We're excited to introduce Cupraganth® MV, the world's first Pd-free electroless copper activation solution that redefines package substrate manufacturing for advanced applications. Why it's a game changer: • Innovative Technology: Based on state-of-the-art colloidal copper, it replaces traditional Pd-based methods with superior performance and reduced cost. • Streamlined Process: Cupraganth MV simplifies workflows and enables finer features by eliminating the need for a separate Pd seed etch. • Cost Efficiency: With the stable price of copper, you can enjoy a lower cost of ownership (CoO) and greater financial predictability. • Unmatched Results: Achieve improved yields, finer track spacing, exceptional coverage, and peel strength comparable to ionic Pd solutions. Cupraganth MV is designed to work seamlessly with tartrate-based electroless copper baths to provide a robust package substrate manufacturing process. Whether your goal is finer features, advanced production or cost reduction, Cupraganth MV is your solution. Find more information here. https://lnkd.in/deZ7kbzg #MKSAtotech #PackageSubstrate #ElectrolessCopper
Steven Roy
2mo
Lea Ronal had a copper catalyst in the 1980s
Musti Buruk
1mo
Sevdim
Leo Liu
2mo
Looks great
Area Sales Manager at mks-Atotech Group
2moAwesome product