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Low-noise GS sensors have a 10-megapixel 3D stacked design, along with a 2-micrometer ADC pitch and global and rolling shutter pixel drivers. Designs support 120 frames per second and include a 12-bit column-parallel ADC, multiple volt supplies and 2.2 Gbps CML serial interface. The top layer has a 65-nanometer backside illumination (BSI) imager chip, while the bottom layer has a 40-nanometer logic chip. Learn more: https://lnkd.in/eY4dRChF #chips #chipdesign #sensors #imaging

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