Panacol-Elosol GmbH’s Post

Panacol presents its first series of new, UV curable, black epoxy resin adhesives. The black color in a conventional UV adhesive absorbs a high percentage of the UV curing energy. This means that the UV light energy required to fully polymerize an adhesive only penetrates a few micrometers. This phenomenon leads to the formation of a superficial “skin”, while the adhesive underneath remains uncured.  Panacol's newly invented “Black&Light” adhesives, Vitralit® BL UC 1101, Vitralit® BL UC 1102 and Vitralit® BL UC 1103, can be cured in thicker layers using only UV light, eliminating the need for a secondary curing mechanism. Vitralit® BL UC 1101, Vitralit® BL UC 1102, and Vitralit® BL UC 1103 are Panacol’s new Black&Light adhesives and they cover a wide range of applications. They are suitable for component encapsulation, glob top, or edge bonding in electronics production. They can also be used as optical adhesives in applications requiring high OD (optical density) values. Benefits: 💡 100 % light curable 🌓 High optical density 🔗 High adhesion, low shrinkage 🥛 High glass transition temperature ⚙ Single component, easy to handle 🌡 Storage and shipping at room temperature Read more at: https://lnkd.in/e5giDRgj #electronicsmanufacturing #adhesivetechnology #uvcuring

How Delnet™ apertured films level up your filtration efficiency Our Delnet™ apertured films are a lightweight, nonwoven material generated through a unique extrusion, embossing, and orientation process. Delnet™ supports a variety of air and liquid filtration applications, including microelectronics, owing to its consistency and cleanliness. They strongly contribute to an improved filter efficiency by providing support and separation for delicate media while offering controlled porosity that promotes even, turbulent flow in tight pleat packs. GESSNER’s Delnet™ is a geometric apertured films composed of Polypropylene, Polyethylene, TPX, ECTFE, and co-extrusions. These films feature a mesh-like structure, crafted from a distinctive extrusion, embossing, and orientation process. We can create endless configurations by adjusting the process parameters to suit our customers' specifications. It is often utilized as an economical bonding layer in the laminating process, typically used to bond dissimilar materials together using A/B or A/B/A layers with varying processing windows. Delnet™ serves multiple purposes, including a dust release layer on a reusable filter, a pleat support layer for pleated filters, and a pleat/drainage layer on liquid filters. As we are able to customize all kind of product characteristics GESSNER can meet all kind of your application and market requirements. Get in touch with us and find out more about our Delnet™ filtration solutions https://lnkd.in/eU8TGCfv. #GESSNER #Delnet™ #aperturedfilms #filtration

We're excited to share our bonding test for PC materials using the LOCTITE® AA 3921 adhesive and LOCTITE® CL40 LED Spot Curing Quad Controller. The LOCTITE® CL40 LED Spot Curing Quad Controller is designed for UV and visible light curing adhesives, supporting up to four LED heads for multiple cure areas. Ideal for both manual workstations and automated production lines, it offers continuous or programmed light output modes. User-friendly with a foot switch, AC power cord, and PLC connection, it’s also environmentally friendly with low power consumption and no need for light guides or lamp replacements. LOCTITE® AA 3921 is the perfect solution for bonding stress-sensitive plastics, metals, glass, and ceramics. This medical-grade, acrylic-based adhesive offers rapid curing with a fixture time of just 3 seconds and a depth of cure over 13 mm. ISO 10993 qualified for medical device applications, it ensures biocompatibility. With low viscosity, low blooming, and no bubble formation, it delivers reliable, flexible bonds every time. #LOCTITE #Adhesive #UVLED #LightCuring #CuringTechnology #Medical #Biocompatibility #MaterialTesting #LowBlooming #NoBubble #ISO10993 #LotiteAA3921 #LoctiteCL40 #SpotCuringQuadController

