Dr. Jens Tschmelak’s Post

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STP, MBE, PhD Chemistry

Heterogeneously integrated SiP devices offer considerable benefits, including higher performance, lower power usage, smaller area, lower cost, and faster time to market. However, thus far they are designed and produced by only a few advanced users. Broad industry proliferation will require a standardization of chiplet models and die-to-die connectivity IP — efforts currently underway — supported by new workflows. This 3D InCites article explains five workflows that are essential for planning, implementing, verifying, and co-designing heterogeneous designs. https://sie.ag/ZZZae #Semiconductor #SemiconductorIndustry #AdvancedPackaging

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