PHIX Photonics Assembly’s Post

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To further support the volume scale-up of our customers, PHIX recently took delivery of an ASMPT AMICRA Nano die bonder. This machine is capable of wafer-level or panel-level die bonding with dicing tape pickup and inline placement accuracy inspection. It was specially modified with a custom imaging system to achieve a world leading bonding accuracy of 200 nanometers at 3 sigma. Another customization enables laser welding at greater speeds and with a more localized application of heat. We're excited with this further upgrade of our integrated #photonics and #MEMS volume packaging capabilities! ➤ Discover our #contractmanufacturing offering: https://lnkd.in/dYnwAnz #siliconphotonics #chipindustry #diebonding

PHIX Photonics Assembly Thanks a lot for this post and the wonderful video showing that your AMICRA NANO system has arrived safely at your place!

Carlos Lee EPIC

EPIC Members Drive the Photonics Revolution!

1mo

I love seeing 2 members of EPIC collaborating, wishing you both much success 👍👍PHIX Photonics Assembly & ASMPT AMICRA

Susanne Oswald

Topics: #SMT, #Semiconductor, #theElectronicsmarket, #digitaltransformation, #ESG, #diversity

1mo

Really nice video :-)

Jose Pozo

Chief Technology Officer at Optica

2mo

Congrats. Looks amazing!

The customized laser heating sounds familiar to me 😉.

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