Ansys Semiconductors’ Post

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The growing demand for computational power from CPUs and GPUs, the Internet of Things (IoT), self-driving cars, and Artificial Intelligence (AI)—require more functionality from integrated circuits. As designers face the challenges of scaling with the complexity and density limitations of traditional flat 2D-IC architectures, advanced packaging techniques can enhance functional densification and performance while adhering to form-factor constraints and cost. Interposers play a crucial role in advanced packaging architectures by providing high connectivity between chiplets. Read this white paper to learn more about these challenges and Ansys' solutions for addressing them. Download White Paper:- https://ansys.me/3W4pcHS #Ansys #EDA #semiconductors #multiphysics

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