I consider myself fortunate to have experienced multiple waves of semiconductor cycles since entering the industry 30 years ago. Over the years, I've witnessed the evolution of technology, from pagers and voicemail to handphones, the internet, smartphones, and now AI. It's incredible to see how AI is enabling us to live more efficiently, speeding up our work and contributing to a greener world. This progress is made possible by technologies like HBM, which connects to GPUs and CPUs through advanced packaging. At Lam Research we take pride in being a key enabler of this remarkable innovation. I encourage you to read the attached article shared by Chee Ping Lee which highlights the success of advanced packaging technology that underpins AI advancements.
#Ai
#HBM
#advancepackaging
As artificial intelligence (AI) advances, the demands for data-intensive applications and machine learning increases. This necessitates key technologies like high-bandwidth memory (HBM), designed to optimise AI performance and curb power drain of memory chips.
In the latest issue of Singapore Semiconductor Industry Association (SSIA)’s VOICE Magazine, Chee Ping Lee, Senior Director, Advanced Packaging Customer Operations at Lam, highlighted the critical role of HBM in innovating semiconductor design for next-generation chips - unlocking the full potential of AI.
Read the full article here: https://lnkd.in/gwxTJqew
#LamResearch #Semiconductor #AdvancedPackaging #AI #MemoryChip
it is very impressive, well done