Ansys Semiconductors’ Post

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To meet the escalating computational needs of CPUs and GPUs for IoT, autonomous vehicles, and AI, integrated circuits must evolve to deliver greater functionality. As designers face the challenges of scaling with the complexity and density limitations of traditional flat 2D-IC architectures, advanced packaging techniques can enhance functional densification and performance while adhering to form-factor constraints and cost. Interposers play a crucial role in advanced packaging architectures by providing high connectivity between chiplets. Read this white paper to learn more about these challenges and Ansys' solutions for addressing them. Download White Paper:- https://ansys.me/4cMt5rX #Ansys #EDA #semiconductors #multiphysics

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