Heritage Olamide’s Post

On day 3 of my #100daysofamplifierdesign, I learnt about being a good circuit designer and how the knowledge and understanding of fabrication of chips is very necessary. I leant a lot from this youtube video https://lnkd.in/dMmkRv4Y by @sam zeloof. In his presentation he described how chips can be fabricated in an home fab, the cost and how the necessary equipement can be gotten.

🔍 Understanding chip packaging is crucial in the IC industry! Different packaging types serve unique functions: DIP (Dual In-line Package): Simple and cost-effective, ideal for prototyping and small-scale production. QFP (Quad Flat Package): Offers higher pin count, suitable for complex circuits. BGA (Ball Grid Array): Enhances thermal and electrical performance, perfect for high-speed applications. CSP (Chip Scale Package): Compact and lightweight, excellent for portable devices. Each type addresses specific needs, ensuring optimal performance and reliability in various applications. 🌟🔌 #ChipPackaging #Semiconductors #ICDesign #TechInnovation

Day 3 of Amplifier design circuit Today, I was captivated by Sam Zeloof's insightful presentation at Hackaday Supercon, where he shared his remarkable journey of fabricating a chip in his garage. This endeavor showcased the fusion of ingenuity and perseverance, unveiling the intricate process of chip fabrication. Spanning around 66 meticulous steps over 12 hours, this process highlights the precision and commitment demanded. A pristine environment is crucial, ensuring optimal conditions at each fabrication stage. Let's explore the key stages briefly: 1. Patterning: Starting with the conceptual design, the silicon wafer is polished to perfection, becoming the canvas for the circuit's blueprint. Laser cleaving and photolithography etch the design onto the wafer, a delicate interplay of light and material. 2. Doping: This stage involves modifying silicon properties strategically to enhance functionality. Techniques like ion implantation or diffusion are pivotal, each with its shades and considerations. 3. Layering: Material films are deposited onto the wafer's surface in a vacuum chamber, contributing to the chip's intricate architecture. Rigorous testing and quality control are essential, ensuring compliance with rigid standards. Only after passing these evaluations does the chip proceed to packaging, marking the peak of a challenging yet rewarding journey. Sam Zeloof's achievement is not just inspiring but a testament to the endless possibilities within our reach. It highlights the impact of passion, ingenuity, and relentless pursuit of excellence in shaping our technological landscape. Pipeloluwa Olayiwola #100daysamplifierdesign Citations: [1] https://lnkd.in/ep6hkgUP [2] https://lnkd.in/egN47dGU [3] https://lnkd.in/eFCJy-_g [4] https://lnkd.in/ekyuSXyA [5] https://lnkd.in/eKKAQcuG

100 Days Amplifier Design Day 3: Why is it important for a good circuit designer to know how chips are fabricated? Understanding how chips are fabricated is crucial for circuit designers because it directly impacts the performance and design considerations of integrated circuits (ICs). By knowing the fabrication processes, designers can optimize layouts, select suitable materials, and anticipate potential issues, leading to more efficient and reliable circuit designs. Recently, I watched a video from the Hackaday Superconference where Sam Zeloof talked about Home Chip Fabrication. He explained how even simple ICs can be made locally using semiconductor fabrication techniques, tools, and processes from the mid-1970s. Zeloof started by discussing semiconductor physics and MOSFET operations, then moved on to fabrication techniques. One interesting thing he mentioned was using a 2-inch wafer for wafer preparation. I learned about photolithography, which is used to fabricate ICs and PCBs. Zeloof also discussed etching failures and mentioned using Boric Acid Solution for doping. He used rust stain remover for oxide etching because it contains Hydrofluoric Acid. Another topic he covered was layering-metalization. Although modern ICs can have over 8 metal layers, the chips he made had just one. Finally, he talked about the scanning electron microscope. Watching the video not only helped me understand specific subjects better but also made me curious to explore more about chip fabrication and related topics. Here is the link to the video https://lnkd.in/eKmFk9Hw Pipeloluwa Olayiwola Sam Zeloof

Recently, I learned Gm/ID methods to design CMOS circuits. It's a technique to design in submicron technology. By the way, here I posted a tutorial on how to design a common source amplifier in Gm/ID methods.

What is wafer level packaging? 🙋♀️ 💐 Hope this article can help you better understand PCB and wafer level packaging. 👀 🧚♀️ 🤞 https://lnkd.in/eVHtZkxc

From concept to creation, the journey of chip test sockets is nothing short of fascinating! 🚀✨ Discover the intricate process of designing and manufacturing these vital components that ensure the reliability of your electronic devices. 🔹 Innovative Design: Explore how cutting-edge designs optimize performance. 🔹 Precision Manufacturing: See the meticulous steps involved in crafting each socket. 🔹 Quality Assurance: Learn about the rigorous testing procedures that guarantee durability. 🔗 Read the full article: https://lnkd.in/eGFdS9K3 #ChipTesting #Manufacturing #TechInnovation #DiskMFR #EngineeringExcellence #ElectronicComponents #SZYUNZE #QualityControl #TechDesign #PrecisionEngineering #ProductDevelopment #IndustrialTech

#day4 #100daysamplifierdesign Today, I focused on having an in depth understanding of the steps involved in creating a DIY home fab. I watched Sam Zeloof video, and I noted down the following: a) Teflon tweezers: These are used for holding and handling delicate wafers during the fabrication process. b) Vacuum Chambers: These are used for thermal evaporation. c) Sticky vinyl: This is used for masking areas on the wafer. d) Ammonium Hydroxide 2%: This is used for cleaning and preparing surfaces for the photoresist. e) Hydrofluoric acid, 1.05%: This is used for etching on the wafer. f) Phosphoric acid: This is used as a dopant. g) Portable furnaces: This is used for oxide growth. h) RF Source: This is used for plasma checking. I) DLP Projector: Patterning the photo resist. Sam's video was very informative and enlightening. I learned that with dedication and adequate knowledge of how to convert basic tools for use in a fab, semiconductor fabrication can be started without spending heavily on equipment. If you are interested in the video, this is the link.

A very good systematic design tutorial using Excel, Spectre and brain (the best design tool ever) This is much closer to the design methodology followed in the industry vs the usual design books

For #CostModelMonday, here's a chart that started out focused on #HybridBonding, but really just came to be about lots of #chiplets versus a few. I ran a design that has the same total area of silicon coming in, but it's four 4x4mm chips versus sixteen 2x2mm chiplets. The bonding method is hybrid bonding, and the assumption is that placing lots of chiplets takes longer (a truth more than an assumption...), but there may be a yield benefit to handling and placing the smaller die. I found a crossover point by adjusting yields; in the chart below, the total cost is the same, but the two designs have different costs in different categories.