Helix IPLM by Perforce’s Post

"Most semiconductor companies are reactionary. They use existing architectures, methodologies, and tools to create solutions to satisfy market demands. They are risk-averse, and that means inventing as little as possible, only changing and extending the parts of an existing design that are necessary to reach their goals. There are examples where semiconductor companies have developed new markets because they anticipated a demand that was not currently in existence. Those are disruptive products, and they don’t happen that often" #semiconductorindustry #eda https://lnkd.in/e8hBrraq

In a recent Semiconductor Engineering article by Brian Bailey, Renxin Xia, VP of Hardware at Untether AI, explores the transformative potential of 3D chip design and memory-on-logic integration. As the tech industry demands ever-more powerful and efficient chips, pioneering approaches like these are set to revolutionize the landscape. Read the full article to hear his thoughts on: ▫ The advantages of vertical integration and the hurdles that must be overcome to realize this groundbreaking technology. ▫ The significance of innovative architectures in unleashing the full potential of memory-on-logic integration.

What is an IP Core in Semiconductor Design? An IP (Intellectual Property) core in semiconductor design is a pre-designed and pre-verified functional block of logic or data used to create a semiconductor chip. It's like a building block that can be reused to create different types of chips, such as FPGAs, ASICs, or SoCs. 🚀 Why are IP cores needed? Speeds up design time: IP cores save time by providing ready-to-use components, eliminating the need to design them from scratch.  Reduces design complexity: IP cores handle complex functionalities, allowing designers to focus on the overall system architecture.  1) Improves design quality: IP cores are rigorously tested and verified, reducing the risk of design errors. 2) Enables faster time-to-market: By using pre-designed IP cores, companies can bring their products to market more quickly. 🚀 Companies that provide IP cores: Many companies specialize in developing and licensing IP cores. Some of the major players in the IP core market include: 1) ARM: Known for its processor cores, ARM licenses its technology to a wide range of companies.  2) Synopsys: Offers a broad range of IP cores, including processor cores, memory controllers, and interface protocols.  3) Cadence Design Systems: Provides a comprehensive portfolio of IP cores, covering various functionalities. For all semiconductor and AI related content, follow TechoVedas ---------- P.S: If you like writings like these, we have compiled 100s of such questions in our book- The semiconductor Saga. Link in comments.

*Business models in Semiconductor Design Industry* In semiconductor design, companies can choose from various business models e.g. fabless model, IDM model, IP core licensing, ASIC design, SoC design, and fabless with foundry partnerships all offer unique advantages and challenges. 1. Fabless Model Description: Fabless semiconductor companies focus on the design and sale of hardware devices and semiconductor chips, while outsourcing the manufacturing (fabrication) to specialized foundries. Examples: Qualcomm, NVIDIA, Broadcom. Advantages: Reduced capital expenditure since there's no need to invest in manufacturing facilities. Allows companies to focus on design innovation and marketing. Flexibility in choosing manufacturing partners with the latest technology. Challenges: Dependence on third-party foundries for production capacity and quality. Potential supply chain disruptions. Managing relationships with multiple foundries can be complex. 2. IP Core Licensing Description: Companies design and license intellectual property (IP) cores, such as processor architectures or specific functional blocks, to other companies for inclusion in their chip designs. Examples: ARM Holdings, Imagination Technologies. Advantages: Recurring revenue through licensing agreements and royalties. Lower risk compared to manufacturing and physical product distribution. Ability to focus on innovation in specific areas of technology. Challenges: Dependence on the success of licensees for revenue. Continuous need for innovation to stay competitive and relevant. Legal and contractual complexities in managing IP rights and agreements. 3. Application-Specific Integrated Circuits (ASIC) Design Description: Companies design custom semiconductor solutions tailored to specific applications for individual clients. Examples: Broadcom (for specific applications), Marvell Technology Group. Advantages: High performance and efficiency for specific applications. Strong differentiation in the market through tailored solutions. Potential for higher margins due to the specialized nature of products. Challenges: High upfront design costs and longer development cycles. Limited market applicability due to the custom nature of products. Greater risk if the specific application market underperforms. 4. System-on-Chip (SoC) Design Description: SoC design companies integrate all components of a computer or other electronic system onto a single chip, including processors, memory, and peripherals. Examples: Apple (with its A-series chips), Qualcomm (Snapdragon series). Advantages: High integration leads to better performance, lower power consumption, and smaller form factors. Strong differentiation and control over the end product. Potential for innovation in integration and optimization. Challenges: High complexity in design and verification. Significant R&D investment required. Dependency on a successful broader ecosystem (software and hardware compatibility).

Embracing chiplets with advanced packaging could lead to advancements in semiconductor technology while the industry works on the development of SoC designs. Exciting times to be in this industry! #semiconductor #chiplets #siliconpackaging Read more: https://lnkd.in/g6rECMTx

I am a big fan of Open Architectures, Open Specifications, Open Standards. Hence we named our ASIC company Open-Silicon :). In other words, allowing collaboration between brilliant minds is the best way to create affordable and meaningful solutions that impact the daily lives of so many. Therefore, I believe, Open chipset ecosystems will allow for wider collaboration across semiconductor design and manufacturing and usher in a new era of innovation that will push Moore’s Law to a new dimension for years to come. Looking toward the future, we may soon see a dynamic where no semiconductor is manufactured in a single place, and instead, the ecosystem is far more globalized than it already is. #Semiconductor #SemiconductorEngineering #ChipletDesign

Rapidus, a leading semiconductor company, has recently announced an expansion of its partnership with IBM to include chiplet packaging for the 2nm devices it plans to manufacture in Japan. This collaboration marks a significant step forward in the development of cutting-edge semiconductor technology. The partnership between Rapidus and IBM involves the construction of the first integrated fab and packaging plant, which will utilize IBM's 2nm process technology. By 2027, Rapidus aims to establish mass production capabilities for chiplet packages using IBM's advanced packaging technology. This initiative is part of a larger effort to enhance Japan's position in the global semiconductor industry. #electricalengineering #electronics #embedded #embeddedsystems #electrical #computerchips Follow us on LinkedIn to get daily news: HardwareBee - Electronic News and Vendor Directory

Semiconductor IP Market  Size, Key Drivers, Growth Factors, Technological Development

"Intel is also announcing something called Quasi Monolithic Multi-Chiplet Interposer, as well as a next-gen fine pitch EMIB. These innovations should increase bandwidth density between chiplets."

Well-designed interconnects are essential to realize the benefits of heterogeneous integration and chiplets. In a recent Semiconductor Engineering article Debendra Das Sharma, UCIe Consortium Chairman, shared “Some folks mistakenly have a view that there should be one interconnect that does it all. That is not correct. I believe the industry has rallied around the right set of interconnects — UCIe for on-package, PCIe and CXL for off-package, as well as rack/pod level, and Ethernet for networking.” Read the article to learn how the importance of interconnects like UCIe in the chiplet ecosystem: https://bit.ly/4cGk2Jt #UCIe #UCIeConsortium #chiplets #interconnects