Jorgensen Engineering’s Post

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𝗚𝗲𝘁 𝗥𝗲𝗮𝗱𝘆 𝘁𝗼 𝗠𝗲𝗲𝘁 𝗕𝗥𝗜𝗔𝗡 & 𝗝𝗘𝗦𝗣𝗘𝗥! Join us at the 𝗯𝗶𝗴𝗴𝗲𝘀𝘁 𝗽𝗮𝗰𝗸𝗮𝗴𝗶𝗻𝗴 𝗲𝘃𝗲𝗻𝘁 in North America! PACK EXPO in Chicago is just around the corner, and we’re gearing up for an exciting showcase! From November 3-6, 𝗕𝗥𝗜𝗔𝗡 and 𝗝𝗘𝗦𝗣𝗘𝗥, Jorgensen Engineering, will be there to share our latest 𝗿𝗼𝗯𝗼𝘁𝗶𝗰𝘀 𝗮𝗻𝗱 𝗮𝘂𝘁𝗼𝗺𝗮𝘁𝗶𝗼𝗻 𝘀𝗼𝗹𝘂𝘁𝗶𝗼𝗻𝘀. Stop by booth 𝗟𝗨-𝟴𝟱𝟱𝟰 and see how we’re making packaging handling 𝗦𝗠𝗔𝗥𝗧𝗘𝗥 & 𝗙𝗔𝗦𝗧𝗘𝗥.👍 📆 𝗠𝗮𝗿𝗸 𝘆𝗼𝘂𝗿 𝗰𝗮𝗹𝗲𝗻𝗱𝗮𝗿𝘀! We’re looking forward to seeing you there! More info: https://lnkd.in/dGPTw5nP #PackExpoChicago #packaginghandling #packaging #foodindustry #petfood #infantformula #ev #healthcare #sustainability #robotics #Fanuc #ABB #automation #DI

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Michael Mancuso

Field Service Engineer

2mo

Worth attending for sute..

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