Ansys Fluids’ Post

Take a look at the detailed thermal modeling of Printed Circuit Boards (PCBs) using Ansys Icepak! PCBs usually have multi-layers with dielectric material and layered copper traces. Typically trace layers are non-uniform. There are also thermal vias that distribute heat through the package. Therefore a locally varying thermal conductivity is required to predict the thermal field accurately. Ansys Icepak does this by importing traces (from ECAD) and creating a thermal conductivity map. Resolving each individual layer is impractical in a system-level model. In Icepak, the trace layout is used to compute varying orthotropic conductivity for the board. #ansys #pcbengineering #pcbdesign #electronicengineering #electronicdesign PCB Modeling with Ansys Icepak including Joule Heating https://hubs.ly/Q02GtG3n0

| Ansys Sherlock | Complete Life Predictions for Electronics Components   Ansys Sherlock is the only reliability physics-based electronics design tool that provides fast and accurate life predictions for electronic hardware at the component, board and system levels in early-stage design.   Ansys Sherlock for Product Life Prediction Ansys Sherlock provides fast and accurate life predictions for electronic hardware at the component, board and system levels in early design stages. Sherlock bypasses the ‘test-fail-fix-repeat’ cycle by empowering designers to accurately model silicon–metal layers, semiconductor packaging, printed circuit boards (PCBs) and assemblies to predict failure risks due to thermal, mechanical, and manufacturing stressors-all before prototype.   👉 Validated Time-To-Failure Predictions 👉 Rapid ECAD to FEA and CFD Translations 👉 Closed-loop Reliability Workflow with Ansys Mechanical, LS-DYNA & Icepak 👉 Complete Product Lifetime Curve   To discuss more about your challenges, please fill in the details on https://zurl.co/VUvv and we will be happy to call you and discuss your project requirements.   #Ansys #AnsysSherlock #ReliabilityEngineering #PredictiveFailureAnalysis #ElectronicsSimulation #DesignForReliability #ElectronicsDurability #AnsysSolutions #ProductReliability #PCBDesignSimulation #FailureAnalysis #3dengineeringservices #3dengg Sangameshwar Ghattargi Pravin Manorkar Jasjit Singh Vinoth R Fazil Quazi Vinay Sawant Rama Baruva

Copper-filled stacked microvias in High-Density Interconnect (HDI) Printed Circuit Boards (PCBs) are prone to thermomechanical fatigue failure, mainly due to the Coefficient of Thermal Expansion (CTE) mismatch between copper and the board materials in the out-of-plane direction.   This short video, based on a Finite Element Analysis conducted with Ansys Workbench, illustrates the thermomechanical stresses experienced by stacked microvias during temperature cycles. Understanding the temperature-dependent material properties of PCBs is essential for accurately assessing the thermomechanical reliability of stacked microvias.   #Ansys #ADDL #PCB #Simulation #Electronics #Reliability #AnsysMechanical

Thermomechanical analysis of stacked microvias in HDI boards with Ansys Workbench #ADDL #Ansys #PCB #Simulation #Reliability

Headline: CAE Simulations - Thermal Analysis of Electronic Components. Overview: The project aimed to optimize printed circuit boards (PCBs) by considering both thermal and mechanical calculations to ensure reliable operation of electronic equipment. As the electronic equipment on these PCBs operates in a harsh environment with limited heat dissipation, it was crucial to ensure the PCB's mechanical resilience during service. TGM Capabilities: TGM offered several capabilities to optimize the PCBs and ensure their reliable operation. Firstly, they improved heat dissipation by optimizing PCB design and component layout, ensuring that electronic equipment operates within safe temperature ranges. Secondly, they maintained optimum operating temperatures to extend the life and reliability of electronic components. Thirdly, they performed mechanical design optimization to ensure that the PCB is resistant to vibration and shock, reducing the risk of physical damage. Lastly, they reinforced the structural integrity of the PCB through mechanical analysis and design to help it withstand the special conditions during service and continue to function reliably. By leveraging these capabilities, TGM was able to enhance the PCB design to function efficiently and reliably in challenging environments. #CAESimulations #ThermalAnalysis #ElectronicComponents #PCBDesign #MechanicalAnalysis #ReliableOperation #HeatDissipation #OptimizedLayout #StructuralIntegrity #ChallengingEnvironments

Headline: CAE Simulations - Thermal Analysis of Electronic Components. Overview: The project aimed to optimize printed circuit boards (PCBs) by considering both thermal and mechanical calculations to ensure reliable operation of electronic equipment. As the electronic equipment on these PCBs operates in a harsh environment with limited heat dissipation, it was crucial to ensure the PCB's mechanical resilience during service. TGM Capabilities: TGM offered several capabilities to optimize the PCBs and ensure their reliable operation. Firstly, they improved heat dissipation by optimizing PCB design and component layout, ensuring that electronic equipment operates within safe temperature ranges. Secondly, they maintained optimum operating temperatures to extend the life and reliability of electronic components. Thirdly, they performed mechanical design optimization to ensure that the PCB is resistant to vibration and shock, reducing the risk of physical damage. Lastly, they reinforced the structural integrity of the PCB through mechanical analysis and design to help it withstand the special conditions during service and continue to function reliably. By leveraging these capabilities, TGM was able to enhance the PCB design to function efficiently and reliably in challenging environments. #CAESimulations #ThermalAnalysis #ElectronicComponents #PCBDesign #MechanicalAnalysis #ReliableOperation #HeatDissipation #OptimizedLayout #StructuralIntegrity #ChallengingEnvironments

Why Intact Simultion for nTop is amazing: * It’s shockingly fast to simulate implicits. * You can trade off performance and accuracy without worrying about convergence, etc. * BCs do not reference topology, so you can swap out different test models (OG CAD, optimized, DFAM’d, scanned, etc.).

[Thermal Presizing Tool of an Electronic Board] 🌡️ 🎯 Evaluating the thermal risks and the cooling needs of the components of a PCB (printed circuit board) in a few minutes is the challenge taken up by MECAGINE engineers with their new tool! Why is it advantageous? ✔️Evaluate as soon as possible the risks linked to the use of an electronic component, or several components located close to each other. ✔️Give an overview of the required air flow rates, the need to implement active or passive cooling, thermal bridges, etc. ✔️Do it in minutes as opposed to the hours or days needed for detailed CFD (Computational Fluid Dynamics) simulations, all while minimizing loss of accuracy. These are structuring choices in the development of a product! To read the full article: 👉 https://lnkd.in/eY9BFxVR #ThermalSimulation #PCB #Electronics

#ComingVerySoon Get on the list for the Intact.Simulation for nTop Beta ➡️https://lnkd.in/evvSHnga #IS4NTOP #INTACTEVERYWHERE

Performing a dynamic analysis of multiple printed circuit board assemblies (#PCBAs) including the geometric details of the #PCBs and the solder joints can be a challenging task, because of the computational effort. Thus, we developed a modal based sub-modelling simulation process, in which a single modal analysis is performed for an electronics component consisting of multiple coarse PCBs modeled by orthotropic material fields and #solderjoint #substructures calculated based on detailed solder-joint models. In the modal domain, then, global displacements are projected onto submodels. This modal basis can then be used to calculate the electronics components' response to a mechanical shock. The video shows the animation of a shock response of multiple PCBAs mounted in an enclosure and for the submodel of an electrolytic capacitor including solder-joint stresses. #simulation #fea #electronics