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"...I think by using our hybrid bonding technique, we achieve the kind of connectivity and power efficiency almost like a monolithic solution, but at the same time it allows us to optimize the electronic die and the photonic die separately. I think this is how you get the best of both worlds." - Dr. Kevin Zhang, SVP and Deputy Co-COO of TSMC Tune in for Dr. Ian Cutress' conversation with TSMC on their commitments to next-generation technologies, including #HybridBonding. https://lnkd.in/dfH9ebq7 

Q&A With TSMC on Next-Gen Foundry

Q&A With TSMC on Next-Gen Foundry

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