TrendForce Releases 2023 Top 10 IC Design Companies Ranking, Three Taiwanese Companies Make the List, #Nvidia Takes the Lead for the First Time, and Surges Ahead by a Significant Margin. In 2023, the combined revenue of the world's top ten IC design companies reached approximately $167.6 billion, marking a 12% annual growth. This significant increase was primarily driven by Nvidia's outstanding performance, with a remarkable 105% revenue surge that significantly boosted the overall industry. The Taiwanese companies on the list include: #MediaTek, #Novatek, and #Realtek. Source: [TrendForce Press Release](https://lnkd.in/g5Ay9-gw)
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#Nvidia GTC is on! If you watched the keynote, you'd not miss a huge shoutout to #Dell and all the great collaboration that we are doing between two companies ( link below). To quote New Yorker's piece , "The chosen chip", masterful metaphoric saying: "There is an AI war and Nvidia is the only arms dealer". Bold, Powerful, Revolutionary. As GTC takes place around the same time every year, this pic came up on my time-line circa 2015 taken in front of #Dell booth. if only phone cameras were better 10 years ago, #Dell logo would've been more clear ;) https://lnkd.in/gBekFBnt #iwork4dell
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It is useful to take a deeper dive to understand the dynamics of the semiconductor industry. Semiconductor companies have three distinct business models for supplying devices to the market. Each model has its advantages depending on the product and the timing of the semiconductor cycle. During the last year, the fabless companies demonstrated strong growth almost exclusively due to Nvidia. Without Nvidia, the growth was in the low single digits. The increase in memory pricing lifted IDMs, and it was a challenging year for mixed-model companies. #Nvidia #Semiconductor https://lnkd.in/dA7CxJMD
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HP held their partner event, #HPAmplify, last week and our colleagues from Six Five Media were there to see how the company is advancing PCs and printers, aligning with the connective tissue of AI to enhance hybrid work. Their coverage highlighted collaboration with Microsoft, Google, NVIDIA, AMD, Qualcomm, and Intel Corporation, and how HP is positioned to compete in the evolving market. Of course there was also a lot of talk about the approaching #AIPC wave, though we anticipate fierce competition in that market with Apple as a dark horse. What's your take on the HP client compute message? This and more on the #Rundown
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ISO9001 certificated Distributor of electronic components 11+ years, focus on #TI #MICRON #Microchip #NXP #STM, #Aanlog Devices, and electronic manufacturing's shortage & hard find part service.
Chiplet Makers Expect to Disrupt Incumbents Executives at chip startups Tenstorrent and Alphawave foresee a day when their firms’ sales of chiplets and IP erodes the business of incumbent chip vendors like Qualcomm. An SoC customer must buy graphics, image signal processing, media, application processing, Arm cores, a modem and security all in one chip, Tenstorrent COO Keith Witek told to media, noting that chiplets allow more choices. “With chiplets, you can say, ‘I don’t want to get $130 of my solution from Qualcomm.’ In fact, somebody might say, ‘I only think their modem is good. The rest of the stuff I can get from a different chip’.” Witek emphasized that he gave Qualcomm as an example only. Designers Alphawave and Tenstorrent expect chiplets to sell like commodities in a marketplace. That remains only an expectation. So how would the Chip market developing in future ? Expecting 2024. #Chiplets #IP #Tenstorrent #Alphawave #Qualcomm #ChipMarket #CustomizedSolutions #Marketplace.
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(ISO9001,DUNS certificated) Leading Top 20 Gold Distributor Electric components 12 years #NXP #ST #ON #TI #ADI #ALTERA #XILINX #Cypress #Microchip #ST,PCB Solution;Shortage and hard find part ect.
Chiplet Makers Expect to Disrupt Incumbents Executives at chip startups Tenstorrent and Alphawave foresee a day when their firms’ sales of chiplets and IP erodes the business of incumbent chip vendors like Qualcomm. An SoC customer must buy graphics, image signal processing, media, application processing, Arm cores, a modem and security all in one chip, Tenstorrent COO Keith Witek told to media, noting that chiplets allow more choices. “With chiplets, you can say, ‘I don’t want to get $130 of my solution from Qualcomm.’ In fact, somebody might say, ‘I only think their modem is good. The rest of the stuff I can get from a different chip’.” Witek emphasized that he gave Qualcomm as an example only. Designers Alphawave and Tenstorrent expect chiplets to sell like commodities in a marketplace. That remains only an expectation. So how would the Chip market developing in future ? Expecting 2024. #Chiplets #IP #Tenstorrent #Alphawave #Qualcomm #ChipMarket #CustomizedSolutions #Marketplace. #chips #electronicsmanufacturing #electroniccomponents #electric #pcbassembly
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Intel Foundry has made significant strides over the past year as we continue to deliver on our goal of building a world-class systems foundry. Our ecosystem partners are critical to the success of Intel Foundry, so we’re continuing to work closely with all the key EDA and IP partners to enable customers to leverage our groundbreaking technology as they realize their AI ambitions. As part of these efforts, we just hit a new milestone with Ansys, Cadence Design Systems, Siemens, and Synopsys Inc announcing the availability of reference flows for Intel’s embedded multi-die interconnect bridge (EMIB) advanced packaging technology. EMIB technology is a key part of Intel Foundry’s approach to extending Moore’s Law, allowing us to cost-effectively scale to a larger silicon area by connecting multiple die in a single package. This news follows the momentum we announced at Direct Connect, with our ecosystem partners declaring readiness for Intel 18A designs. If you’re attending DAC 2024 this week in San Francisco, make sure to check out the Intel Foundry booth #2337 on the 2nd floor to see demos from four of our ecosystem partners. Learn more about how we’re building out Intel Foundry’s ecosystem: https://intel.ly/4cBl9cs
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When do you expect to reach parity in terms of yields. Ireland is reporting Intel 4 and 3 aren't ready for primetime. TSMC is at an average weekly ISO of 670. For a 12mm x 12mm die this translates to 120% more good die on 3nm. The process isn't well characterized and the TSMC folks say your at a local maximum They've comprehensively examined the response surface and feel they are near a global maximum and have better control of the E-test parameter and each layers critical dimensions have 6 sigma control. We reckon that you're at 4.2 for the 3nm, and haven't optimized the target CD's especially on the critical gate layer and ultra fine pitch metal layers. Also registration between layers with stacked tolerance is a big limiting factor to better CD's. What's the recovery plan to get economicallly viable utilization and yields. With equipment utilization at sub 50% and yields less than 45% your true over all productivity is less than 25%. TSMC has 90% utilization and approximately 85% yields they are realizing roughly 80% productivity in their 3nm factories. Our models show Foundry losses growing 12% Moreover your transistor density on 3nm is 25 to 30% lower and consumes 2.2x the power/transistor.
