David Guzmán Caballero’s Post

#Semiconductor device #fabrication is the #process of #manufacturing #semiconductordevices, like #integratedcircuits (ICs) including #computerprocessors,  #microcontroller and #memorychips (such as NAND flash and DRAM). #industrialfilms #industrialfilmmaking #industrialmarketing https://lnkd.in/djHMYg3w

IN STOCK！   P/N：MCP3301T-BI/MS MFR：Microchip DESC：Analog to Digital Converters - ADC 13-bit Diff In 1 Chl #EMS #OEM #CEM #Microchip #IC #Semiconductor #electroniccomponents #integratedcircuits #Chips #SMT #THT

#Chinese #flash #memory maker claims breakthrough - QLC NAND matches endurance of TLC NAND 🤩 - New materials, error correction methods, and SSD controllers can do wonders 💡 Typically, the more charges a #NANDflash cell can hold, the less durable it is in terms of program/erase cycles. But 3D #NAND material innovations, advancements of NAND controllers, and error correction algorithms can significantly increase the number of P/E cycle a NAND flash cell can sustain. This is what happened with Yangtze Memory Technologies  X3-6070 3D QLC device that boasts the endurance of 3D TLC ICs, ITHome reports. YMTC's X3-6070 3D QLC NAND device belongs to the company's fourth Generation products and features 128 active layers as well as Xtacking 3.0 architecture with a 2400 MT/s interface. While 128 active layers do not seem like a record by today's standards, one of the key part about this 3D QLC NAND device is that the manufacturer claims rather significant endurance of 4,000 program/erase cycles for this #IC. The fast interface supported by these devices makes them suitable for the best #SSDs featuring a PCIe 4.0 or PCIe 5.0 interface. Thanks again to Anton Shilov and Tom's Hardware for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/ePeeAxHV #semiconductorindustry #semiconductors #semiconductor #technology #tech #it #ic #foundry #chip #chips #geopolitics #ssd #china #ai #mobile

"Samsung is preparing to announce its next-generation QLC NAND V9 flash solution, bolstering a seriously impressive density size of 28.5Gb/mm2. The chip has a magnetic area density of 28.5 Gb/mm² and a speed of 3.2 GB/s. The fastest 3D NAND flash memory type currently powering flagship NVMe SSDs has an I/O data transfer rate of approximately 2.4 GB/s." #samsung #techgiants #chips #memorychips #nand #semiconductors #semiconductorindustry #innovation #technology #technologynews

AMD has recently unveiled a motor driver starter kit designed for its Kria K24 system-on-module. The Kria K24 system-on-module is built around a Zynq UltraScale+ IC and measures 60 x 42 x 11mm. The kit, known as KD240 drives starter kit, includes the module itself, a carrier card, and a heat sink. The kit comes equipped with 2Gbyte (2chan x 256Mbit x 16bit/chan) of LPDDR4, as well as a 512Mbit QSPI primary boot memory backed by a MicroSD card secondary boot memory. Secure boot is handled by the main IC's hardware root-of-trust, and an Infineon TPM2.0 IC is also included. #electricalengineering #electronics #embedded #embeddedsystems #electrical

The ability to balance performance, thermal and power in sub-5nm process nodes, such as @TSMC's #3nmFinFET offering, is critical to chip designers. Analog Bits novel #LDO macros that can be easily scaled, arrayed and shared adjacent to CPU cores and SERDES and our detector macros simultaneously monitor power supply health, allowing chip designers to balance power real time. That's why we are the industry's leading provider of low-power, mixed-signal IP. Learn more about our #powermanagementIP demonstrated for TSMC manufacturing processes at https://lnkd.in/gyUu_GPT

As the #DRAM cell is scaling, DRAM maximum memory capacity per wafer in production has been increasing up to 3.61 TB per wafer from Micron Technology, with the very recently released D1-beta 16 Gb #DDR5 chip, which is 31.6% higher than the previous Micron D1-alpha 16 Gb DDR5 chip (2.74 TB). For the D1a chips from Samsung Electronics and SK hynix, the maximum memory capacities per wafer in production are 2.74 TB (ex. Samsung #LPDDR5X 1a 16 Gb chip) and 2.55 TB (ex. SK hynix #LPDDR5X and #LPDDR5T Turbo 1a 16 Gb chips), respectively. The recent #GDDR6/6X chips show 1.5 (1y) ~ 1.8 TB (1z), while #HBM2E chips have 1.28 TB (Samsung) and 1.27 TB (SK hynix). SK hynix’s new 16 Gb #HBM3 chip used for NVIDIA GH200 has a 1z technology node and 1.16 TB maximum capacity per wafer.  TechInsights #Memory #Wafer #Production #Capacity

Comparison of CMOS and FinFET Technologies : Key Differences and Advantages CMOS : CMOS faces challenges in scalability as device dimensions shrink below 22nm, where short-channel effects become increasingly problematic, impacting performance and power efficiency. FinFET : FinFET technology is inherently more scalable than CMOS. The 3D structure allows for effective control over short-channel effects, enabling continued scaling down to 5nm and below while maintaining performance and reducing leakage. Key Differences and Advantages 1) Structure CMOS: Planar, 2D structure; flat channel; gate above the channel. FinFET: 3D structure; fin-like channel; gate wraps around three sides. 2) Gate Control CMOS: Limited control; increased leakage as sizes shrink. FinFET: Enhanced control; reduced leakage; better performance. 3) Power Consumption CMOS: Higher static power consumption due to leakage. FinFET: Lower static power consumption; minimizes leakage. 4) Applications CMOS: Widely used in digital circuits, microprocessors, and memory devices. FinFET: Used in high-performance computing applications, such as CPUs and GPUs. #physicaldesign #asic #finfet #cmos #PD #VLSI

Flip Chip Market Size, Growth, Trends and Forecast 2024-2033 Global flip chip market size is expected to reach 60.48 Bn by 2028 at a rate of 11.7% segmented as 3d ic, 2.5d ic, 2d ic Read more @ https://lnkd.in/gg_RCQe8 #marketresearch #marketintelligence #marketreport #industryanalysis #TheBusinessResearchCompany #TBRC #GlobalMarketModel #flipchip #microchip #technology

🔍 The Secret Life of CPU chips: How Billions of Tiny Transistors Get Baked into Your Tech! 🍰💡 The video explains the complex process of microchip manufacturing, highlighting the steps involved in creating nanoscopic transistors and intricate 3D wire mazes on silicon wafers in a semiconductor fabrication plant. The process includes photolithography, deposition, etching, and ion implantation, with each layer requiring precise steps and tools. The video also covers wafer testing, cutting, and packaging into CPUs. It emphasizes the intricate engineering and technology required, taking viewers through the detailed fabrication steps and showcasing the significance of each stage in producing powerful microchips.