To further support the volume scale-up of our customers, PHIX recently took delivery of an ASMPT AMICRA Nano die bonder. This machine is capable of wafer-level or panel-level die bonding with dicing tape pickup and inline placement accuracy inspection. It was specially modified with a custom imaging system to achieve a world leading bonding accuracy of 200 nanometers at 3 sigma. Another customization enables laser welding at greater speeds and with a more localized application of heat. We're excited with this further upgrade of our integrated #photonics and #MEMS volume packaging capabilities! ➤ Discover our #contractmanufacturing offering: https://lnkd.in/dYnwAnz #siliconphotonics #chipindustry #diebonding
I love seeing 2 members of EPIC collaborating, wishing you both much success 👍👍PHIX Photonics Assembly & ASMPT AMICRA
Really nice video :-)
Congrats. Looks amazing!
The customized laser heating sounds familiar to me 😉.
PHIX Photonics Assembly Thanks a lot for this post and the wonderful video showing that your AMICRA NANO system has arrived safely at your place!