Advanced Packaging Lead
Untether AI is building the world’s highest performance, energy-centric AI inference accelerator. We are a rapidly growing Toronto-based startup, with employees across Canada and the US (and even a few outside North America). To help grow our organization we are looking for an Advanced Packaging Lead to collaborate with a bright group of engineers to tackle complex and interesting problems at the intersection of AI and hardware. Responsibilities
- Develop advanced packaging solutions for next generation AI products
- Collaborate with internal stakeholders, product, architecture and design to analyze and propose packaging solutions to improve performance, reliability and manufacturability
- Drive technical decisions, short-term and long-term, on packaging solutions, chiplet strategy and die-to-die interfaces
- Manage and collaborate with external suppliers, foundry and OSAT to propose leading-edge packaging solutions
- Review electrical, thermal, mechanical and feasibility data from suppliers and lead analysis through high volume production
- Resolve quality and integrity issues related to package design
- Drive long term plans to grow internal capabilities and expertise in these areas
- Experience working with 2.5/3D packaging technologies using CoWoS, EMIB or similar
- Experience with chiplets, die-to-die interconnects and designs with stacked memories
- Experience with manufacturing processes, reliability and qualification of advanced packaging designs through production ramp
- Working knowledge of package design tools and failure analysis
- Demonstrated success with designs in advanced technology nodes
- 20 vacation days
- Solid health and extended health benefits from day 1
- Unlimited sick days
- Stock options
- Being part of building chips and software that will change the world
-
Seniority level
Not Applicable -
Employment type
Full-time -
Job function
Information Technology -
Industries
Semiconductor Manufacturing
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