suitable for use in test socket applications mainly in the final continuity testing stage (back-end process). Demand for high-hardness probe pins has increased in recent years. However, one common challenge with harder materials is that they can be more difficult to process and are prone to breaking during machining. Additionally, palladium alloys on the market previously had a maximum hardness of around 560HV. Through its unique processing technology, TANAKA Kikinzoku Kogyo has successfully developed TK-SK with a hardness of 640HV. By 2028, the company aims to ship 1.5 times the volume of its existing products. Pogo pin-type probe pins are typically used in test sockets. During testing, the tip or plunger of the probe pin can become deformed due to friction from contact with substrates. Solder may also adhere to the plungers, needing regular cleaning, which further increases the risk of deformation due to friction. High-hardness probe pins, like TK-SK, reduce wear-related deformation, leading to longer service life and lower maintenance costs for semiconductor test equipment. Looking ahead, TANAKA Kikinzoku Kogyo plans to continue contributing to the development of the semiconductor market, which is expected to experience significant growth in the coming years. TK-SK Properties (Reference Values) Exhibition details * Exhibition name: SWTest Asia 2024 * Dates: October 24 (10:00–15:30) and October 25 (10:00–16:00), 2024 * Venue: Hilton Fukuoka Sea Hawk, Japan * Official website: https://lnkd.in/f7EYBEz * Exhibitor: TANAKA Kikinzoku Kogyo K.K. * Booth No.: 210 * Panel display: Palladium alloy for probe pins (TK-SK wire, TK-FS wire and sheet), copper-silver alloy for… http://dlvr.it/TFTTVc

AIM to Exhibit at SMTA South China Expo: CRANSTON, RI — AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA South China Expo & Tech Forum taking place November 6-7 at the Shenzhen World Exhibition & Convention Center in Shenzhen, China. Among other great products, AIM will be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste. NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer. In addition, AIM Product Manager, Diego Jiang will be giving a presentation titled High Reliability: The Challenges of Soldering for Extremely Harsh Environments: High reliability in electronics pertains to the quality of solder joints themselves as well as the electrochemical properties of the flux residue. Key characteristics of reliable solder joints include strength and ductility. These joints are often tested via thermal cycling, drop shock and more. Exact testing requirements are dependent on application. When it comes to flux, industry standards such as IPC and JIS define the electrochemical requirements of flux residues, which is particularly important in no clean processes. This presentation outlines the trends and challenges of high reliability application sin automotive, military & aerospace, and LED sectors. Test data comparing specially formulated high reliability alloys with SAC305 are presented along with a discussion of how key elements of the alloys aid in improved reliability. To learn more about NC259FPA and to discover all of AIM’s products and services, visit the company at the SMTA South China Expo & Tech Forum November 6-7th, or visit www.aimsolder.com. http://dlvr.it/TFTTVR

RENEX Features Reeco's Innovative Product Lines: See RENEX at SMTAI, Booth 2004 & 2100   WŁOCŁAWEK, POLAND ― RENEX is excited to announce its participation in SMTA International 2024, taking place Oct. 22-24, 2024 at the Donald E. Stephens Convention Center in Rosemont, IL. RENEX will exhibit in collaboration with Thermaltronics at their booth #2004, showcasing two innovative product lines from Reeco: antistatic clothing and ESD modular furniture. The antistatic clothing line also will be available in the Technimark, Inc. Booth #2100. RENEX will present Reeco’s antistatic clothing line, designed to protect electronic components from electrostatic discharge (ESD) while ensuring wearer comfort. This clothing is ideal for electronics manufacturing environments, offering lightweight, breathable fabrics that meet strict ESD compliance standards. With a range of jackets, pants and other apparel, Reeco’s clothing ensures both protection and practicality, making it a perfect solution for maintaining ESD-safe environments.  Alongside the clothing, RENEX will showcase Reeco’s ESD modular furniture, including workbenches specifically designed for ESD-sensitive areas. These benches offer customizable configurations, allowing users to create workspaces tailored to their needs. Each piece of modular furniture is built to meet rigorous ESD standards, ensuring safety and efficiency. With durable materials and ergonomic design, Reeco’s furniture provides not only protection but also enhanced productivity for electronics assembly environments.  “We are excited to present Reeco’s antistatic clothing and modular furniture at SMTA International,” said Robert Beber, Export Manager at RENEX. “These products align with our mission to provide innovative solutions that enhance both safety and efficiency in electronics manufacturing.” Attendees of SMTA International are invited to visit Thermaltronics’ booth to explore these advanced ESD solutions and learn how Reeco’s products can elevate workplace safety and productivity.  Fore more information about RENEX, visit www.renex.pl.  http://dlvr.it/TFTTVB

