Micron Technology’s Post

Ever felt the pressure to market a product before it’s ready? You’re not alone. Check out my new blog post where I discuss the pitfalls of ‘Marketing Ahead of the Duck’ and how our Storage Business Unit at Micron avoids them. https://bit.ly/4cvyRxZ #TechMarketing #MicronInsights

Finally, Micron commences production of HBM3E. In the future, W2W bonding would replace current D2W approach by either reconstituted technology or multi-stacked W2W hybrid bonding depending upon wafer yield and challenge of D2W.

SK Hynix announces 321-layer NAND Flash samples! 😍 SK Hynix has unveiled 321-layer 4D NAND Flash samples, making it the first company to achieve NAND Flash stacking beyond 300 layers. The company is currently refining the technology and aims for mass production by the first half of 2025. The new 321-layer 1Tb TLC 4D NAND Flash from SK Hynix demonstrates a 59% performance boost compared to the previous 238-layer 512Gb 4D NAND Flash. This advancement is attributed to improved memory cell stacking, resulting in larger storage capacity and higher production efficiency.

SK Hynix announces 321-layer NAND Flash samples! 😍 SK Hynix has unveiled 321-layer 4D NAND Flash samples, making it the first company to achieve NAND Flash stacking beyond 300 layers. The company is currently refining the technology and aims for mass production by the first half of 2025. The new 321-layer 1Tb TLC 4D NAND Flash from SK Hynix demonstrates a 59% performance boost compared to the previous 238-layer 512Gb 4D NAND Flash. This advancement is attributed to improved memory cell stacking, resulting in larger storage capacity and higher production efficiency.

Semiconductors’ shelf life is the length of time they can be stored without degrading. The shelf life depends on a number of factors, including the type of component, the storage conditions and the manufacturer. Take a read of our guide to semiconductor components shelf lives: https://ow.ly/25vb50Pmt8y

Storage devices, volatile and non volatile memory, fram memory chips

Are you overthinking date codes? Follow this link to learn why general date code restrictions for semiconductor components are becoming obsolete...we have the data!

Details of SK hynix 321-L NAND is available within TechInsights TechStream blog. Not a client? Check out this post (https://lnkd.in/e8zDj7vf) for a glimpse of the exclusive TechInsights content.

SK hynix had revealed more information on their 321-Layer 4D NAND during FMS2023. What more can we find out on the first 3xx-Layer 3D NAND? More information available in my recent TechStream blog. https://lnkd.in/eRRPvA-f

Random Access Memory, Fram chip, what is ferroelectric ram, F-RAM Memory