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In a bid to enhance its foundry capabilities, Samsung Semiconductor is earnestly integrating hybrid bonding technology. Compared to existing bonding methods, hybrid bonding enhances I/O and wiring lengths. According to industry sources, Applied Materials and Besi Semiconductor are establishing equipment for hybrid bonding at the Cheonan Campus, slated for use in next-generation packaging solutions like X-Cube and SAINT. Samsung’s SAINT (Samsung Advanced Interconnect Technology) platform includes three types of 3D stacking technologies: SAINT S, SAINT L, and SAINT D. SAINT S involves vertically stacking SRAM on logic chips such as CPUs. SAINT L involves stacking logic chips on top of other logic chips or application processors (APs). SAINT D entails vertical stacking of DRAM with logic chips like CPUs and GPUs. Read more here: https://bit.ly/3OAslw0 #semiconductor #memory #DRAM #NAND #flashmemory #industryinsights #weknowmemory

The PIC was originally intended to be used with the General Instrument CP1600, the first commercially available single-chip 16-bit microprocessor. The CP1600 had a complex bus that made it difficult to interface with, and the PIC was introduced as a companion device offering ROM for program storage, RAM for temporary data handling, and a simple CPU for controlling the transfers. While this offered considerable power, GI's marketing was limited and the CP1600 was not a success. When the company spun off their chip division to form Microchip in 1985, sales of the CP1600 were all but dead. By this time, the PIC had formed a major market of its own, and it became one of the new company's primary products. Early models only had mask ROM for code storage, but with its spinoff it was soon upgraded to use EPROM and then EEPROM, which made it possible for end-users to program the devices in their own facilities. All current models use flash memory for program storage, and newer models allow the PIC to reprogram itself. Since then the line has seen significant change; memory is now available in 8-bit, 16-bit, and, in latest models, 32-bit wide. Program instructions vary in bit-count by family of PIC, and may be 12, 14, 16, or 24 bits long. The instruction set also varies by model, with more powerful chips adding instructions for digital signal processing functions. The hardware implementations of PIC devices range from 6-pin SMD, 8-pin DIP chips up to 144-pin SMD chips, with discrete I/O pins, ADC and DAC modules, and communications ports such as UART, I2C, CAN, and even USB. Low-power and high-speed variations exist for many types. #snsinstitutions #snsdesignthinking #snsdesignthinkers

#snsinstitutions #snsdesignthinking #designthinkers #snsct 8086 MICROPROCESSOR Intel 8086 microprocessor is the enhanced version of Intel 8085 microprocessor.The 8086 microprocessor is a16-bit, N-channel, HMOS microprocessor. Where the HMOS is used for High-speed Metal Oxide Semiconductor.Intel 8086 is built on a single semiconductor chip and packaged in a 40-pin IC package. The type of package is DIP (Dual Inline Package).It consists of a powerful instruction set, which provides operation like division and multiplication very quickly.8086 is designed to operate in two modes, i.e., Minimum and Maximum mode. It is a 16-bit microprocessor. It has a 20-bit address line.The Clock speed of this microprocessor varies between 5, 8 and 10 MHz for different versions.8086 microprocessor supports memory segmentation.It is general purpose register based processor. In8086, more than one processor is used. An additional external processor can also be employed it contains more number of transistors compare to 8085 microprocessor. It contains about 29000 in size.

The STMicroelectronics series STM32F767ZIT6 is a high-performance Arm® Cortex®-M7 32-bit RISC core integrated circuit developed by STMicroelectronics. It operates at a frequency of up to 216 MHz, has a floating-point unit (FPU), supports Arm® double-precision and single-precision data processing instructions and data types, implements DSP instructions and memory protection unit (MPU), and enhances the security of applications. #mcu #stmicroelectronics #stm #stm32 #mpu #dsp #fpga #bga #ic #icchips #integratedcircuit #integratedcircuit #microcontrollers #microprocessors #pcba #pcb #embedded #embeddedsystems #electronics #electroniccomponent

⚡ Processing the History of Microprocessors https://hubs.la/Q02MB5zS0 ❔ Did you know that in the British market, Acorn Computers released the first ARM microprocessor in 1987? While initially released only in the UK in the Acorn Archimedes PC, ARM chips eventually became common worldwide. This embedded 32-bit microprocessor was a revolution for consumer electronics and is now the most utilized 32-bit processor of all time. Explore 50 years of microprocessing history 👇 https://hubs.la/Q02MB5zS0 #RochesterElectronics #RochesterElectronicsUS #processors #microprocessors #semiconductor #authorizedsemiconductors #semiconductors

8085- Microprocessor Training Kit. 8085 is pronounced as "eighty-eighty-five" microprocessor. It is an 8-bit microprocessor designed by Intel in 1977 using NMOS technology. It has the following configuration − • 8-bit data bus • 16-bit address bus, which can address upto 64KB • A 16-bit program counter • A 16-bit stack pointer • Six 8-bit registers arranged in pairs: BC, DE, HL • Requires +5V supply to operate at 3.2 MHZ single phase clock It is used in washing machines, microwave ovens, mobile phones, etc. #electricalengineering #elearning #microprocessor #microcontroller #practical

Difference Between EXTI_IMR and EXTI_EMR in ARM STM32 microcontrollers: ✓ EXTI_IMR (Interrupt Mask Register): Controls whether an external interrupt is generated when an event occurs on an external line. If an interrupt is generated, the CPU can respond by executing an interrupt service routine (ISR). ✓ EXTI_EMR (Event Mask Register): Controls whether an event is generated on an external line. Unlike interrupts, events do not necessarily trigger an ISR. Instead, they can be used to trigger other hardware actions, such as waking the microcontroller from a low-power mode or starting a peripheral. #embedded #embeddedsystems #microcontrollers #electronics

Nice to see Eclipse with T-Core expanding to address AI-GPU test requirements of today and the next few years as power/power densities get more challenging. A fantastic platform (low cost, scalable) powered by an ever more incrediable thermal technology that is the “industry’s best” according to the leader in this market.

A new powerful STM32 microprocessor generation - MP2 - to develop enhanced applications with Computer Vision, Ethernet Switch, and HW video processing. #MP2, #EdgeAI, #ComputerVision, #Ethernet, #Industry 5.0, #Innovation

Why Siemens S7-1500 ❓❓❓ ✔ Performance: High-performance CPUs with fast processing speeds for handling complex automation tasks and real-time control. ✔ Integrated Safety: Integrated safety functions, including Safety Integrated (SINAMICS) and Safety Integrated (SIMATIC), to ensure a high level of safety in automation applications. ✔ Scalability: Scalable hardware options with various CPU performance levels, memory capacities, and communication interfaces to meet the specific needs of different applications. #siemens #s71500 #PLC #industrialautomation