Intel Foundry has made significant strides over the past year as we continue to deliver on our goal of building a world-class systems foundry. Our ecosystem partners are critical to the success of Intel Foundry, so we’re continuing to work closely with all the key EDA and IP partners to enable customers to leverage our groundbreaking technology as they realize their AI ambitions. As part of these efforts, we just hit a new milestone with Ansys, Cadence Design Systems, Siemens, and Synopsys Inc announcing the availability of reference flows for Intel’s embedded multi-die interconnect bridge (EMIB) advanced packaging technology. EMIB technology is a key part of Intel Foundry’s approach to extending Moore’s Law, allowing us to cost-effectively scale to a larger silicon area by connecting multiple die in a single package. This news follows the momentum we announced at Direct Connect, with our ecosystem partners declaring readiness for Intel 18A designs. If you’re attending DAC 2024 this week in San Francisco, make sure to check out the Intel Foundry booth #2337 on the 2nd floor to see demos from four of our ecosystem partners. Learn more about how we’re building out Intel Foundry’s ecosystem: https://intel.ly/4cBl9cs
Building Intel’s Foundry Ecosystem for the AI Era
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Visual media is getting redefined In Delhi, Nvidia demonstrated the cost-reducing potential of their GPUs for photo & video editing. Advancements in semiconductor technology are rapidly reshaping visual media. India should give a bigger push to the semiconductor industry to accept disruptive technologies. #VisualMedia #Nvidia #SemiconductorTechnology #PhotoEditing #VideoEditing #Innovation #DisruptiveTech #IndiaTech #DigitalTransformation #FutureOfMedia #CostReduction
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CEO at The Futurum Group. Chief Analyst at Futurum Research. Co-Host of The Six Five Podcast and The Six Five Summit. Co-founder of Signal65.
EP205 Weekly Podcast: We are Live! Join us now... Talking 1. Lenovo Q3 FY2024 Earnings 2. $SNPS Q1 FY2024 Earnings 3. NVIDIA Q4 FY2024 Earnings 4. What to Expect at MWC 2024 5. Intel Corporation Foundry Direct Connect Event 6. Third Generation Arm Neoverse $NVDA $INTC $ARM #NVIDIA #Intel #mwc24
EP205: We are Live! Talking Lenovo Q3 FY2024 Earnings, Synopsys Q1 FY2024 Earnings, NVIDIA Q4 FY2024 Earnings, What to Expect at MWC 2024, Intel Foundry Direct Connect Event, Third Generation Arm Neoverse
EP205: We are Live! Talking Lenovo, Synopsys, NVIDIA, MWC 2024, Intel, Arm
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🔉 A shoutout to our very own #FPGAexpert and principal engineer Vikrant Kapila, who will be sharing insights and tips on how to speed time-to-market by integrating custom chipsets when developing for both cloud and edge in his upcoming presentation: ‘Data-Driven Design for Adaptive Multi-Die Systems’. Well worth connecting with Vikrant if you’re in the area and attending #SNUGSiliconValley!
🚀 Excited to share that I'll be presenting a talk on 'Data-Driven Design for Adaptive Multi-Die Systems' at SNUG Silicon Valley on March 20, 2024, at the Santa Clara Convention Center, California! 🌐 Join me as I explore how Agilex® System-on-Chips seamlessly integrate diverse chiplets, pre-optimized hardware blocks, and flexible reconfigurable fabrics. Discover the potential to integrate custom chiplets, expediting solution development for both cloud and edge platforms, all while mitigating risks and accelerating time-to-market. In this technical discussion, we'll dive into the intricacies of crafting adaptive Multi-Die Systems, navigating architectural challenges, and embracing a data-driven approach for early exploration of the design space. 🛠️ I'm eager to connect with fellow enthusiasts and engage in insightful discussions. Looking forward to an enriching experience! 🌐🤝 #SNUGSiliconValley #AcceleratingInnovators #WeAreAltera #AgilexSoCs #MultiDieSystems #DataDrivenDesign #TechTalk #Innovation #Networking #altera Altera #iamintel #fpga #fpgadesign #chiplets #innovation Intel Corporation
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