Ansys Optics’ Post

Check out what's new in #Ansys Optics, and keep an eye out for upcoming webinars from PADT, covering all of the in's and out's of this exciting new release. - #Simulation | #Optics | #SPEOS | #Zemax | #Lumerical | #Ansys2024R2

Explore features of Ansys Electronics Desktop such as optimization, parametrization, 3D Components, and the wrap function when you enroll in this free Ansys Innovation Course.

Explore features of Ansys Electronics Desktop such as optimization, parametrization, 3D Components, and the wrap function when you enroll in this free Ansys Innovation Course.

Empower Your IC Designs with Ansys' Multiphysics Signoff Solutions! Amidst the rapid pace of the modern world, where speed, intelligence, and efficiency in integrated circuits (ICs) are paramount, #Ansys emerges as a pioneering force of innovation. Our #semiconductors solutions propel industries toward their ambitions, providing the cutting-edge technology required for today's challenges. • Signoff with Confidence: With Ansys' #multiphysics Signoff Solutions for 2.5/3D-IC, multi-die, and SOCs eliminate any second thoughts. Confidently sign off on your designs, knowing they have undergone rigorous analysis and met the highest standards of performance and reliability. • Power Integrity at its Best: RedHawk-SC for digital and Totem-SC for analog designs provide impeccable power integrity (EM/IR) analysis and modeling. With these tools, you can ensure the robustness of your designs, leaving no room for power-related surprises. • Thoroughly Analyze Multi-Die Systems: Ansys RedHawk-SC Electrothermal solution offers comprehensive thermal and structural analysis for 2.5D/3D-IC multi-die systems. Now, you can confidently address thermal challenges and optimize the performance of your multi-die designs. • Ensuring Reliability and ESD Protection: With PathFinder-SC, you can easily perform Electrostatic Discharge (ESD) and reliability analysis, safeguarding your ICs from potential risks and vulnerabilities. • RTL Power Analysis Made Easy: PowerArtist simplifies RTL power analysis and reduction, helping you achieve power-efficient designs without compromising on performance. • Mastering Electromagnetic Analysis: Ansys enables on-silicon #electromagnetic analysis and modeling with RaptorH, Exalto, and VeloceRF. Tackle the electromagnetic challenges head-on, ensuring optimal performance across all frequency ranges. • Unlimited Compute Power with Cloud-Native Architecture: The cloud-native elastic compute architecture allows you to harness the full-chip capacity of our powerful solutions, ensuring faster turnaround times and the ability to explore larger designs effortlessly. Don't miss out on the opportunity to elevate your semiconductor designs to unprecedented heights. To learn more about our Multiphysics Signoff Solutions, download the datasheet from here: #chipdesign #eda

Explore features of Ansys Electronics Desktop such as optimization, parametrization, 3D Components, and the wrap function when you enroll in this free Ansys Innovation Course.

Explore features of Ansys Electronics Desktop such as optimization, parametrization, 3D Components, and the wrap function when you enroll in this free Ansys Innovation Course.

Read #thermal news this week: https://sie.ag/5teonY , including a semiconductor industry customer view on Siemens Embeddable BCI-ROM technology. Learn how this enhances thermal design collaboration in the electronics supply chain. Semiconductor manufacturers can now generate and share accurate 3D IC package thermal models easily with their clients for use in 3D CFD simulation studies in Simcenter Flotherm software, with the confidence that internal geometry and details that are IP sensitive are protected. This new reduced order modeling approach enables easier, accurate downstream thermal management design tasks to be performed by engineers in electronics companies. An Embeddable BCI-ROM model is ready for use in the computational fluid dynamics (CFD) software environment in Simcenter Flotherm, supports steady state + transient analysis temperature prediction, and is able to model modern complex multi-die packages and also IC packages with partioned powered areas on a single die. ----- #semiconductors #electronics #thermalanalysis #thermal #transient #simulations #multidie #computationalfluiddynamics

Find out about a step change in IC package thermal modeling for 3D simulation in the electronics supply chain. https://lnkd.in/gbBzJhUN Embeddable BCI-ROM technology enables creation of IC package reduced order thermal models for 3D CFD simulation in Simcenter Flotherm, while protecting internal package physical details that are IP sensitive. Benefits include: - accurate in steady state and transient analysis - support for multiple power sources in packages - secure: impossible to reverse engineer This new technology helps semiconductor manufacturers to share accurate thermal models more easily with their clients to develop more reliable electronics products.  Read the blog to find out comparisons to two-resistor (2R), DELPHI compact thermal models and for information Embeddable BCI-ROM accuracy vs a detailed model. #semiconductors #electronicscomponents #electronics #thermal #computationalfluiddynamics #eda #siemens #simulations #Simcenter #Flotherm

🚀 Exciting News for Optics Engineers! 🌟 Our latest blog post dives deep into the Optics Simulation Enhancements in Ansys 2024 R1! 🎉 Miniaturization is at the forefront of optics design, and we're thrilled to share how our enhancements in Ansys 2024 R1 are making it faster, easier, and more affordable. From endoscope cameras to augmented reality glasses to mobile phone camera lenses, we're empowering engineers to create smaller, lighter, and more efficient optical systems. Read the full blog post to explore: 🔍 The Challenge of Metalenses: Unlocking miniaturization with three layers of design and analysis. 💡 System-level Workflows: Seamless integration and fast analysis from component to system level. 🛠 Solution-specific Product Enhancements: Exciting updates to Lumerical, OpticStudio, and Speos. Don't miss out on the future of optics design! Dive into the details now: https://lnkd.in/eXBMuucp #OpticsDesign #Ansys2024R1 #SimulationEnhancements #Miniaturization #EngineeringInnovation

Understanding Electromagnetic (EM) coupling within semiconductor devices is critical for ensuring reliable operation. EM interactions span from silicon chip to enclosing package, which requires EM modeling for both on-die metal and package layers. This blog explores the critical role of EM interactions between various device elements, from on-die metals to package layers. The key highlights of the blog are:- 🔹 Understanding EM interactions for meeting design specifications and ensuring reliable operation 🔹 Challenges in creating and simulating EM models incorporating on-die metals and package layers 🔹 Ansys' solution for seamlessly adding package layers to silicon technology's metal stack-up 🔹 Overview of Ansys' suite of on-chip electromagnetic analysis tools, including RaptorX™ and Exalto™ 🔹 Utilizing Ansys Process Configurator for easy creation and modification of technology files 🔹 Case study demonstrating the impact of package layers on device performance through simulation Unlock insights into EM coupling and semiconductor design optimization. Read the full blog now! https://ansys.me/4bp6mkN #multiphysics #SignalIntegrity #EDA