Alternative UV-Curing Adhesives A new generation of UV-curing silicones and epoxies are increasingly being used in automotive and electronics applications. Every action in life involves a trade-off: The gaining of one benefit at the expense of another, to best meet the needs of the situation at hand. When the situation involves high-volume bonding and sealing, manufacturers rely on UV-cure adhesives because they allow on-demand and quick curing (1 to 5 seconds after light exposure). The trade-off, however, is that these adhesives (acrylic, silicone and epoxy) require a transparent substrate to properly bond, and they cost significantly more than adhesives that cure by other means. Nevertheless, countless manufacturers in many industries have happily made this trade-off for several decades. Many more companies will do so for the foreseeable future. The difference, however, is that engineers will be as likely to use a silicone or epoxy UV-cure adhesive, as one that’s acrylic-based. UV-cure epoxy adhesives are also frequently used for automotive and consumer electronics applications. One reason is that these adhesives, like silicones, are specifically formulated to match the wavelength of LED light sources (320 to 550 nanometers), so manufacturers get all of the benefits of LED lighting, such as long life, limited heat and flexible configurations. Another reason is the lower capital costs of UV curing, thereby making it easier for companies to trade up to this technology. #uvcuring #UVadhensive #epoxy

HDPE (high-density polyethylene) is chosen for its strong intermolecular forces and high tensile strength, making it ideal for products like medical containers, milk jugs, and water pipes. Marking HDPE is challenging due to its surface texture and the need for permanent, tamperproof labels. Traditional labels and inks are not durable, and IR laser marking often results in a low contrast melt of the material. However, our DPSS 355 nm UV lasers use a "Cold Marking" process to create permanent marks without thermal damage. Because many plastics are extremely sensitive to UV wavelengths, marking speeds of 3 to 5 meters per second are achievable with UV powers as low as a few hundred mW. Contact your Local Technical Sales Engineer to schedule an onsite demo > https://hubs.li/Q02B8TZ30 #lasermarking #lasermarkingsystem #HDPEbottles #HDPE #pharmaceuticalindustry #medicalmanufacturing #UVlasers #DPSSLasers Nicholas Kaczmarski Alex Laymon Matthew Kaczmarski Gabrielle Molina

What will be the cost of this UV silicone base material?

What do PC, PS, PEEK and PE have in common? 🧐 Right, they are all #thermoplastics that can be joined or separated using ultrasound. Thermoplastics are divided into two categories: semi-crystalline thermoplastics such as POM, CA, LCP, PEEK, PA, PBT, PE, PPS, PP, PTFE and then there is the amorphous group with ABS, MABS, PMMA, PC, PET, PS or PVC, for example. The same materials can be welded together perfectly. But what if we want to combine different materials? 🤔 Some combinations are made for each other, and others, well, they'd better stay friends. 😅 Not only plastics but also nonwovens, technical textiles and even food can be processed with all-rounder ultrasonics. The advantages? Ultrasound ensures clean cut edges without a lot of cleaning effort. Click here for the compatibility table: https://lnkd.in/erbgz94k Curious for more? Then discover our ultrasonic knowledge page here 👇 https://lnkd.in/ecmytr7k #RINCO #explains #materials #join #cut #ultrasonicwelding

Led UV Curing Production Line for Offset Print, Silkscree Print, Adhesive Glue / Inks/Coatings quicklly Dry. The Basics and Benefits of LED-UV Curing from Youwei LED UV: 1.Inks cure instantly, no need for drying time or powder 2.Expanded substrate offerings to include plastics and other materials that don't absorb inks 3.Heat-sensitive substrates can be printed on safely, with quality results 4.LED-UV lamps last significantly longer (10x) than traditional UV lamps, saving time and money . 5.Heat, ozone and mercury are eliminated from press rooms, improving overall environmental impact. 6.UV inks are free of solvents, free VOCs (volatile organic compounds) and avoids the environmental issues caused by them 7.The energy costs and heat-related hazards of heatset drying bypassed 8.Value-added coatings can be used efficiently and effectively 9.High-end printing effects, like drip-off . SZ YOUWEI PRTG MATERIALS EQP Should you have any questions or need further assistance, please don't hesitate to reach out. We're here to help! WhatsApp NO. 008617875467687 mary@leduvsolution.com curitiscui@gmail.com #UVLEDCuring #UVCuringSystem #LEDUVSystem #LEDUVCuirngDevices #UVSolutions #UVPrinting  #PrintingInnovation #UVLEDCuring #leduvlamp #ScreenPrinting #PackagingSolutions #EcoFriendly #printingpress #HighQuality #chinafactory #PrintingTechnology #PrintIndustry #AdvancedPrinting #PrintingSolutions #Packagingindustry #GraphicArts #IndustrialPrinting #PrintQuality #Quality #SustainablePrinting #flexolabel #PrintRevolution #inkjetprinting #NextGenPrinting

