EPIC - EUROPEAN PHOTONICS INDUSTRY CONSORTIUM’s Post

In my recent report, I dive into a comparative analysis of deposition techniques for Silicon Dioxide (SiO₂) and Silicon Nitride (Si₃N₄), two essential materials in the world of semiconductor manufacturing. Key highlights include: 🔹 Advances in Atomic Layer Deposition (ALD) for precise SiO₂ layers. 🔹 Innovations in Plasma-Enhanced CVD (PECVD) for stress reduction in Si₃N₄ films. 🔹 The role of in-situ monitoring and post-deposition annealing in improving surface quality and managing defects. With these advancements, we’re pushing the boundaries of film quality and performance in semiconductor devices. #Semiconductors #MaterialsScience #SiO2 #Si3N4 #ALD #PECVD #Research #Innovation

The semiconductor industry is facing the physical limits of miniaturization, pushing transistor sizes to nanoscales where traditional 2D designs can’t keep pace with Moore’s Law. To continue advancing, manufacturers are innovating with complex 3D architectures that maximize efficiency at the atomic level. Atom Probe Tomography (APT) is proving essential for these next-gen chips. Recently, an APT analysis of a Ni₀.₅Al₀.₅ thin film, considered for alternative metallization in interconnect applications, revealed critical insights. A 10 at% oxygen iso-surface displayed unexpected oxidation, while a 2D Ni concentration map uncovered nanoscale compositional inconsistencies. Additionally, silicon segregation at grain boundaries near the SiO₂ interface was observed—highlighting challenges at the atomic scale. As we press on in this nanoscale race, APT continues to drive breakthroughs, offering detailed insights that guide advanced materials development. Thanks again to R&D - Research & Development World for the full article with more background and insights click the source link in the comments below 💡 🙏👇 #Semiconductors #Nanotechnology #MooresLaw #AtomProbeTomography #Innovation #3DChips #AdvancedMaterials

💡Traditional 2D chip designs cannot keep pace with Moore's Law. What's next? Read in the article below 👇

✍ In a little more than 10 minutes, das-Nano and the Terahertz Wave Technology Revolution explained by its Director Israel Arnedo. A month ago, we participated in an online event organized by EPIC - EUROPEAN PHOTONICS INDUSTRY CONSORTIUM around thin films fabrication and characterization. Thin films are basically layers of material that are deposited on any surface, using complex chemical and physical deposition techniques, including gas-phase precursors and plasma process. They are widely used in different markets, such as optics, photovoltaics, telecom/datacom, consumer electronics, medical/healthcare or automotive. To support some of the present technological mega-trends and the last requirements of the different sectors, innovative thin-film materials have to be studied, developed and implemented. These new materials also require special developments for their fabrication and specific tools for the characterization of their physical and optical properties. EPIC invites coating and thin-film manufacturers, machine builders for coating manufacturing, the suppliers of characterization tools and all the end-users of special thin-films to join us to discuss the newest solutions in this field and where are the present challenges and needs. Thanks Antonio Castelo, PhD https://lnkd.in/eUpMu_BG #Coatings #OEMs #Filmbuild #TerahertzTechnology #AdvancedFactories #Manufacturing

#photonixFAB partners from A to X: Today, meet Luceda!  Luceda Photonics is a leading provider of photonic integrated circuit (PIC) design software and services, empowering photonics IC designers to easily bring their PIC design ideas to life and reduce time to market.   Martin Fiers, Product Manager, Luceda comments: “As part of photonixFAB, we develop mature process design kits for silicon (SOI) and silicon nitride (SiN) photonic IC technologies. This enables the design for heterogenous integration of InP chiplets and electro-optical materials, reducing packaging cost. These schematic-assisted design kits incorporate packaging rules, variability-aware simulation models, and electro-optical interfaces, which increase efficiency and accuracy of the photonic IC design implementation.”   Discover how their contributions are automating and integrating all aspects of photonics design flows: https://lnkd.in/e5kCk4QH   #photonics #innovation #EUInnovationEcosystems #PhotonicsDesign #PICDesign photonixFAB is supported by the Chips Joint Undertaking

𝗘𝘀𝗰𝗮𝗹𝗮𝘁𝗼𝗿 𝗜𝗻𝘁𝗲𝗿𝗰𝗼𝗻𝗻𝗲𝗰𝘁𝘀: 𝗘𝗻𝗮𝗯𝗹𝗶𝗻𝗴 𝗠𝘂𝗹𝘁𝗶-𝗟𝗮𝘆𝗲𝗿 𝗜𝗻𝘁𝗲𝗴𝗿𝗮𝘁𝗲𝗱 𝗣𝗵𝗼𝘁𝗼𝗻𝗶𝗰 𝗦𝘆𝘀𝘁𝗲𝗺𝘀 As photonic systems become more data-intensive, the ability to scale beyond single- and dual-layer designs is essential for handling larger bandwidths and more sophisticated functions efficiently. 𝗪𝗵𝘆 𝗶𝘁 𝗺𝗮𝘁𝘁𝗲𝗿𝘀 ‣ Escalator interconnects have been successfully fabricated with up to four photonic layers, doubling the available routing space. ‣ Multi-layer designs can significantly reduce the need for interlayer coupling, improving system efficiency and reducing optical loss. ‣ Low-temperature fabrication techniques ensure compatibility with existing silicon photonics processes, enabling easier integration into mature systems. 𝗥𝗲𝗮𝗱 𝘁𝗵𝗲 𝗳𝘂𝗹𝗹 𝗮𝗿𝘁𝗶𝗰𝗹𝗲: https://lnkd.in/gY9Xfivd #OpticalNetworks #EscalatorInterconnects #SiliconPhotonics #MultiLayerSystems

If you want to know basics of Silicon photonics, here is a free webinar. #SiliconPhotonics

"As advancements in laser microprocessing flourish in the semiconductor sector, process monitoring, including via SWIR imaging, is further increasing the chances to achieve favorable outcomes in processing compact components. " "In the imaging domain, SWIR cameras are favored for semiconductor inspection due to the capability of SWIR light to "see" inside silicon to detect cracks and other potential wafer defects, or defects to solar cell panels. SWIR imagers are further used to perform failure analyses of integrated circuits. New Imaging Technologies’ (NIT’s) line-scan array camera solution, for example, which is based on an indium gallium arsenide detector, provides extremely sharp images of defects in materials at high throughput. This system achieves 2K resolution (2048 × 1 pixels at 7.5-μm pixel pitch). NIT has also recently launched a high resolution SWIR sensor for the most demanding inspections in this field, with an 8-μm pixel pitch and 2-MP resolution at 1920 × 1080 pixels. This solution achieves ultralow noise of 25 e- to ensure image clarity even in challenging environments."

①TSMC: Major breakthroughs in 2nm and silicon photonics; plans to build two new wafer fabs...https://lnkd.in/g76PU36E ②Another silicon carbide (SiC) wafer factory project canceled...https://lnkd.in/gsDZ5yzt