Emcor Enclosures will be showcasing at IEEE #AUTOTESTCON2024 next month in National Harbor, Maryland. Emcor Enclosures specializes in the design and manufacture of industry-leading mechanical packaging solutions tailored for T&M (Test and Measurement), MODSIM (Modeling and Simulation), and Evaluation platforms, catering to both cost-sensitive and specification-driven programs. Our comprehensive catalog offers solutions for diverse needs, and we are equipped to provide custom modifications to meet specific application requirements. Whether your testing demands involve extreme seismic resilience or rigorous EMI (Electromagnetic Interference) protection, Emcor’s expert engineers are prepared to support your project. If you are part of the #TestAndMeasurement sector and plan to attend the event, visit the Emcor Enclosures booth to engage with a trusted engineering and manufacturing partner dedicated to collaboration and innovation.
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Harnessing the Power of Simulation, Data Analytics, and High Performance Computing for Engineering and Manufacturing
🔥 Don't Burn Your Inverter! - #Electronics #thermal #management Power losses link the electrical and thermal domains together. It is relatively straightforward to understand losses from the #power electronics components but including these losses in a 3D thermal simulation brings much more information and insight to the #feasibility of a design. 👉 Common mistakes you are better off leaving to your competitors: https://lnkd.in/dS36MvGj #altair #onlyforward
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Bubble rise in a vertical column Comparison of four interface tracking solvers for bubble rise in a vertical column for a Bond number = 243, Morton number = 266, and Reynolds number = 7.8. #simulation #engineering #technology #innovation #future #cfd
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Designing efficient wireless power transfer systems involves overcoming critical challenges such as alignment sensitivity, coil design, electromagnetic interference (EMI), and energy efficiency. EMWorks' state-of-the-art electromagnetic simulation software provides effective solutions by ensuring reliable power transfer even with alignment issues, optimizing coil designs to minimize energy losses, and reducing EMI to meet regulatory standards. By enabling detailed simulation and analysis, EMWorks allows for virtual testing and refinement of your designs, enhancing overall efficiency and performance before physical prototypes are created. Learn more about our solutions by visiting: https://lnkd.in/dgHiES-B #WPT #SimulationSoftware #Electromagnetics
Electromagnetic Simulation Software for Wireless Power Transfer
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| Battery Electromagnetic Interference and Compatibility (EMI/EMC) | Ansys offers a state-of-the-art battery system EMI/EMC simulation solution that seamlessly combines frequency and time domain simulation. ANSYS APPLICATIONS Battery Electromagnetic Interference (EMI) Simulation Testing and Design High-frequency EMI noises can cause crosstalk between a high-voltage power circuit in a battery array and a low-voltage control circuit in a battery management system. Electromagnetic simulation can be used to predict electromagnetic interference (EMI) emissions and susceptibility early in the battery design process or be used to conduct root cause analysis for existing EMI challenges in a battery system. These predictions and analysis can help optimize the EMI filter design and reduce hardware testing costs for compatibility tests. 👉Early Detection and Mitigation of EMI Noises Before Battery Production 👉EMI Noise Prediction and System Level Virtual Compatibility Testing 👉EMI Filter Design and Optimization for Battery Systems To discuss more about your challenges, please fill in the details on https://zurl.co/VUvv and we will be happy to call you and discuss your project requirements. Sangameshwar Ghattargi Rama Baruva Pravin Manorkar Jasjit Singh Vinoth R Fazil Quazi #Ansys #EMI #ElectromagneticInterference #EMC #Electromagneticcompatibility #BatteryTesting #BatteryTechnology #ElectricVehicles #EV #BatterySafety #Simulation #Engineering #TechInnovation #PowerElectronics #Electromagnetics #ElectronicsDesign #3dengineeringservices #3dengg
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Tech Business and Product Generalist. Focused on 3D Heterogeneous Integration and related with Glass (Fused Silica). Semiconductor Packaging. Product Development.