Select screen module adhesive, first look at AVENTK screen module UV adhesive application guide. Screen module bonding fixation is one of the important application of UV adhesives. Because of its production of high-precision, automated features, it also has more stringent requirements for the UV adhesive. At present, there are many manufacturers of screen module UV adhesives on the market, but few of them can really meet the requirements of screen manufacturers for all aspects of UV adhesives. Therefore, how to choose a good screen module UV adhesives, has also become a difficult problem that screen manufacturers face. 1. LCD edge sealing adhesive: AVENTK 4028 UV adhesive can be used for LCD edge sealing, and this UV adhesive has high viscosity, acid and alkali resistant characteristics. Therefore, it has excellent performance in LCD edge sealing applications. 2. Module bezel fixing adhesive: For this application, AVENTK recommends 4008 UV adhesive, which has high viscosity and good adhesion to both metal and glass, and is suitable for module bezel fixing applications. 3. screen ITO protection adhesive: in communication with customers, AVENTK found that many UV adhesive manufacturers in this application have encountered problems, it is difficult to develop a product that makes customers very satisfied. AVENTK technology and R & D personnel after careful communication with customers, continuous adjustment and optimization of the adhesive formula, finally provide customers with 1058 UV adhesive that is repairable and can be peeled. This UV adhesive can be quickly cured into adhesive film after UV light irradiation, and can be easily peeled off and removed after finishing the protection. 4. screen L / B bonding: At present, in this application, what customers praise most is AVENTK 9039 model adhesive. #UVadhesive #UVscreenadhesive #LCD #ITO #screen

How to choose low-temperature curing epoxy adhesive for chip mounting? The chip mounting process refers to the chip adhesive and metal solder are used to bond the chip to the substrate, playing the role of thermal, electrical and mechanical connection. In the mounting process, the quality of the adhesive will directly affect the mounting effect, so how to choose the appropriate chip mounting adhesive, becomes the customer's attention. In chip laminating applications, adhesives are not only required to meet the bonding requirements, but also need to have heat resistance and good dispensing characteristics to meet the increasing demand for miniaturization. AVENTK's low temperature curing epoxy adhesive is characterized by its high strength after aging and higher dispensing accuracy compared to other similar products. These characteristics have been demonstrated in several AVENTK trials and customer applications. Another advantage of AVENTK's low-temperature curing epoxy adhesive is that its thixotropic index reaches ~ 9 (test data). The higher the thixotropic index value, the better the rheological resistance after the dispensing process. The thixotropy of AVENTK's low-temperature cured epoxy ensures that the glue can be accurately applied at low viscosity under the action of the stress generated by the dispensing valve. At the end of the dispensing process, the consistency rises again within a fraction of a second, preventing the glue from flowing, which allows the chip mount adhesive to form individual drops that can then be molded in a controlled manner. At the same time, the glue doesn't flow into areas where it shouldn't be. Even during the heat curing process, the shape of the drops remains extremely stable. AVENTK low temperature curing epoxy glue flow design, can be used to spray valve and dispensing needle dispensing. The glue has high flexibility and a wide range of uses. It shows excellent dispensing performance in the chip mounting application. With the dispensing system and UVLED curing machine, it can obtain fast and high quality bonding effect and adapt to the automatic production process. #UVadhesive #Chip #epoxyadhesive #lowtemperaturecuring