GÖPEL Introduces Multi Line Inspection Systems: JENA, GERMANY — GÖPEL electronic introduces the new Multi Line product family, an innovative platform of inspection systems that supports the entire manufacturing process. The centerpiece of this solution is a modular base system with a uniform and powerful software interface. This reduces training requirements, enables flexible employee scheduling, and optimizes the exchange of knowledge between production staff. This can be especially important when there may be a shortage of skilled workers. The all-rounder can be configured for all inspection tasks throughout the entire manufacturing process: for solder paste inspection (SPI), for surface mount technology (SMT) and through-hole technology (THT) automated optical inspection (AOI), and also for conformal coat inspection (CCI). For THT printed circuit board assemblies (PCBA), Multi Line provides flexible transport options, with or without carriers, and all the necessary camera modules for this application. It also allows THT solder inspection, even during return on the optional lower transport conveyor.  Thanks to 3D technology, solder joints can be inspected not only for soldering quality and for shorts, but also for solder volume and pin length, without flipping the PCBA. The system's configuration versatility also makes it suitable for use in the SMT process, where optional double-sided inspection offers the advantage of fully testing SMT assemblies without flipping the PCBA. Furthermore, Multi Line is available as an SPI system for the inspection of solder paste deposits in regard to shape, height, area, bridges, volume, X/Y offset, and co-planarity. A closed-loop interface to the solder paste printer is available, and a link to PILOT Verify software makes fault analysis more efficient by displaying associated AOI, AXI, and SPI result data. Multi Line CCI can automatically inspect protective coatings by making fluorescent coatings glow using UV LEDs of different wavelengths. With telecentric optics and a color camera, the system delivers high-contrast images and enables fast programming using CAD data and coating plans. As a special feature, the PCBA can simultaneously inspect both top and bottom without turning, and, if necessary, can also be transported back to the beginning of the line using a lower level return conveyor.  Thanks to the modular design of the Multi Line platform, camera modules can be flexibly combined and, if necessary, retrofitted later for new applications in the manufacturing process. With this comprehensive solution, GÖPEL electronic is utilizing its many years of experience in quality assurance and setting new standards in inspection technology for the electronics manufacturing process. GÖPEL electronic develops and manufactures innovative electrical and optical test, measurement, and inspection equipment for electronic… http://dlvr.it/TFTTTn

Mycronic Acquires Modus High-Tech Electronics: TÄBY, SWEDEN — Mycronic has acquired Modus High-Tech Electronics GmbH, a Dusseldorf-based provider of automated optical inspection systems for electronics volume production.   Modus was founded in 1999, has 18 employees and more than 1,650 scanners and 650 camera systems in service. Net sales in 2023 amounted to 4 MEUR. The company provides solutions for automated optical inspection of coating, soldering, and components within printed circuit board assembly. Modus has also developed solutions for fuel cell inspection.    “Modus’ inspection systems are an integral part of conformal coating production lines, where Mycronic’s High Volume division is a global leader in electronics conformal coating solutions. Together we will be able to offer complete and optimized solutions to our respective customers”, says Ivan Li, Sr VP High Volume at Mycronic.   Mycronic is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic’s headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, Mexico, the Netherlands, Singapore, South Korea, United Kingdom, United States and Vietnam. Mycronic is listed on Nasdaq Stockholm. www.mycronic.com. http://dlvr.it/TFTTTh

Saki Strengthens Presence in India: TOKYO, JAPAN — Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, is pleased to announce its sales partnership agreement with Blue Star Engineering & Electronics Ltd. (Blue Star E&E) for the Indian market. Blue Star E&E will offer technical sales for Saki’s full range of 3D solder paste inspection (SPI), automated optical inspection (AOI), and automated X-ray inspection (AXI) equipment and software solutions to customers. Saki is committed to maintaining its high level of customer service, for which it is well known, and has been very careful to choose the right distribution partners. By selecting highly focused, specialist partners like Blue Star E&E, Saki is able to ensure customers benefit from the same specialist technical knowledge and customer service that they would receive if they came directly to Saki. “Blue Star E&E holds a leading position in the Indian market, providing a comprehensive range of quality assurance and measurement solutions across various industries. Our strategic partnership with Saki enables us to further strengthen our offerings in the PCB Testing and Assembly sector by incorporating advanced inspection technologies such as AOI, AXI, and SPI. This collaboration enables us to deliver comprehensive SMT line solutions tailored to meet the high standards of quality and efficiency that our customers demand”, commented Mr. Nikhil Srivastava, Business Head – PCB Solutions, Blue Star E&E. “Our robust network of local offices and technical support teams across India ensures we are well-positioned to serve the rapidly growing electronics manufacturing sector.” “We recognize the excellent capability of Blue Star E&E’s team, backed by a strong marketing strategy. Despite being a relative newcomer to the SMT business in India, their experienced SMT team have many established connections in this industry. We anticipate a robust future for this organization in the fiercely competitive Indian market,” said Anusorn Wiriyapongpibool, Technical Sales Manager Saki Asia Pacific.  For more information about Saki visit www.sakicorp.com/en/. http://dlvr.it/TFTTQn