ASMPT SEMI Solutions’ Post

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We’re thrilled to hear about the recent installation of the ASMPT AMICRA NANO at PHIX Photonics Assembly! The world-class bonding accuracy of 200 nanometers at 3 sigma is truly impressive and will set new standards in the industry. Besides the precision, NANO is an all-round and well-rounded machine. To discover NANO more, please visit us: https://lnkd.in/g9wWHigU #Photonics #CPO #copackageoptics #siliconphotonics

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To further support the volume scale-up of our customers, PHIX recently took delivery of an ASMPT AMICRA Nano die bonder. This machine is capable of wafer-level or panel-level die bonding with dicing tape pickup and inline placement accuracy inspection. It was specially modified with a custom imaging system to achieve a world leading bonding accuracy of 200 nanometers at 3 sigma. Another customization enables laser welding at greater speeds and with a more localized application of heat. We're excited with this further upgrade of our integrated #photonics and #MEMS volume packaging capabilities! ➤ Discover our #contractmanufacturing offering: https://lnkd.in/dYnwAnz #siliconphotonics #chipindustry #diebonding

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