I'm really excited with ED2 Corporation to launch the first ever system-in-package #phasedarray #antenna module. Phased array system design and build just got a lot easier, faster, and less expensive! Use multiple modules together to build an array of any size. Traditional phased array antenna systems are difficult to design and build, for a number of reasons. ED2’s StingArray™ phased array antenna module represents a quantum leap forward in the category. Complex Design and Manufacturing: Designing a phased array antenna requires precise engineering to ensure each element in the array works correctly. Manufacturing such arrays can be complicated due to the need for precise alignment and integration of numerous antenna elements. ED2's SMT package simplifies the design and manufacturing process. Power Consumption: Phased array antennas often require significant power to operate, particularly for systems with active electronic components for beamforming and steering. Traditional systems’ efficiency might range from 20% to 50%. ED2’s phased array improves power efficiency significantly by incorporating very low loss materials and short trace lengths. Thermal Management: The electronic components in a phased array can generate significant heat, requiring efficient thermal management solutions to maintain performance and reliability. At mmWave frequencies, phased array systems have high power densities due to the need for many closely packed elements. This can lead to significant heat generation within a small area, requiring efficient heat dissipation solutions. ED2’s phased array module implements innovative thermal management techniques to simplify and ease the design of the larger antenna system. Integration and Compatibility: Integrating phased array antennas into existing systems or platforms can be challenging, requiring careful consideration of compatibility with other components and systems. ED2’s phased array module is designed for SMT, enabling automated assembly, higher component density, and flexibility in design. Reach out to us at info@ed2corp.com or to your #RFMW sales rep to learn more! #rf #IC #beamforming
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Ever wondered if your voltage drop calculations are keeping pace with the latest advancements in simulation technology? 🔍 Our latest white paper, "Is Your Voltage Drop Flow Obsolete?" dives deep into why traditional voltage drop methods might be falling short and how modern simulation tools are stepping up to the challenge. With the rapid evolution of electronic systems, staying ahead means leveraging the most advanced techniques available. 💡 Key Takeaways: Why traditional voltage drop calculations might not be enough for today's complex designs. The role of advanced simulation tools in ensuring accuracy and efficiency. How to adapt your design processes to incorporate the latest advancements. Don't let outdated methods hold your designs back. Explore the future of electrical simulations and stay ahead in the game! 🔗 Read the full white paper here: https://ansys.me/4dDWowU #Ansys #semiconductor #multipyhiscs #EDA
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Developing Simbeor Electromagnetic Signal Integrity Software for Design of Predictable Interconnects!
During our first systematic analysis to measurement validation project (see more at https://lnkd.in/gkfw8svj), we realized that a formal method to build broadband dielectric and conductor roughness models is needed. Not just an identification of Dk and LT/Df at a few frequency points, but a reliable methodology to build broadband material models suitable for predicting PCB interconnect behavior in signal integrity tools. This realization led to the birth of the model identification technique using GMS-parameters, a concept we first introduced in this DesignCon2010 paper. If you're intrigued about the developments since then, I invite you to explore application notes 2021_03, 2021_04, 2019_01, among others, available at Simberian's Website https://lnkd.in/gmXBDAC. This methodology has matured within Simbeor software into a fully automated identification process with separation of dielectric and conductor losses, now integral to the "predictable interconnect design process" adopted by numerous companies. Fast forward to today, with data rates exceeding the 100 Gbps threshold, the significance of the formal broadband dielectric and conductor roughness model identification using GMS-parameters has never been more critical. #simbeor #electromagnetics #signal_integrity
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Ever wondered if your voltage drop calculations are keeping pace with the latest advancements in simulation technology? 🔍 Our latest white paper, "Is Your Voltage Drop Flow Obsolete?" dives deep into why traditional voltage drop methods might be falling short and how modern simulation tools are stepping up to the challenge. With the rapid evolution of electronic systems, staying ahead means leveraging the most advanced techniques available. 💡 Key Takeaways: Why traditional voltage drop calculations might not be enough for today's complex designs. The role of advanced simulation tools in ensuring accuracy and efficiency. How to adapt your design processes to incorporate the latest advancements. Don't let outdated methods hold your designs back. Explore the future of electrical simulations and stay ahead in the game! 🔗 Read the full white paper here: https://ansys.me/3LZbTnn #Ansys #semiconductor #multipyhiscs #EDA
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Read the Article! Discover advanced techniques for optimizing signal integrity in EMC simulations with LTspice in our latest technical article! Part 2 focuses on strategies to enhance signal integrity, ensuring accurate results for your designs. Learn how to tackle common challenges and achieve optimal performance. #engineering #innovation #ltspice
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fully utilize the dynamic range of the ADC, it is essential to consider the AGC amplifier. This ensures that the correct signal is presented in front of the ADC, preventing saturation
MR Engineering 101 - Dynamic Range of MR Signals into ADC Receiver For MR Engineers ONLY: This is a delicate but important technical topic for the typical high field MR System's Receive Chain design. The MR signal's dynamic range is usually designed to be ranged from minimum as -26 dBm to maximum as 0 dBm. Rationale: * The thermal noise power is 10*log10(kT/0.001) = -173 dBm/Hz * The gain for typical preamp = 23 dBm * The typical receiver bandwidth = +/- 750 kHz, which could be expressed as 20*log10(2*750k) = 124 dBm Sum up the above three numbers and you will get -26 dBm, which is the system's base thermal noise ready to enter into ADC. In the meantime, the maximum allowable signal 0 dBm is limited by the dynamic range of ADC itself. It might cause image showing "Intensity Washout" if over the 0 dBm limit, as shown below.
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